A capacitive microelectromechanical device is provided. The capacitive microelectromechanical device includes a semiconductor substrate, a support structure, an electrode element, a spring element, and a seismic mass. The support structure, for example, a pole, suspension or a post, is fixedly connected to the semiconductor substrate, which may comprise silicon. The electrode element is fixedly connected to the support structure. Moreover, the seismic mass is connected over the spring element to the support structure so that the seismic mass is displaceable, deflectable or movable with respect to the electrode element. Moreover, the seismic mass and the electrode element form a capacitor having a capacitance which depends on a displacement between the seismic mass and the electrode element.

A method for detecting hardened bunkers within a target, the method including: producing a first output from a sensor fired to travel through the hardened bunkers, the first output being different from a second output when the sensor travels in a void between the hardened bunkers or encounters other objects outside of the hardened bunkers; and determining one or more of the number of hardened bunkers, a thickness of the hardened bunkers and a strength of the hardened bunkers based on the first and second outputs of the sensor over time. The sensor can include one of a piezoelectric generator for producing a voltage output and a circuit input by the voltage output or an accelerometer having a locking member for locking a proof mass during periods of impact with the one or more hardened bunkers.

A micromechanical spring for a sensor element, including at least two spring sections formed along a sensing axis, the at least two spring sections each having a defined length, and the at least two spring sections having different defined widths.

The invention relates to a device for detecting acceleration. The device contains: a frame; a mass; a lever arm connected to the mass, wherein the mass is provided at a first lever position; an optical fiber having a fiber-optic sensor; and a compensation element for disturbance variables, wherein the compensation element for disturbance variables is connected to the lever arm or the mass and wherein the compensation element for disturbance variables is connected to the frame.

A flexure for a MEMS device includes an elongated beam and a protrusion element extending outwardly from a sidewall of the elongated beam. A MEMS inertial sensor includes a movable element spaced apart from a surface of a substrate, an anchor attached to the substrate, and a spring system. The spring system includes first and second beams, a center flexure between the first and second beams, a first end flexure interconnected between an end of the first beam and the anchor, and a second end flexure interconnected between an end of the second beam and the movable element. Each of the end flexures includes the elongated beam having first and second ends, and the sidewall defining a longitudinal dimension of the elongated beam, and the protrusion element extending from the sidewall of the elongated beam, the protrusion element being displaced away from the first and second ends of the beam.

A capacitive microelectromechanical device is provided. The capacitive microelectromechanical device includes a semiconductor substrate, a support structure, an electrode element, a spring element, and a seismic mass. The support structure, for example, a pole, suspension or a post, is fixedly connected to the semiconductor substrate, which may comprise silicon. The electrode element is fixedly connected to the support structure. Moreover, the seismic mass is connected over the spring element to the support structure so that the seismic mass is displaceable, deflectable or movable with respect to the electrode element. Moreover, the seismic mass and the electrode element form a capacitor having a capacitance which depends on a displacement between the seismic mass and the electrode element.

A physical quantity detector according to the invention includes a substrate section including a base section, a movable part connected to the base section, a support section extending from the base section, an extending part extending from the support section, and a physical quantity detection element fixed to the base section and the movable part, and a weight fixed to the movable part, and the extending part and the weight overlap each other in a planar view from the thickness direction of the extending part.

A pulse-width modulation control circuit includes a first transistor and a signal generator. The first transistor includes a first terminal coupled to a power source and a second terminal coupled to a first input of a controlled component. The signal generator includes a first node coupled to a gate of the first transistor. The signal generator is configured to receive a comparison value and a comparison criterion and to compare the comparison value to a counter value based on the comparison criterion. In response to the comparison value satisfying the comparison criterion with respect to the counter value, the signal generator is configured to send a control signal to the gate of the first transistor to generate a pulse edge of a pulse of a pulse-width modulated signal.

A resonant sensor device includes a base and a detection substrate. The detection substrate includes a movable portion configured to move in a first direction, a supporter includes one or more supporting portions which extend in a direction along an intersecting plane intersecting the first direction, an intermediate fixing portion which is connected to the movable portion via the supporter, a connection portion which connects a mounting portion fixed to the base to the intermediate fixing portion in a second direction that is one direction along the intersecting plane, and a resonator at least partially embedded in the one or more supporting portions. The maximum dimension of the connection portion in a third direction orthogonal to the second direction in the intersecting plane is smaller than a maximum dimension of the supporter in the third direction.

An inertial sensor includes a substrate, a movable element having an edge, and a suspension system retaining the movable element in spaced apart relationship above a surface of the substrate. The suspension system includes an anchor attached to the surface of the substrate, the anchor having a first side laterally spaced apart from the edge of the movable element, and a spring structure having a first attach point coupled to the first side of the anchor and a second attach point coupled to the edge of the movable element. The spring structure includes beam sections serially adjoining one another, the beam sections extending from the first side of the anchor and surrounding the anchor to couple to the edge of the movable element. The spring structure makes no more than one coil around the anchor to position the first attach point in proximity to the second attach point.