Electronic device characterization platforms, systems, devices, and methods for use in testing instruments, devices, and sensors that is portable, modular, multiplexed, and automated are disclosed. The system includes a substrate, a chip adapter, such as a chip socket, and an optional housing. Chip samples to be tested can be disposed in the chip adapter and various environmental modules designed to supply different environmental conditions to the chip sample can be disposed over the chip adapter, enabling testing of the chip samples to be performed in the different environment conditions. The system can further include various connectors that allow for add-on modules to be included as part of the system. Methods of characterizing electronic devices and sensors are also disclosed.

The present invention relates to a BGA socket apparatus which is a lidless-type from which a cover, generally provided on the top part of a socket body in order for the loading/unloading operation of an IC, is removed, the BGA socket apparatus enabling the elimination of elements which may obstruct air flow during testing.

An electronic component handling apparatus for handling a DUT and pressing the DUT against a socket electrically connected to a tester, including: a temperature adjuster adjusting a temperature of the DUT; a first calculator calculating the temperature of the DUT on the basis of a detection result of a temperature detection circuit disposed in the DUT; a temperature controller controlling the temperature adjuster; and a first controller outputting a first signal to the temperature controller. A temperature control includes a first temperature control based on the temperature of the DUT calculated by the first calculator and a second temperature control, and when the first signal is input from the first controller to the temperature controller after the temperature controller starts the first temperature control, the temperature controller switches the temperature control from the first temperature control to the second temperature control.

An electrical contactor capable of coping with an electrical test under a high temperature environment and realizing reliable positioning is provided. An electrical contactor includes: a planar body portion formed of a conductive member; an upper arm having a cantilever beam structure, including an upper base extending integrally and continuously upward from the body portion, an upper supporting portion extending in a horizontal direction from the upper base along the body portion, and a first distal end extending vertically upward from the upper supporting portion to make electrical contact with a first contact target; a lower arm having a cantilever beam structure, including a lower base extending integrally and continuously downward from the body portion, a lower supporting portion extending in a horizontal direction from the lower base along the body portion, and a second distal end extending vertically downward from the lower supporting portion to make electrical contact with a second contact target; a first positioning portion extending upward from one end of the body portion; and a second positioning portion extending upward from near the other end of the body portion.

The present invention relates to a multistory electronic device testing apparatus, which mainly comprises a feeding and binning device, a multi-axis transfer device, a chip-testing device and a main controller. The feeding and binning device includes an upper module and a lower module. The chip-testing device includes a plurality of testing units arranged vertically. The main controller not only controls the feeding, binning and testing operations, but also controls the multi-axis transfer device to transfer an electronic device to be tested or a tested electronic device between the feeding and binning device and the chip-testing device. Accordingly, the three-dimensional arrangement of the feeding and binning module and the testing device is realized, and the accommodating capacity and the testing capacity for the electronic devices to be tested and the tested electronic devices can be increased.

A chuck unit includes a chuck on which a semiconductor is mounted, a heating part including a heater and configured to heat the chuck, a cooling block configured to cool the heating part by using fluid-cooling, and a Peltier module configured to cool the cooling block. The heater is configured to be energized while the cooling block and the Peltier module are spaced apart from each other, and the heater is configured to be cut off from energization while the cooling block and the Peltier module contact each other.

This socket is provided with: an accommodating section having a recess capable of accommodating an electronic component; an opening/closing section for opening/closing an opening of the recess and pressing the electronic component in the recess in a direction of pressing when the opening is in a closed position; and a support section for supporting the opening/closing section so as to be able to move between an open position and the closed position. The support section supports the opening/closing section, in a closing operation of the opening/closing section, so that the opening/closing section moves while changing the angle formed with the direction of pressing as the opening/closing section moves from the open position to a predetermined position ahead of the closed position, and so that the opening/closing section moves along the direction of pressing when the opening/closing section moves from the predetermined position to the closed position.

An electronic component handling apparatus that handles a pressed body including a DUT or a carrier accommodating the DUT, includes: a pressing device that electrically connects the DUT to a socket by pressing the pressed body toward the socket, and includes: a contact plate that contacts the pressed body; and a retainer that holds the contact plate, the contact plate being separated from the retainer while the contact plate contacts the pressed body, and the contact plate being held by the retainer while the contact plate is separated from the pressed body.

A method and apparatus for conducting burn-in testing of semiconductors is provided. A semiconductor device under test (DUT) with a plurality of contact pads is placed into a seal carrier. The seal carrier is then placed within a plurality of first inner walls of an outer housing of a burn-in testing apparatus that is fastened to a cold plate through a printed circuit board (PCB). The seal carrier has a plurality of second inner walls that define a recessed cavity. A lid is placed over the seal carrier and fastened to the outer housing to seal the recessed cavity. The recessed cavity is pneumatically pressurized to force the contact pads of the semiconductor DUT into electrical contact with a plurality of resiliently compressible pins of a socket of the PCB. The socket is then energized to conduct a burn-in test of the semiconductor DUT.

An example test system includes test sites comprising test sockets for testing devices under test (DUTs) and pickers for picking DUTs from the test sockets or placing the DUTs into the test sockets. Each picker may include a picker head for holding a DUT. The test system also includes a gantry on which the pickers are mounted. The gantry may be configured to move the pickers relative to the test sites to position the pickers for picking the DUTs from the test sockets or placing the DUTs into the test sockets. The test sockets are arranged in at least one array that is accessible to the pickers on the gantry.