A contact terminal includes a tubular body and a first conductor. The tubular body has an end-side cutout provided in a shape cut out from one axial-direction end surface toward an other axial-direction side at one axial-direction end portion of the tubular body, a hole that is open at the one axial-direction end portion, and a pair of arms interposed between the end-side cutout and the hole. The first conductor includes a first insertion including an inclined portion having an outside diameter gradually increased toward one axial-direction side, and a first straight portion connected to the one axial-direction side of the inclined portion and having an outside diameter constant along the axial direction. The outside diameter of the first straight portion is larger than an inside diameter of the tubular body. The first straight portion is configured to be in contact with the pair of arms.

The present invention provides a novel method of constructing a coax spring-pin socket that furnishes better performance and is easier to manufacture in volume using common dielectrics and copper plating. This is accomplished by, in application, a lamination of PCB dielectric layers. This dielectric block is then drilled, plated, etched, and drilled in steps for the construction of a coaxial structure for the signal pins, and a ground structure for ground pins. This design process that can be quickly adjusted and customized for each design.

According to the present invention, a semiconductor inspection device includes a control section that outputs a signal to inspect a semiconductor wafer, a contact section comprising contact terminals connected to the control section, a probe card that can simultaneously contact a plurality of semiconductor chips formed on the semiconductor wafer and a drive section, wherein the contact terminals can contact some of electrode pads provided for the probe card and the drive section drives the contact section so as to switch electrode pads in contact with the contact terminals.

A connector for interfacing with a circuit board includes a body having opposing first and second face surfaces and defining a plurality of ports extending between the face surfaces. A plurality of center conductors extend in respective ports between the face surfaces. Support elements engage the center conductors to secure the center conductors generally centered in the respective ports. Each center conductor includes a pin portion positioned proximate to the first face surface and a plunger portion positioned to extend beyond the second face surface. The plunger portion moves longitudinally with respect to the connector second face surface for varying the distance of an end of the center conductor from the second face surface to allow adjustability in the interfacing of the connector with a circuit board or other signal handling component.

A test probe tip can include a compliance member or force deflecting assembly and a tip component. The compliance member or force deflecting assembly can include a plunger component and a barrel component to receive the plunger component, wherein the plunger component is configured to slide axially inside the barrel component. The test probe tip can also include a spring mechanism within the barrel component to act on the plunger component, and a resistive/impedance element, e.g., a round rod resistor, coupled with the plunger component at one end and with the tip component at the opposite end.

The invention provides a testing probe, which includes a base, an elastic extensible element and a probe needle, the probe needle being disposed on the base through the elastic extensible element, and the elastic extensible element being in a stretched state. By the testing probe provided by the invention, only coating silver adhesive on the testing area of the liquid crystal screen previously is needed, and the steps of making solder wire, fixing solder wire, etc. are not needed any more. Therefore not only the preparation before testing can be simplified largely, but also reliability of connection is ensured, so as to reduce testing time largely and improve testing efficiency. The invention further provides a testing device including the above testing probe.

An alloy material includes: a composition containing 17 at % to 25 at % of silver (Ag), 30 at % to 45 at % of palladium (Pd), and 30 at % to 53 at % of copper (Cu) in a composition range of a ternary alloy of Ag, Pd, and Cu; and at least one of manganese (Mn), tin (Sn), silicon (Si), antimony (Sb), titanium (Ti) and magnesium (Mg) added to the composition in a range of 4.5 at % or less, and the Mn in a range of 0.5 at % to 3.5 at %, the Sn in a range of 1 at % to 2 at %, the Si in a range of 0.5 at % to 2 at %, the Sb in a range of 0.5 at % to 3 at %, the Ti in a range of 0.5 at % to 2 at %, and the Mg in a range of 0.5 at % to 3.5 at % are added to the composition.

A probe unit according to the present invention is suitable for allowing a large current to flow. In the probe unit that accommodates a plurality of contact probes for electrically connecting an inspection target object and a signal processing device used to output an inspection signal, both ends of a large current probe (3) are electrically connected to electrodes of a contact target object, and a large current is made to flow via a metal block (50) that comes into contact with both end portions of the large current probe (3).

Embodiments provided herein include methods, compositions, and uses of aromatic alcohols to increase the potency of antifungal agents.

The present invention discloses a test probe, a test probe component, and a test platform. The test probe comprises a probe body, wherein one end of the probe body is of a hollow design, thereby cooperating with a gold finger through insertion. According to the present invention, one end of the probe body is of a hollow design, thereby cooperating with the gold finger through insertion, thus solving the current technical problems of the assembling of the probe being relatively difficult, the requirements for processing of the through-hole being relative high, and the powering on being unstable.