The present disclosure provides a probe device, a probe system including the probe device and an operating thereof. The operating method includes: approaching the probe device to a reference region; stopping the probe device when a first pin of a sensing module of the probe device touches the reference region; rotating the probe device and approaching the probe device to the reference region; and stopping the probe device when both the first pin and a second pin of the sensing module of the probe device touch the reference region.

The invention relates to a test needle for measuring electrically conductive layers in holes of printed circuit boards, as well as to a test probe equipped with such a test needle and to a flying probe tester for testing printed circuit boards equipped with such a test needle or such a test probe.

The test needle has a capacitive measuring body, which is connected via a cable to a capacitive measuring device. The cable is shielded so that only the capacitive measuring body can form a capacitive coupling with other electrically conductive bodies. This makes it possible to determine this capacitive coupling with a high local resolution.

Embodiments implement rotation stoppage for a contact pin at a lower cost, in which the contact pin is disposed in a socket main body to establish electrical conduction between an IC package and a wiring board. The contact pin has a barrel, an upper contact member, a lower contact member, and a coil spring. The barrel has a flange that has rotation stoppers protruding in the horizontal direction. When the contact pin is disposed in a socket main body, the rotation stoppers of the flange are brought into contact with the socket main body, whereby the barrel is restrained from rotating relative to the socket main body.

A probe card device includes a first die, a second die, and a plurality of rectangular probes. Each of the rectangular probes includes a middle segment, two extending segments, and two contact end segments. In each of the rectangular probes, the two extending segments are respectively arranged in the first die and the second die, the two contact end segments respectively extend from two opposite ends of the two extending segments along a direction away from the middle segment, each of the two contact end segments includes a conductive portion, and at least one of the two contact end segments includes a piercing portion partially embedded in the conductive portion thereof. A conductivity of the piercing portion is less than that of each of the two conductive portions, and a Vickers hardness number of the piercing portion is larger than that of each of the two conductive portions.

A probe for characteristic inspection of a connector includes a plunger, a coaxial cable, a flange, and a housing having an end portion on one side including an increased diameter portion. A recessed portion which receives the increased diameter portion is in an upper surface of the flange. The increased diameter portion has side walls in contact with or facing respective inner side surfaces of the flange partly, with the inner side surfaces forming the recessed portion, and a bottom wall in contact with an upper recessed surface of the flange that forms the recessed portion. The increased diameter portion has connection surfaces connecting the bottom and side walls and inclined inward from one of the side walls toward the bottom wall. Alternatively, the inner side surfaces each have a first surface inclined downward, and a vertical surface extending downward from the first surface to the upper recessed surface.

A probe head and a conductive probe thereof are provided. The conductive probe includes a first long lateral surface and an opposite second long lateral surface. The first long lateral surface and the second long lateral surface define a central axis there-between. The conductive probe includes a middle segment, an upper connecting segment and a lower connecting segment respectively extending from the middle segment in two opposite directions, and an upper contacting segment and a lower contacting segment respectively extending from the upper and the lower connecting segments in two opposite directions. The upper connecting segment includes an extension extending from the first long lateral surface in a direction away from the central axis. The upper contacting segment includes a protrusion extending from the first long lateral surface in a direction away from the central axis, and the extension and the protrusion are spaced apart from each other.

The application provides a spring probe with high stability, which comprises a hollow syringe with a spring in it. The upper end and the lower end of the syringe has an upper thimble and a lower thimble respectively. There are two support rings at the outer clearance of the syringe, and a group of flanges for positioning the support rings at two sides of each support ring. The advantages of this application are that: the support ring can ensure that the spring probe is better fixed in the fixed plate without being pressed out, thereby better ensuring that the spring probe does not deviate beyond the tolerance range when used, and obviously improving the high frequency bandwidth by the support ring with low relative dielectric constant.

There is provided a probe pin for performing an electrical inspection between a contact pad of a test apparatus and a conductive ball of a semiconductor device, the probe pin including a cylinder-type bottom plunger connected to the contact pad and configured to slide vertically, a piston-type top plunger connected to the conductive ball and configured to slide vertically, and an outer spring configured to provide an elastic force between the bottom plunger and the top plunger. According to the configuration of the present invention, it is possible to perform a stable inspection process by using the outer spring despite pin miniaturization.

The present disclosure provides a probe apparatus, including a circuit board, a flexible interconnect substrate, at least one probe, and a supporting element. The circuit board includes tester contacts. The flexible interconnect substrate has a first surface and an opposing second surface. The flexible interconnect substrate is electrically coupled to the circuit board. The probe is disposed in the first surface of the flexible interconnect substrate. The probe is electrically coupled to the flexible interconnect substrate, and the probe is configured to electrically contact a device under test. The supporting element is adhered to the second surface of the flexible interconnect substrate. The supporting element is disposed between the flexible interconnect substrate and the circuit board.

The disclosure includes a contact device for electrical test, the contact device for electrical test including a second body portion, a first body portion stacked above the second body portion, a middle portion stacked above the first body portion, and having a first protrusion that is sharp and has a first apex portion, the first protrusion being formed on an upper side of the middle portion, and the first body portion, the middle portion, and the contact portion are sequentially and upwardly stacked, the middle portion and the contact portion include materials different from each other, and a first protrusion is provided inside the second protrusion.