The present invention relates to a test socket having a thin structure that can reduce durability degradation of a contact itself, have excellent electrical characteristics in processing high-speed signals, and can extend a service life thereof, and relates to spring contacts suitable thereto. The test socket according to the present invention includes: a plurality of spring contacts (100) each of which includes an upper contact pin (110) and a lower contact pin (120) that are assembled cross each other, and a spring (130) supporting the upper and lower contact pins (110 and 120); a main plate (1110) having a plurality of accommodating holes (1111) in which the respective spring contacts (100) are accommodated, with first openings (1113); and a film plate (1120) provided on a lower portion of the main plate (1110), and having second openings (1121).

The present disclosure provides a probe and a probe card device. The probe card device includes a first plate and a plurality of probes. The probes are arranged through the first plate, and include a first probe and a second probe. The first probe has a first body and an end portion of the first body. The end portion of the first body has a first recess and a first protrusion. The second probe has a second body and an end portion of the second body. The end portion of the second body has a second recess and a second protrusion. The second protrusion extends into the first recess.

A probe tip for an isolated probe having a triaxial cable has a conductive probe tip interface at one end of the cable, a signal conductor, the signal conductor traversing a length of the cable and electrically connected to the conductive probe tip interface, a reference conductor surrounding the signal conductor along the length of the cable, a shield conductor surrounding the reference conductor at least along the length of the cable, the shield conductor and the reference conductor electrically connected at ends of the probe tip, a first insulator between the signal conductor and the reference conductor along the length of the cable, a second insulator between the reference conductor and the shield conductor along the length of the cable, and high magnetic permeability material inside the shield conductor. A method of manufacturing a tip for an isolated probe having a triaxial cable includes accessing a shield conductor of the triaxial cable, inserting a high magnetic permeability material between the shield conductor and a reference conductor in the triaxial cable, electrically connecting the shield conductor to the reference conductor. A triaxial cable has a signal conductor, the signal conductor traversing a length of the cable, a reference conductor surrounding the signal conductor along the length of the cable, a shield conductor surrounding the reference conductor along the length of the cable, the shield conductor and the reference conductor electrically connected at ends of the cable, a first insulator between the signal conductor and the reference conductor along the length of the cable, a second insulator between the reference conductor and the shield conductor along the length of the cable, and high magnetic permeability material inside the shield conductor.

An automated high speed test solution for Quad Flat Pack device packages that enables connectivity between test equipment and the integrated circuit under test is described. A test probe geometry that provides highly repeatable and reliable connections suitable for use with consumer grade QFP devices coupled with ease of maintenance is provided. In some embodiments, the probe tip ends are chisel-shaped. The probes can be slightly slanted with respect to a vertical axis of the probe retaining block.

Probes that define retroreflectors, probe systems that include the probes, and methods of utilizing the probes. The probes include the retroreflector, which is defined by a retroreflector body. The retroreflector body includes a first side, an opposed second side, a tapered region that extends from the first side, and a light-receiving region that is defined on the second side. The probes also include a probe tip, which is configured to provide a test signal to a device under test (DUT) and/or to receive a resultant signal from the DUT. The retroreflector is configured to receive light, via the light-receiving region, at a light angle of incidence. The retroreflector also is configured to emit at least an emitted fraction of the light, from the retroreflector body and via the light-receiving region, at a light angle of emission that is at least substantially equal to the light angle of incidence.

A vertical probe assembly having a resilient compliant probe, a first guide plate, a second guide plate, and a third guide plate is disclosed. The probe may include an upper portion, a lower portion, and a stopper structure positioned between the upper and lower portions of the first probe. The first, second, and third guide plates may be formed from a non-conductive substrate and separated by one or more spacers. The first, second, and third guide plates may also include a first, second, and third hole, respectively. The first, second, and third holes may be vertically aligned. The probe may be positioned within the first, second, and third holes such that the upper portion extends through the first hole, the lower portion extends through the second and third holes, and the stopper structure contacts a surface of the second guide plate that faces the first guide plate.

A probe pin is proposed. The probe pin includes a first plunger configured to come in contact with a testing target contact point of a testing object and a second plunger configured to come in contact with a testing contact point of a testing circuit, in which the first plunge or the second plunger has a stem extending with a predetermined cross-sectional area and a contact portion extending from the stem such that a cross-sectional area decreases, and having first second tips, which are configured to come in contact with the testing target contact point or the testing contact point, at a front end; and the first and second tips are formed in symmetric shapes at positions that are symmetric with a central axis of the stem therebetween.

A wafer probe alignment system includes a test probe needle including a body having a tip that is configured to make contact with a surface of a wafer at a first tip position, wherein the body is deformable and includes a sensing area that undergoes a deformation in response to at least one force, including a lateral friction force, applied to the tip; at least one sensor configured to monitor the sensing area for deformation caused by a lateral friction force and generate at least one first sensor information representative of the lateral friction force; and a controller configured to control a position of the tip, wherein the controller is configured to receive the at least one first sensor information and reposition the tip to counteract the lateral friction force in order to maintain the tip at the first tip position.

The invention relates to a contact device (1) for contacting an electrical contact point of a test object, comprising a contact plunger (3), which has a plunger shaft (4) for mounting in a guide sleeve (2) in an axially displaceable manner as well as a contact head (5) which is assignable to the test object and arranged on a free end of the plunger shaft (4), and comprising at least one contact element (13), which is movably mounted on and/or in the contact head (5), whereby at least one spring element (6), which is elastically deformable against its spring force by means of the contact element (13) under a load resulting from a contact, is assigned to the contact element (13). is provided that several of the contact elements (13), which in each case have a contact area (14) for contacting, are arranged next to one another on the contact head (5) in such a way that the contact areas (14) form an at least essentially continuous contact surface (15) of the contact head (5) for the contact point in the unloaded state.

A probe pin is proposed. The probe pin includes a first plunger configured to come in contact with a testing target contact point of a testing object and a second plunger configured to come in contact with a testing contact point of a testing circuit, in which the first plunge or the second plunger has a stem extending with a predetermined cross-sectional area and a contact portion extending from the stem such that a cross-sectional area decreases, and having first second tips, which are configured to come in contact with the testing target contact point or the testing contact point, at a front end; and the first and second tips are formed in symmetric shapes at positions that are symmetric with a central axis of the stem therebetween.