A probe module includes a circuit board and at least one probe formed on a probe installation surface of the circuit board by a microelectromechanical manufacturing process and including a probe body and a probe tip. The probe body includes first and second end portions and a longitudinal portion having first and second surfaces facing toward opposite first and second directions. The probe tip extends from the probe body toward the first direction and is processed with a gradually narrowing shape by laser cutting. The first and/or second end portion has a supporting seat protruding from the second surface toward the second direction and connected to the probe installation surface, such that the longitudinal portion and the probe tip are suspended above the probe installation surface. The probe has a tiny pinpoint for detecting tiny electronic components, and its manufacturing method is time-saving and high in yield rate.

In some implementations, a probe tip assembly includes a driver printed circuit board assembly (PCBA) and a probe tip subassembly. The probe tip subassembly includes a plurality of probe tips, wherein a probe tip, of the plurality of probe tips, extends beyond an end of the PCBA, and the PCBA and the probe tip are configured to transmit an electric signal to test an optical component. The probe tip may include a material comprising at least one of copper (Cu), a beryllium copper (BeCu) alloy, tungsten (W), Paliney, Neyoro, and/or another conductive material.

A test probe includes a main body extending along an axis, and a contact unit connected to the main body. The contact unit includes a plurality of structural components surrounding the axis and extending outwardly from the main body along the axis. Each structural component has a pointed tip suitable for contact with an object to be tested, and at least one ridgeline connected to the pointed tip. The at least one ridgeline is inclined with respect to a reference surface that passes through said pointed tip and that is perpendicular to the axis, and is configured to form an included angle with the reference surface. The included angle is smaller than 30 degrees.

Structures and methods for directly testing a semiconductor wafer having micro-solder connections. According to one embodiment, a method forms a pattern of micro-solder connections coupled with a through substrate via (TSV) that can be directly tested by electrical probing, without the use of a testing interposer. According to another embodiment, a method tests the pattern of micro-solder connections. According to another embodiment, a novel electrical probe tip structure has contacts on the same pitch as the pattern of micro-solder connections.

An electrical contactor includes: an installing portion; a base end portion extending continuously toward the installing portion; a plurality of arm portions extending from the base end portion in a longitudinal direction; a coupling portion coupled to the tip of each of the arm portions; a pedestal portion provided continuously toward the coupling portion; and a contact portion provided at a lower end of the pedestal portion, wherein each of the plurality of arm portions elastically supports the contact portion in contact with a first contact target, and a curved portion is provided on the coupling portion side or the base end portion side of a closest-to-contact-portion arm portion that is the closest to the contact portion among the plurality of arm portions.

The contact probe comprises a barrel 50, an inspection device side terminal 60, a test board side terminal 70, and a spring 80 disposed in a state of being in contact with the test board side terminal 70 and the inspection device side terminal 60, the test board side terminal 70 includes a stop portion 74 that can abut on the caulked portion 52 in the barrel 50 and a terminal body that projects from the other end 56 of the barrel 50, and the terminal body includes, in order from a tip end, a first shaft section 71, a second shaft section 72 having a diameter larger than a diameter of the first shaft section 71, and a third shaft section 73 having a diameter smaller than the diameter of the second shaft section 72 and having at least a part that can be housed in the barrel 50.

A contact terminal includes a tubular body extending in an axial direction of the contact terminal and having conductivity; a bar-shaped first conductor having conductivity and capable of coming into contact with an inspection target; and a bar-shaped second conductor having conductivity. The first conductor includes: a first protrusion that protrudes from the tubular body toward one side in the axial direction; and a first insertion portion provided at the other end of the first conductor in the axial direction and disposed in the tubular body. The second conductor includes a second insertion portion disposed in the tubular body. The tubular body includes: a spring portion configured in a spiral shape along a peripheral surface of the tubular body; and a first body portion connected to one side in the axial direction of the spring portion. The first insertion portion is fixed to the first body portion.

A probe card device and a dual-arm probe are provided. The dual-arm probe has a probe length, and includes a bifurcation end portion and a testing end portion. The dual-arm probe has two broad side surfaces respectively arranged on two opposite sides thereof The dual-arm probe has a separation slot that is recessed from a bifurcation opening of the bifurcation end portion toward the testing end portion and that penetrates from one of the two broad side surfaces to the other one, so that two branch arms of the dual-arm probe are defined by the separation slot and are spaced apart from each other. The separation slot has a slot length being 50% to 90% of the probe length. In a cross section of the two branch arms, an area of any one of the two branch arms is 90% to 110% of that of the other one.

A contact probe is conductive and capable of expanding/contracting along an axial line direction. The contact probe includes: a first contact member configured to contact one contact target; a second contact member configured to contact another contact target, and to house at least a portion of the first contact member; and a spring member configured to couple the first contact member and the second contact member in a manner capable of expansion/contraction with both end parts of the spring member. The spring member is wound in a helical shape, and at least a diameter of an outer circumference in one of the end parts held by the second contact member is larger than diameters of other portions. A diameter of an inner circumference of an end part of the second contact member on a side housing the first contact member is equal to or larger than a maximum diameter of the first contact member.

A contact probe for a testing head of an apparatus for testing electronic devices comprises a body extending along a longitudinal axis between a first end portion and a second end portion, the second end portion being adapted to contact pads of a device under test. Suitably, the contact probe comprises a first section, which extends along the longitudinal axis from the first end portion and is made of an electrically non-conductive material, and a second section, which extends along the longitudinal axis from the second end portion up to the first section, the second section being electrically conductive and extending over a distance less than 1000 μm.