A high-frequency testing probe is disclosed. The probe includes a layered probe substrate having a first and second PCB, as well as first and second conducting traces disposed on opposite sides of the substrate. The probe substrate has an ungrounded differential region including two probe tips coupled to the traces, a grounded differential region, and a decoupled differential region including two probe connectors coupled to the traces. The probe also includes a ground plane between the two PCBs and between the two traces in the decoupled and grounded differential regions. In the ungrounded differential region, the first and second traces form a first differential transmission pair having a differential impedance. In the grounded differential region, the first and second traces form a second differential transmission pair having the differential impedance. The probe connectors are configured to couple to one of a vector network analyzer and a time domain reflectometer.

A probe for direct nano- and micro-scale electrical characterization of materials and semi conductor wafers. The probe (10) comprises a probe body (12), a first cantilever (20a) extending from the probe body. The first cantilever defining a first loop with respect to said probe body. The probe further comprises a first contact probe being supported by said first cantilever, and a second contact probe being electrically insulated from the first contact probe. The second contact probe being supported by the first cantilever or by a second cantilever (20b) extending from the probe body.

Pin probes and pin probe arrays are provided that allow electric contact to be made with selected electronic circuit components. Some embodiments include one or more compliant pin elements located within a sheath. Some embodiments include pin probes that include locking or latching elements that may be used to fix pin portions of probes into sheaths. Some embodiments provide for fabrication of probes using multi-layer electrochemical fabrication methods.

Probes for contacting electronic components include a plurality of compliant modules stacked in a serial configuration, which are supported by an exoskeleton or an endoskeleton which allows for linear longitudinal compression of probe ends toward one another wherein the compliant elements within the compliant modules include planar springs (when unbiased). Other probes are formed from single compliant modules or pairs of back-to-back modules that may share a common base. Module bases may include configurations that allow for one or both lateral alignment and longitudinal alignment of probes relative to array structures (e.g., array substrates, guide plates) or other modules they contact or to which they adhere.

A contact probe having a first end portion adapted to abut onto a contact pad of a device under test and a second end portion adapted to abut onto a contact pad of a PCB board of a testing apparatus, as well as a rod-shaped probe body extended between the end portions along a longitudinal development direction is provided with an opening extending along the longitudinal development direction and defines at least one pair of arms in the probe body. Suitably, each arm of the at least one pair of arms has a not constant transversal section, which is perpendicular to the longitudinal development direction, having different areas in correspondence of different points along the probe body and ensures a distribution of the stress along the probe body during bending thereof during testing operation of the device under test performed by means of the contact probe.

The present disclosure provides a probe structure. The probe structure includes a plurality of bodies and a plurality of protrusions. Each body includes an end portion. Each end portion has a surface. The plurality of protrusions are formed on the surfaces and extend toward a same direction. At least one protrusion is formed on each surface.

The invention relates to a test needle for measuring electrically conductive layers in holes of printed circuit boards, as well as to a test probe equipped with such a test needle and to a flying probe tester for testing printed circuit boards equipped with such a test needle or such a test probe. The test needle has a capacitive measuring body, which is connected via a cable to a capacitive measuring device. The cable is shielded so that only the capacitive measuring body can form a capacitive coupling with other electrically conductive bodies. This makes it possible to determine this capacitive coupling with a high local resolution.

A testing arrangement for testing Integrated Circuit (IC) interconnects is provided. In an example, the testing arrangement includes a substrate, and a first interconnect structure. The first interconnect structure may include a first member having a first end to attach to the substrate and a second end opposite the first end, and a second member having a first end to attach to the substrate and a second end opposite the first end. In some examples, the second end of the first member and the second end of the second member are to contact a second interconnect structure of a IC device under test, and the first end of the first member and the first end of the second member are coupled such that the first member and the second member are to transmit, in parallel, current to the second interconnect structure of the IC device under test.

A contact probe for a probe head for test equipment of electronic devices is provided. The contact probe includes a first end portion and a second end portion configured to realize a contact with suitable contact structures, and a body portion extended along a longitudinal development axis between respective the first and second end portions. The first end portion includes a base portion, a peripherally protruding element protruding from the base portion, and a hollow part having a base at a surface of the base portion and being surrounded by the peripherally protruding element. In addition, the peripherally protruding element is configured to penetrate into the contact structures.

A contact, an inspection jig using the contact, an inspection device, and a method of manufacturing the contact are provided. A contact includes a coil spring including a slit formed in a cylindrical body and first and second conductors. A bottom wall portion, a first side wall portion, a second side wall portion, and a top wall portion are configured so a cross-sectional shape of the cylindrical body as viewed in the axial direction is rectangular, the slit includes a first slit, a second slit, a third slit, and a fourth slit, the third slit is continuous with the first slit and the second slit, the fourth slit is continuous with the second slit, the first slit and the second slit are rectangular in a side view of the cylindrical body, the first and second conductors respectively connected to first and second end portions of the cylindrical body.