A contact probe for a testing head for testing electronic devices includes a rod-like body made of a first conductive material and extending along a longitudinal axis, and a contact tip supported by the body at an end portion thereof. The contact tip is made of a second conductive material that is different from the first conductive material. The contact tip includes a contact zone configured to perform mechanical and electrical contact with contact pads of a device under test. The body and the contact tip include respective contact surfaces in contact with each other. The contact surfaces are complementary to each other and include respective connection elements engaging each other. The connection elements include a protruding element projecting from the contact surface of one among the body and the contact tip, and a recess made in the other among the body and the contact tip.

A test pin contact buffer, fixed to a test pin base, is a sheet-like structure made of a composite material including a conductive material and an insulating material, and defines at least one contact area corresponding to at least one test pin of the test pin base. The contact area has at least one cutout hole, an insulating deformation structure and a conductive head structure. The insulating deformation structure is extendable and made of the insulating material and extends outward from the conductive head structure. The cutout hole enables the contact area to be in a partial hollow state, which is beneficial for deformation of the insulating deformation structure. The test pin can be used for performing measurement in an indirect manner, reducing the wear of the test pin, prolonging the service life, and improving the measurement speed and efficiency.

Provided is a conical nano-carbon material functionalized needle tip, formed by assembling a nano-carbon material with a material of a needle tip by means of a covalent bond; and the material of the needle tip is a metal selected from one or more of tungsten, iron, cobalt, nickel and titanium. Further provided is a method for preparing the conical nano-carbon material functionalized needle tip. The conical nano-material functionalized needle tip has an outstanding interface formed by metal-carbide covalent bonds, and the orientation of the conical nano-material is matched with the axial direction of the metal needle tip (illustrated in FIG. 6). The proposed preparation method affords a robust interface and avoids the potential pollution to the nano-material caused during the deposition of fixing materials, such as carbon or platinum or the like, in other preparation methods.

A detection device includes: a metal body having a plurality of main vias, a plurality of main through holes with insulators formed on the hole walls of the main vias, and a plurality of connecting elements disposed in the main through holes. Therefore, when testing a chip with I/O pins of high density with the detection device, the connecting elements contact the insulator only, without contacting the hole walls of the main vias, and the problem of short circuits can be avoided. A method of forming a detection device is also provided.

Methods, systems and devices related to wafer level probing of electrical biosensors.

A probe card includes a conductive body, an insulation block, and a plurality of conductive microsprings. The insulation block covers at least one side of the body and at least partially encloses the microsprings. A first end of each microspring is connected to the conductive body and a second end is exposed from the insulation block. In operation, the probe card is moved onto one or more semiconductor devices to be tested. As the probe card is moved toward the semiconductor devices, the second ends of the conductive microsprings come into contact with contact pads on the semiconductor devices. The insulation block encloses the microsprings, which prevents the microsprings from buckling or making contact with each other. As a result, the probe card produces fewer false positives and false negatives during the testing process.

A test probe for testing a chip package is provided, wherein the test probe comprises a test probe body comprising a conductive material; and a probe tip arranged on an end of the test probe body and comprising carbon nano tubes.

A probe for direct nano- and micro-scale electrical characterization of materials and semi conductor wafers. The probe (10) comprises a probe body (12), a first cantilever (20a) extending from the probe body. The first cantilever defining a first loop with respect to said probe body. The probe further comprises a first contact probe being supported by said first cantilever, and a second contact probe being electrically insulated from the first contact probe. The second contact probe being supported by the first cantilever or by a second cantilever (20b) extending from the probe body.

Forming buckling beam probe arrays having MEMS probes engaged with guide plates during formation or after formation of the probes while the probes are held in the array configuration in which they were formed is disclosed. Probes can be formed in, or laterally aligned with, guide plate through holes. Guide plate engagement can occur by longitudinally locating guide plates on probes that are partially formed or fully formed with exposed ends, by forming probes within guide plate through holes, by forming guide plates around probes, or forming guide plates in lateral alignment with arrayed probes and then longitudinally engaging the probes and the through holes of the guide plates. Arrays can include probes and a substrate to which the probes are bonded with one or more guide plates. Final arrays can include probes held by guide plates with aligned or laterally shifted hole patterns.

A probe module includes a circuit board and at least one probe formed on a probe installation surface of the circuit board by a microelectromechanical manufacturing process and including a probe body and a probe tip. The probe body includes first and second end portions and a longitudinal portion having first and second surfaces facing toward opposite first and second directions. The probe tip extends from the probe body toward the first direction and is processed with a gradually narrowing shape by laser cutting. The first and/or second end portion has a supporting seat protruding from the second surface toward the second direction and connected to the probe installation surface, such that the longitudinal portion and the probe tip are suspended above the probe installation surface. The probe has a tiny pinpoint for detecting tiny electronic components, and its manufacturing method is time-saving and high in yield rate.