Disclosed herein is a method of providing a structure having two electrodes connected by nanowires, exposing the structure to an analyte that can adsorb onto the nanowires, and passing an electrical current through the nanowires to heat the nanowires to desorb the analyte. Also disclosed herein is an apparatus having the above structure; a current source electrically connected to the electrodes, and a detector to detect the analyte.

A rectangular probe of a probe card device includes an upper positioned segment, an upper contacting segment, a deformable segment, a lower positioned segment, and a lower contacting segment. The upper positioned segment includes an offset portion, a first positioned portion extending from the offset portion along a first direction, and a second positioned portion extending from a second direction being parallel to and opposite to the first direction. In a width direction perpendicular to the first direction, a width of the first positioned portion is 25%-95% of a width of the offset portion, and a width of the second positioned portion is 25%-95% of the width of the offset portion. The upper contacting segment extends from the first positioned portion along the first direction. The deformable segment, the lower positioned segment, and the lower contacting segment sequentially extend from the second positioned portion along the second direction.

A probe card device includes a probe head including a plurality of pins, wherein each of the pins includes a body, a first metal layer formed on the body, and a second metal layer covering the first metal layer; a multi-layered flexible board electrically connected to the pins; a support plate, the multi-layered flexible board disposed on a first surface of the support plate; and a circuit board electrically connected to the multi-layered flexible board.

A miniature probe for measuring small voltage signals of a DUT includes a probe body having a flexible substrate and signal transmission lines running a longitudinally, and a first probe connection circuit located at a first end of the probe body and including exposed wires, SMT components coupled between the exposed wires and the signal transmission lines, respectively, and a local mechanical stiffener mounted adjacent the SMT components. The wires are connectable to the DUT for receiving the voltage signals. The probe further includes a second probe connection circuit located at a second end of the probe body, and including transmission line connectors coupled to the signal transmission lines, respectively, and a bent portion of the flexible substrate between the probe body and the transmission line connectors. The bent portion enables the transmission line connectors to exit the probe substantially axially, relative to the longitudinal length of the probe body.

System for performing in-line nanoprobing on semiconductor wafer. A wafer support or vertical wafer positioner is attached to a wafer stage. An SEM column, an optical microscope and a plurality of nanoprobe positioners are all attached to the ceiling. The nanoprobe positioners have one nanoprobe configured for physically contacting selected points on the wafer. A force (or touch) sensor measures contact force applied by the probe to the wafer (or the moment) when the probe physically contacts the wafer. A plurality of drift sensors are provided for calculating probe vs. wafer alignment drift in real-time during measurements.

A probe head for electrical detection of semiconductor devices and a probe assembly including the same are provided. The probe head includes: a probe head body; and at least one polygon cone shaped contact portion coupled to an end face of the probe head body. The probe head body includes at least three body portions sequentially stacked and coupled axially, the second body portion has an outer diameter greater than the first and third body portions. The at least one contact portion is disposed around the periphery of the end face of the probe head body. Each contact portion has an inclined edge or inclined plane inclined upward and outward from a central portion of the probe head body and oriented to facing a central axis of the probe head body. The first body portion has a hardness greater than or equal to the at least one contact portion.

Provided are improved manufacturing methods of semiconductor devices, probe cards, test apparatuses including the probe card, and methods for manufacturing probe cards. The probe card includes a circuit board, a support located under the circuit board, and a plurality of probe needles located on a bottom surface of the support. Each of the probe needles has a tip configured to contact a side surface of a bump included in a test target. The support may include a stress absorption layer located on a bottom surface to which the probe needles are connected. Manufacturing of semiconductor devices may comprise forming elongated conductive bumps on a body of a semiconductor device, testing the semiconductor device by contacting tips of the probe needles to sides surfaces of the bumps and packaging of the semiconductor device.

Probes for testing electrical circuits having decoupled electrical and mechanical design are provided. For example, a mechanically resilient core can be surrounded by an electrically conductive shell. In this way, electrical parameters of the probes are determined by the shells and mechanical parameters of the probes are determined by the cores. An important application of this approach is to provide impedance matched transmission line probes.

Vertical probes, formed of at least one layer that longitudinally includes a first and a second end and a central portion, with the central portion including at least three compliant arms wherein each of the two outer arms include a material having a yield strength greater than a first amount and the at least one intermediate arm is formed of a material having a yield strength less than the first yield strength amount wherein a yield strength of the material of the intermediate arm has a ratio to that of an outer arm of less than 1, more preferably less than 0.8, even more preferably less than 0.6, and most preferably less than 0.4.

Probes for contacting electronic components include a plurality of compliant modules stacked in a serial configuration, which are supported by an exoskeleton or an endoskeleton which allows for linear longitudinal compression of probe ends toward one another wherein the compliant elements within the compliant modules include planar springs (when unbiased). Other probes are formed from single compliant modules or pairs of back-to-back modules that may share a common base. Module bases may include configurations that allow for one or both lateral alignment and longitudinal alignment of probes relative to array structures (e.g., array substrates, guide plates) or other modules they contact or to which they adhere.