A contact probe having a first end portion and a second end portion, a probe body extended along a longitudinal development direction between the first end portion and the second end portion is disclosed. The probe body has a pair of arms separated by a slot and extending according to the longitudinal development direction and a conductive insert extended along the longitudinal development direction, in a bending plane of the contact probe. The conductive insert is made of a first material and the contact probe is made of a second material and the first material has a lower electrical resistivity than an electrical resistivity of the second material. The conductive insert is a power transmission element of the contact probe and the arms are structural support elements of the contact probe during a deformation of the probe body.

A system for testing multiple devices includes a connector holder having a plurality of holes, wherein each hole included in the plurality of holes is configured to hold a respective cable connector that connects to a cable; a device holder that is configured to hold a first device in a testing position; and an engagement mechanism that supports the connector holder and is operable to move the connector holder to an engaged position, wherein when the first device is being held by the device holder in the testing position, and a first hole included in the plurality of holes holds a first cable connector, a contact point associated with the first cable connector contacts a signal pad associated with the first device.

Provided are improved manufacturing methods of semiconductor devices, probe cards, test apparatuses including the probe card, and methods for manufacturing probe cards. The probe card includes a circuit board, a support located under the circuit board, and a plurality of probe needles located on a bottom surface of the support. Each of the probe needles has a tip configured to contact a side surface of a bump included in a test target. The support may include a stress absorption layer located on a bottom surface to which the probe needles are connected. Manufacturing of semiconductor devices may comprise forming elongated conductive bumps on a body of a semiconductor device, testing the semiconductor device by contacting tips of the probe needles to sides surfaces of the bumps and packaging of the semiconductor device.

The terminals of a device under test (DUT) are temporarily electrically connected to corresponding contact pads on a load board by a series of electrically conductive pin pairs. The pin pairs are held in place by an interposer membrane with a top facing the device under test, a bottom facing the load board, and a vertically resilient, non-conductive member between the top and bottom contact plates. Each pin pair includes a top and bottom pin, which extend beyond the top and bottom contact plates, respectively, toward the device under test and the load board, respectively. The bottom pins has a lower contact surface which includes an arcuate portion or ridge which increases contact pressure and ablates oxides by the rocking action of ridge when the DUT in inserted.

Disclosed herein is a structure having: a support, a plurality of nanowires perpendicular to the support, and an electrode in contact with a first end of each nanowire. Each nanowire has a second end in contact with the support. The electrode contains a plurality of perforations. The electrode contains a plurality of perforations. Also disclosed herein is a method of: providing the above support and nanowires; depositing a layer of a filler material that covers a portion of each nanowire and leaves a first end of each nanowire exposed; depositing a plurality of nanoparticles onto the filler material; depositing an electrode material on the nanoparticles, the ends of the nanowires, and any exposed filler material; and removing the nanoparticles and filler material to form an electrode in contact with the first end of each nanowire; wherein the electrode contains a plurality of perforations.

A device to improve the safety of head, heart, muscle and organ electrical stimulation devices during MRI scanning. The device consists of introducing an alternative second loop containing an energy dissipating device, with the possible addition of means to divert most of the induced energy during the MRI scanning into the second loop and into the energy dissipating device, thereby protecting the electrodes, the battery and the controlling electronics of the electrical stimulation device.

Probes for contacting electronic components include a plurality of compliant modules stacked in a serial configuration, which are supported by an exoskeleton or an endoskeleton which allows for linear longitudinal compression of probe ends toward one another wherein the compliant elements within the compliant modules include planar springs (when unbiased). Other probes are formed from single compliant modules or pairs of back-to-back modules that may share a common base. Module bases may include configurations that allow for one or both lateral alignment and longitudinal alignment of probes relative to array structures (e.g., array substrates, guide plates) or other modules they contact or to which they adhere.

In one embodiment of the present invention, a test probe assembly for testing packaged integrated circuit (IC) devices includes a plurality of probes, a pad and a PCB/interposer. The plurality of probes is configured to repeatedly maintain reliable electrical contact with a corresponding plurality of DUT contacts when under a compliant force. The pad provides mechanical support and/or electric coupling for the plurality of probes. In turn, the PCB/interposer supports the pad. In some embodiments, the plurality of probes includes a hard core material such as diamond. In other embodiments, the surface of the probes is hardened.

A probe head comprising of pogo pins and a slot for accepting a probe board is provided. The pogo pin has a spring-loaded rotating ball at its apex which allows for smooth sliding of a probe board into the slot. The probe board houses a probe chip with a single or multiple integrated probes. The probes are used to extract the electrical, mechanical, optical, chemical, and structural properties of thin film materials and semiconductor integrated circuits.

A probe chip consisting of multiple probes integrated on a single substrate. The layout of the probes could be designed to match specific features on the device under test. The probes are spring-loaded to allow for reversible deformation during contacting of the device under test. The probe chip provides for detailed electrical and mechanical testing of integrated circuits (IC).