A chip testing apparatus and system suitable for performing testing on multiple chips in a chip cluster are provided. The chip testing apparatus includes a signal interface and a test design circuit. The signal interface transmits an input signal and multiple driving signals in parallel from a test equipment to each of the chips. The test design circuit receives multiple output signals from the chips through the signal interface and serially outputs a test data to the test equipment according to the output signals.

A wafer probe alignment system includes a test probe needle including a body having a tip that is configured to make contact with a surface of a wafer at a first tip position, wherein the body is deformable and includes a sensing area that undergoes a deformation in response to at least one force, including a lateral friction force, applied to the tip; at least one sensor configured to monitor the sensing area for deformation caused by a lateral friction force and generate at least one first sensor information representative of the lateral friction force; and a controller configured to control a position of the tip, wherein the controller is configured to receive the at least one first sensor information and reposition the tip to counteract the lateral friction force in order to maintain the tip at the first tip position.

When a load necessary for inspection is applied to a cylindrical body in the axial direction thereof, an end of the first bar-like main body is located closer to the other end side of the cylindrical body than one end of a support portion in a support member that supports the body portion, an end of the second bar-like main body is located closer to one end side of the cylindrical body than the other end of the support portion, the body portion is located in the entire portion where the support portion is located, and a radial distance between the outer peripheral surface of the axial central portion of at least one of the first spring portion and the second spring portion and the support member is larger than the distance between the body portion and the support portion.

A probe test card includes a substrate, a plurality of test needles, and a fixing layer. The substrate includes a first surface at which a trench is formed, and a second surface opposite to the first surface. The plurality of test needles is arranged in the trench. Each test needle includes a first end and a second end being opposite to the first end. The fixing layer is filled in the trench to fix the plurality of test needles in the trench, and a thickness of the fixing layer is same with a depth of the trench. The fixing layer comprises a ceramic powder. The first end of the test needle is non-removably fixed in the trench by the fixing layer and the second end of the test needle protrudes from the trench of the substrate to test a device under test (DUT).

A semiconductor wafer includes a scribe line and a probe pad. The scribe line extends along a first direction. The probe pad is disposed on the scribe line and is configured to contact a probe needle. The probe pad includes a first metal layer, a dielectric layer, and a second metal layer. The dielectric layer is disposed on the first metal layer, in which the dielectric layer includes a first recess and a second recess. The second metal layer is configured to connect to the first metal layer, in which the second metal layer includes a first portion and a second portion, and the first portion and the second portion are separated by a distance in a second direction perpendicular to the first direction.

A probe testing device having an elastic structure is provided. The probe testing device having the elastic structure includes a plurality of probe elements and a guide plate module. Each of the probe elements includes a body, a first contact segment, and a second segment, and is formed integrally. The guide plate module includes a first guide plate, a second guide plate, and a third guide plate that are parallel to each other, and the third guide plate is arranged between the first guide plate and the second guide plate. The plurality of probe elements correspondingly pass through the first guide plate, the second guide plate, and the third guide plate. The third guide plate is configured to perform a parallel movement relative to the first guide plate and the second guide plate in a direction perpendicular to an axis of the probe element.

Reliability of an electrical test of a semiconductor wafer is improved. A method of manufacturing a semiconductor device includes a step of performing an electrical test of a semiconductor element by allowing contact portions (tips) of a force terminal (contact terminal) and a sense terminal (contact terminal) held by a probe card (first card) to come into contact with an electrode terminal of a semiconductor wafer. In the step of performing the electrical test, the contact portions of the force terminal and the sense terminal move in a direction away from each other after coming into contact with the first electrode terminal.

A method of determining a minimum permissible tip diameter of probing needles of a probe card for wafer probing is described. The method includes performing a plurality of contact procedures of at least one probing needle to a plurality of bonding pads on a wafer. The plurality of contact procedures is performed at different stress applied by the at least one probing needle to the bonding pads. A chart of indentation depths of the plurality of bonding pads caused by the contact procedures at different stress is determined. A set of calibration coefficients based on the chart is determined, wherein the set of calibration coefficients allows to compute a predicted indentation depth as a function of stress. The minimum permissible probing needle tip diameter is determined based on an evaluation of the function.

A printed circuit board according to various embodiments of the disclosure includes a plurality of layers in which at least one opening is formed and at least one antenna included in at least one layer among the plurality of layers, and the at least one opening is located within a specified distance from the at least one antenna and is formed through at least one of the plurality of layers.

A carbon nanomaterial functionalized needle tip is modified with a low work function material. The needle tip is formed by combining a carbon nanomaterial with a material of a needle tip through a covalent bond. The interior or outer surface of the carbon nanomaterial is modified with a low work function material. The material of the needle tip is a metal which can be any of tungsten, iron, cobalt, nickel, and titanium. The carbon nanomaterial can be carbon nanocone or carbon nanotube. The tip of the carbon nanomaterial has the same orientation as the metal needle tip. The low work function material can be selected from metals, metal carbides, metal oxides, borides, nitrides, and endohedral metallofullerene. The carbon nanomaterial functionalized needle tip has a lower electron emission barrier, and can effectively reduce the electric field intensity required for electron emission, and improve the emission current and emission efficiency.