G01R1/0675

Probe socket
11333680 · 2022-05-17 · ·

A probe socket for inspecting electric characteristics of an object to be tested. The probe socket includes a plurality of power pins for applying power to the object to be tested, a plurality of ground pins arranged in parallel with the power pins, a support block for accommodating and supporting the plurality of power pins or ground pins in parallel, and a conductive plate arranged inside the support block in a direction transverse to lengthwise directions of the power pin and the ground pin and having at least one of a power connection pattern for electrically connecting the plurality of power pins in common and a ground connection pattern for electrically connecting the plurality of ground pins in common.

Silicon probe for millimeter-wave and terahertz measurement and characterization

A probe includes a first rod having a first axis and a second rod having a second axis. A first end of the first rod is connected to a first end of the second rod to form an angle that maintains a “total internal reflection” effect for waves propagating through the probe. A second end of the second rod includes a prong facilitating attachment of the probe to a housing block. The first axis and the second axis define a plane. A second end of the first rod includes a tapered face formed perpendicular to the plane. The tapered face is sufficiently flat to make planar contact with a portion of a component under study. A support is formed in the plane and connected to the second rod. A second end of the support includes a connector to facilitate attachment of the probe to the housing block.

Spring probe

Disclosed is a spring probe, which comprises a needle tube, a needle with a tail end clamped in the needle tube and capable of moving axially along the needle tube, and a spring arranged between the front end of the needle and the inner bottom of the needle tube and applying thrust to the needle. The open end of the needle tube is circumferentially provided with a plurality of elastic sheets with elasticity. The inner sides of the elastic sheets are provided with first flanges for preventing the needle from separating from the needle tube. The first flanges are pressed against the outer wall of the needle under the action of the elastic force of the elastic sheets. The outer wall of the tail end of the needle head is provided with a second flange which can abut against the first flanges under the action of the spring.

ANALYSIS DEVICE AND IMAGE GENERATION METHOD
20220026465 · 2022-01-27 ·

An analysis device analyzes inspection results of an inspection object which includes inspection target devices having respective electrodes on which needle marks are formed. The analysis device includes a display part for displaying an image, and an image generation part for generating an image to be displayed on the display part. The image generation part generates an analysis image based on information on inspection results with respect to the needle marks. The analysis image includes a needle mark scatter plot image showing positions of the needle marks with respect to the electrodes in each inspection target device in an overlapped manner, an inspection object map image showing a surface of the inspection object and showing needle mark inspection results with respect to the inspection target devices, and a captured image of the electrodes. Display contents of the images are linked with each other.

INSPECTION JIG, INSPECTION DEVICE, AND CONTACT TERMINAL
20210364553 · 2021-11-25 ·

When a load necessary for inspection is applied to a cylindrical body in the axial direction thereof, an end of the first bar-like main body is located closer to the other end side of the cylindrical body than one end of a support portion in a support member that supports the body portion, an end of the second bar-like main body is located closer to one end side of the cylindrical body than the other end of the support portion, the body portion is located in the entire portion where the support portion is located, and a radial distance between the outer peripheral surface of the axial central portion of at least one of the first spring portion and the second spring portion and the support member is larger than the distance between the body portion and the support portion.

PROBE AND ELASTIC STRUCTURE THEREOF
20230314473 · 2023-10-05 ·

The present disclosure provides a probe and an elastic structure thereof. The probe includes: a first end portion, a second end portion and a plurality of elastic units. The elastic units are disposed between the first end portion and the second portion. Each elastic unit includes a first supporting element and a second supporting element, wherein the first supporting element and the second supporting element are at opposite sides of an axis, and the axis extends along a length of the probe.

PROBE CARD DEVICE AND SPRING-LIKE PROBE

A probe card device and a spring-like probe are provided. The spring-like probe defines a longitudinal direction and a separation plane that is parallel to the longitudinal direction, and includes a fixing end portion, a testing end portion, and two stroke arms that are arranged between the fixing end portion and the testing end portion. The two stroke arms are spaced apart from each other and are respectively located at two opposite sides of the separation plane. Each of the two stroke arms is in a curved shape. Two projection regions defined by orthogonally projecting the two stroke arms onto the separation plane have at least one intersection point. In a cross section of the two stroke arms perpendicular to the longitudinal direction, an area of any one of the two stroke arms is 95% to 105% of an area of another one of the two stroke arms.

Device and Method for Measuring Thickness of Dielectric Layer in Circuit Board
20220221262 · 2022-07-14 ·

A method for measuring thickness of dielectric layer in circuit board includes the following steps: First, circuit board including dielectric layer and circuit layers is provided. The dielectric layer is between the circuit layers, and the circuit board further includes test area including test pattern and through hole. The test pattern includes first conductor and second conductors. The distance between the side of the through hole and the second conductor is less than the distance between the side of the through hole and the first conductor. Next, measuring device including conductive pin and sensing element is provided. Next, the conductive pin is powered, and one end of the conductive pin is electrically connected to the second conductor. Next, the sensing element is moved along the through hole to obtain sensing curve, and the thickness of the dielectric layer is calculated via variations of the sensing curve.

Probe card device and spring-like probe

A probe card device and a spring-like probe are provided. The spring-like probe defines a longitudinal direction and a separation plane that is parallel to the longitudinal direction, and includes a fixing end portion, a testing end portion, and two stroke arms that are arranged between the fixing end portion and the testing end portion. The two stroke arms are spaced apart from each other and are respectively located at two opposite sides of the separation plane. Each of the two stroke arms is in a curved shape. Two projection regions defined by orthogonally projecting the two stroke arms onto the separation plane have at least one intersection point. In a cross section of the two stroke arms perpendicular to the longitudinal direction, an area of any one of the two stroke arms is 95% to 105% of an area of another one of the two stroke arms.

Device and method for measuring thickness of dielectric layer in circuit board

A method for measuring thickness of dielectric layer in circuit board includes the following steps: First, circuit board including dielectric layer and circuit layers is provided. The dielectric layer is between the circuit layers, and the circuit board further includes test area including test pattern and through hole. The test pattern includes first conductor and second conductors. The distance between the side of the through hole and the second conductor is less than the distance between the side of the through hole and the first conductor. Next, measuring device including conductive pin and sensing element is provided. Next, the conductive pin is powered, and one end of the conductive pin is electrically connected to the second conductor. Next, the sensing element is moved along the through hole to obtain sensing curve, and the thickness of the dielectric layer is calculated via variations of the sensing curve.