A system for testing an integrated-circuit wafer, the system including a probe card having a probe needle and a probe body enclosing a pressure chamber. The probe body includes a unitary sidewall, a first end cap substantially closing a first end of the probe body, except for an outlet passage in the first end cap, and an inlet passage configured to introduce compressed gas into the pressure chamber. The probe needle is within the pressure chamber and is supported by the probe body. A free end of the probe needle extends through the outlet passage. The ends of the probe needle are separated by a first bend in the probe needle, which has a center of curvature that is located between the probe needle and a longitudinal centerline of the unitary sidewall. Methods of using a probe card are also disclosed.

A probe has a substantially bar shape, and includes a tip end, a base end, and a body portion that is located between the tip end and the base end and has a thickness in a thickness direction orthogonal to an axial direction of the substantially bar shape thinner than the tip end. The body portion includes a slope surface that is continuous with the tip end and is inclined with respect to the axial direction in a direction in which the thickness becomes gradually thinner with increasing distance from the tip end. A first region having a surface shape that bulges outward is provided in at least a part of the slope surface.

A test system includes a semiconductor die and an integrated optical/electrical probe card. Electrical, optical, and optoelectronic devices reside in the semiconductor die. Electrical pads in the semiconductor die connect to the electrical and optoelectronic devices. Grating couplers in the semiconductor die connect to the optical device and optoelectronic devices. The electrical pads and grating couplers are interspersed in substantially a single line in the semiconductor die. The integrated optical/electrical probe card interfaces with the electrical pads by electrical needles, and concurrently interfaces with the grating couplers by optical fibers.

A test system includes a semiconductor die and an integrated optical/electrical probe card. Electrical, optical, and optoelectronic devices reside in the semiconductor die. Electrical pads in the semiconductor die connect to the electrical and optoelectronic devices. Grating couplers in the semiconductor die connect to the optical device and optoelectronic devices. The electrical pads and grating couplers are interspersed in substantially a single line in the semiconductor die. The integrated optical/electrical probe card interfaces with the electrical pads by electrical needles, and concurrently interfaces with the grating couplers by optical fibers.

The contact probe comprises a barrel 50, an inspection device side terminal 60, a test board side terminal 70, and a spring 80 disposed in a state of being in contact with the test board side terminal 70 and the inspection device side terminal 60, the test board side terminal 70 includes a stop portion 74 that can abut on the caulked portion 52 in the barrel 50 and a terminal body that projects from the other end 56 of the barrel 50, and the terminal body includes, in order from a tip end, a first shaft section 71, a second shaft section 72 having a diameter larger than a diameter of the first shaft section 71, and a third shaft section 73 having a diameter smaller than the diameter of the second shaft section 72 and having at least a part that can be housed in the barrel 50.

Disclosed is a spring probe, which comprises a needle tube, a needle with a tail end clamped in the needle tube and capable of moving axially along the needle tube, and a spring arranged between the front end of the needle and the inner bottom of the needle tube and applying thrust to the needle. The open end of the needle tube is circumferentially provided with a plurality of elastic sheets with elasticity. The inner sides of the elastic sheets are provided with first flanges for preventing the needle from separating from the needle tube. The first flanges are pressed against the outer wall of the needle under the action of the elastic force of the elastic sheets. The outer wall of the tail end of the needle head is provided with a second flange which can abut against the first flanges under the action of the spring.

A probe head and a conductive probe thereof are provided. The conductive probe includes a first long lateral surface and an opposite second long lateral surface. The first long lateral surface and the second long lateral surface define a central axis there-between. The conductive probe includes a middle segment, an upper connecting segment and a lower connecting segment respectively extending from the middle segment in two opposite directions, and an upper contacting segment and a lower contacting segment respectively extending from the upper and the lower connecting segments in two opposite directions. The upper connecting segment includes an extension extending from the first long lateral surface in a direction away from the central axis. The upper contacting segment includes a protrusion extending from the first long lateral surface in a direction away from the central axis, and the extension and the protrusion are spaced apart from each other.

A replaceable double-type probe pin is proposed. The double-type probe pin includes: a support having upper and lower coupling portions disposed at both ends of a supporting bar to face each other; an upper plunger detachably coupled to the upper coupling portion and being able to reciprocate up and down when coupled; a lower plunger detachably coupled to the lower coupling portion and being able to reciprocate up and down when coupled; and a coil spring disposed between the upper and lower plungers and pressing the upper and lower plungers in opposite directions.

An electrical connection device includes: a probe (10); and a probe head (20) including a top portion (21) allowing penetration of the probe (10), a bottom portion (23) disposed closer to a distal end portion than the top portion (21) and allowing penetration of the probe (10), and an upper guide portion (24) and a lower guide portion (25), which are disposed between the top portion (21) and the bottom portion (23) and allow penetration of the probe (10), wherein the probe (10) is held in a curved state between the top portion (21) and the bottom portion (23), the probe (10) buckles by contact of the distal end portion with an inspection object (2), and at least a continuous portion of the probe (10), which ranges from a portion where the probe (10) in a buckling state penetrates the bottom portion (23) to a portion where the probe (10) penetrates the lower guide portion (25), is a high-rigidity portion (101) made to have higher rigidity than a buckling portion of the probe (10).

A probe carrier of a probe card device includes an upper die unit, a lower die unit, a spacer sandwiched between the upper and lower die units, and an impedance adjusting member. The upper die unit includes a first die, a second die spaced apart from the first die, and a flexible board disposed on the second die and arranged away from the first die. The flexible board includes a plurality of penetrating holes and a circuit layer. The impedance adjusting member is disposed on the flexible board and is electrically coupled to the circuit layer. The circuit layer includes at least one plated wall arranged in at least one of the penetrating holes, a part of the flexible board having the at least one plated wall is separable from the second die by receiving an internal force.