Systems, devices, and methods for characterizing semiconductor devices and thin film materials. The device consists of multiple probe tips that are integrated on a single substrate. The layout of the probe tips could be designed to match specific patterns on a CMOS chip or sample. The device provides for detailed studies of transport mechanisms in thin film materials and semiconductor devices.

A plunger includes a conductive base layer, and a platinum group layer which is provided on the outside of the base layer and which contains a platinum group element as a main component. The plunger has the base layer as its base material, and has the platinum group layer on the outside of the base layer at the tip part to come into contact with an inspection object. A contact probe includes the plunger, and a spring which abuts on the plunger at an end part.

A probe assembly, adapted to test high-speed signal transmission lines of printed circuit boards, includes two pogo pins for providing high-frequency differential test signals, and both sides of the pogo pin include no metal layer (grounding layer). Experiments have found that when the two pogo pins test a to-be-tested object, the test signal will be coupled to the metal layers on both sides of the pogo pins to generate a radiation resonance, resulting in a loss of the test signal on a specific frequency band, and further reducing the effective bandwidth of the probe assembly. The metal layers on both sides of the pogo pins of the probe assembly are reduced, so that the foregoing radiation resonance phenomenon can be avoided.

A contact probe includes a first plunger including a tip portion and a base end portion, and a spring configured to bias the first plunger, in which a surface of the tip portion and a surface of the base end portion are formed of metal materials which are different from each other.

A probe card device includes a probe head including a plurality of pins, wherein each of the pins includes a body, a first metal layer formed on the body, and a second metal layer covering the first metal layer; a multi-layered flexible board electrically connected to the pins; a support plate, the multi-layered flexible board disposed on a first surface of the support plate; and a circuit board electrically connected to the multi-layered flexible board.

A semiconductor probe includes multiple metal layers. An oxide layer is disposed between each adjacent pair of the metal layer. A via for connecting at least one pair of the metal layers. At least one protection layer 150 is disposed at an external side of the metal layer.

An insulator applied in a probe base including a probe mounting hole, the insulator is a sheet structure having plural through holes, and the probe mounting hole is formed at the center of the insulator, and the probe mounting hole and the through hole penetrate from a first surface to a second surface of the insulator, and the regions of the first and second surfaces without the probe mounting hole and the through hole are coplanar. The probe base has a base body and at least a composite assembly, and the base body has at least a testing zone, and the composite assembly is installed in the testing zone and has at least a probe hole for installing a probe, and the insulator is installed into the probe hole.

It is described a contact probe for a testing head of an apparatus for testing electronic devices including a body essentially extended along a longitudinal direction between a contact tip and a contact head, that contact probe comprising at least one multilayer structure, in turn including a superposition of at least one inner layer or core and a first inner coating layer, and an outer coating layer that completely covers the multilayer structure and made of a material having a higher hardness than a material realizing the core.

The invention relates to a clad wire (1) for producing test needles or sliding contacts having a wire core (2) made of rhodium or a rhodium-based alloy, an inner cladding (3) made of copper or silver or aluminum or a copper-based alloy or a silver-based alloy or an aluminum-based alloy, wherein the inner cladding (3) covers or completely encloses the wire core (2) on at least two opposite sides, an adhesion-promoting layer (5) made of gold or a gold-based alloy, which is arranged between the wire core (2) and the inner cladding (3), and an outer cladding (4) made of a metal or a metal alloy having a greater hardness than the material of the inner cladding (3), wherein the outer cladding (4) encloses the inner cladding (3). The invention also relates to a method for producing a clad wire and to a test needle having at least one clad wire (1) or produced from a clad wire (1) and a test needle array having a plurality of test needles spaced apart from one another and a sliding contact having a plurality of clad wires (1) or produced from a clad wire (1).

The present disclosure provides a probe card device and a conductive probe thereof. The conductive probe includes a metallic pin, an outer electrode, and a dielectric layer. The metallic pin includes a middle segment, a first connecting segment and a second connecting segment respectively extending from two opposite ends of the middle segment, and a first contacting segment and a second contacting segment respectively extending from the first connecting segment and second contacting segment along two opposite directions away from the middle segment. At least part of the outer electrode corresponds in position to the middle segment and is arranged adjacent to the first connecting segment. The dielectric layer is sandwiched between and entirely separates the metallic pin and the outer electrode, so that the outer electrode, the dielectric layer, and the metallic pin are jointly configured to generate a capacitance effect.