A three-layer micro electro mechanical system (MEMS) spring pin includes a lower-layer spring pin in which a lower-layer wave is disposed between and connected to a lower-layer top plunger and a lower-layer bottom plunger, an upper-layer spring pin in which an upper-layer wave is disposed between and connected to an upper-layer top plunger and an upper-layer bottom plunger, a middle-layer top tip interposed between the upper-layer top plunger and the lower-layer top plunger, and a middle-layer bottom tip interposed between the upper-layer bottom plunger and the lower-layer bottom plunger. According to the above-described structure, effects are expected in which bending is prevented, a stroke is stabilized due to the multi-layer spring, and contact characteristics are enhanced due to the multi-layer plunger.

The present disclosure provides a probe apparatus, including a circuit board, a flexible interconnect substrate, at least one probe, and a supporting element. The circuit board includes tester contacts. The flexible interconnect substrate has a first surface and an opposing second surface. The flexible interconnect substrate is electrically coupled to the circuit board. The probe is disposed in the first surface of the flexible interconnect substrate. The probe is electrically coupled to the flexible interconnect substrate, and the probe is configured to electrically contact a device under test. The supporting element is adhered to the second surface of the flexible interconnect substrate. The supporting element is disposed between the flexible interconnect substrate and the circuit board.

A test probe card includes a substrate, a plurality of test needles, and a fixing layer. The substrate includes a trench formed at a surface of the substrate. Each of the test needles includes a first end positioned in the trench and a second end, opposite to the first end, protruding from the trench. The fixing layer is formed in the trench to fix the test needles to the trench. The fixing layer includes a resin layer having a ceramic powder.

A probe card in an automated test equipment (ATE) is disclosed. The probe card may be a portion of a vertical-type probe card assembly in which pads on a circuit board are contacted by probe pins, with vertical vias in the circuit board interconnecting various conductive elements. Disclosed herein is a transposed via arrangement within a circuit board for a probe card, where adjacent vias are offset towards each other such that the inductance between the adjacent vias may be reduced to provide a desirable impedance during high frequency signal and/or power transmission.

A metal probe structure and a method for fabricating the same are provided. The metal probe structure includes a multi-layer substrate, a first flexible dielectric layer, a second flexible dielectric layer, and a plurality of first metal components. The first flexible dielectric layer is disposed over the multi-layer substrate and has a conductive layer formed thereover. The second flexible dielectric layer is disposed over the first flexible dielectric layer to cover the conductive layer. The plurality of first metal components is disposed over the conductive layer and partially in the second flexible dielectric layer to serve as a metal probe.

An electrical connection device includes: a wiring board in which lands are arranged on a main surface; and probes. Each of the probes has a distal end portion that contacts an object to be measured and a proximal end portion that contacts the land. A material of a surface film of the proximal end portion, which contacts the land, is a metal material different in composition from a material of the land that contacts the surface film.

An electrical contact and connector (also known as elastic electrical contact and system) are disclosed herein for testing semiconductor devices such as integrated circuit (IC) packages, particular high density IC packages. The elastic electrical contact comprises a plurality of interlaced or interwove and unsupported conductive wires. The electrical contact system comprises the elastic electrical contacts and a carrier having a plurality of through openings. The elastic electrical contacts are placed in their respective through openings with both ends exposed from the through openings. Method of making and using the elastic electrical contact are also provided.

An integrated circuit (IC) device tester includes contact probes. A liner is formed upon the contact probes. The liner includes a matrix of metal particles and glass particles. The metal particles of the liner allow the contact probe to pass an electrical current through the liner. The glass particles of the liner prevent C4 material from adhering to the liner.

Systems, devices, and methods for characterizing semiconductor devices and thin film materials. The device consists of multiple probe tips that are integrated on a single substrate. The layout of the probe tips could be designed to match specific patterns on a CMOS chip or sample. The device provides for detailed studies of transport mechanisms in thin film materials and semiconductor devices.

A cylindrical body is formed of a conductive member provided with a spiral spring portion. Further, the cylindrical body includes a Ni metal layer and a NiW alloy layer containing W, and an end portion of the NiW alloy layer protrudes to an outer side of the Ni metal layer.