A probe card device includes a plurality of pins; a thin film substrate including a plurality of first thin film connecting points and a plurality of second thin film connecting points, wherein at least one of the first thin film connecting points is electrically connected to at least one the second thin film connecting points, and a pitch of any two adjacent ones of the first film connecting points is less than a pitch of any two adjacent ones of the second film connecting points; and a circuit board including a plurality of first circuit board connecting points, wherein at least one of the second thin film connecting points is electrically connected to at least one of the first circuit board connecting points. The probe card device can enhance a layout function and a support function at the same time.

Provided is a contact pin comprising: a hollow first plunger that includes a first contact portion provided on one end side in a first direction and a first enlarged portion which is enlarged in a second direction intersecting the first direction; a second plunger, the one end of which is inserted into the first plunger and that includes a second contact portion provided on the other end side in the first direction and a second enlarged portion provided in a protruding portion protruding from the first plunger so as to be enlarged in the second direction; and a spring provided between the first and second plungers so as to surround the first and second plungers, wherein the first enlarged portion forms a curve shape to bulge outward.

A probe guide plate used for a semiconductor inspection apparatus that inputs and outputs an electrical signal for inspecting an object via a probe needle, the probe guide plate includes a silicon substrate provided with a through hole that penetrates the silicon substrate from one surface to another surface through which the probe needle is inserted, the through hole including a first tapered portion provided at an end portion at the one surface side such that the hole size of which increases as it approaches the one surface, and a second tapered portion provided at an end portion at the other surface side such that the hole size of which increases as it approaches the other surface; and a silicon oxide film formed on an inner wall surface of the through hole including the first tapered portion and the second tapered portion.

The present disclosure provides a jig for manufacturing probe card for semiconductor inspection, a probe alignment system comprising same, and a probe card manufactured thereby.

The present invention provides a novel method of constructing a coax spring-pin socket that furnishes better performance and is easier to manufacture in volume using common dielectrics and copper plating. This is accomplished by, in application, a lamination of PCB dielectric layers. This dielectric block is then drilled, plated, etched, and drilled in steps for the construction of a coaxial structure for the signal pins, and a ground structure for ground pins. This design process that can be quickly adjusted and customized for each design.

According to the present invention, a semiconductor inspection device includes a control section that outputs a signal to inspect a semiconductor wafer, a contact section comprising contact terminals connected to the control section, a probe card that can simultaneously contact a plurality of semiconductor chips formed on the semiconductor wafer and a drive section, wherein the contact terminals can contact some of electrode pads provided for the probe card and the drive section drives the contact section so as to switch electrode pads in contact with the contact terminals.

A testing system for electrical interconnects having a removable device under test printed circuit board (DUT PCB) that electrically connects with the electrical testing components of the system. A removable top plate is placed on top of the DUT PCB and is locked in place by a plurality of locking posts that selectively connect to cam surfaces in the top plate that pull the top plate down sandwiching the DUT PCB between the top plate and the electrical testing components of the system. An actuator is also presented that presses the device under test into the electrical interconnect at increments where tests are performed on one, some or all of the contact points of the electrical interconnect. This information is then analyzed and graphed to assist with determine the optimum force and/or height to use during actual use.

A wafer testing probe card includes a printed circuit board, a flexible circuit board, an elastic piece, and a probe unit. The flexible circuit board is electrically connected to the printed circuit board. The elastic piece is disposed between the printed circuit board and the flexible circuit board. The probe unit includes a probe head and a plurality of probes. The probe head is fixed on the printed circuit board and has a plurality of through holes. The probes respectively pass through the through holes and move up and down relative to the probe head.

A manufacturing method of contact probes for a testing head comprises the steps of:—providing a substrate made of a conductive material; and—defining at least one contact probe by laser cutting the substrate. The method further includes at least one post-processing fine definition step of at least one end portion of the contact probe, that follows the step of defining the contact probe by laser cutting, the end portion being a portion including a contact tip or a contact head of the contact probe. The fine definition step does not involve a laser processing and includes geometrically defining the end portion of the contact probe with at least a substantially micrometric precision.

A manufacturing method of a semi-finished product that includes a plurality of contact for a testing head of electronic devices comprises the steps of: providing a substrate made of a conductive material; and defining each contact probe by removing material from the substrate, each contact probes being anchored to the substrate by at least one bridge of material. The step of defining the contact probes includes a step of laser cutting, in correspondence with a contour of the contact probes and of that at least one bridge of material.