An electrical contact assembly that uses an elastomer strip for each row of individual contacts. Each contact comprises a rigid bottom pin and a flexible top pin with a pair of arms which extend over and slide along sloped surfaces of the bottom contact. The elastomer strip is located between rows of the bottom and top pins. A bottom socket housing is provided with grooves which receive each elastomer strip. A row of top pins is then placed over each elastomer strip, and through ducts in the bottom socket housing. Bottom pins are then snapped into place in between the pair of arms.

A probe array having decoupled electrical and mechanical design constraints on the probes is provided. Each probe is a two-part structure with the two parts able to stay in electrical contact with each other as the parts slide up and down with respect to each other. The probes are disposed in through holes of an elastic matrix, each probe having its corresponding hole. The probes engage with the elastic matrix such that a restoring force in response to vertical probe compression is provided by the elastic matrix. With this approach, electrical and mechanical design are much more decoupled than in conventional spring probe design. The elastic matrix provides the mechanical compliance and restoring force, while the parts of the probe determine its current carrying capacity and electrical bandwidth.

A device for processing a multiplicity of semiconductor chips in a wafer assemblage includes an electrically conductive carrier for contacting rear contacts of the semiconductor chips, an electrically conductive film for contacting front contacts of the semiconductor chips that are situated opposite the rear contacts, and a squeegee, which is displaceable relative to the film and is configured to press a region of the film in the direction toward the carrier.

A thin-film probe card and a test module thereof are provided. The test module includes a carrying unit, a plurality of vertical probes fixed in position by the carrying unit, an elastic cushion disposed on the carrying unit, and a thin sheet. The thin sheet includes a carrier partially disposed on the elastic cushion, a plurality of signal circuits disposed on the carrier, and a plurality of electrically conductive protrusions that are respectively formed on the signal circuits. An end of the vertical probes is arranged at an inner side of the electrically conductive protrusions and is coplanar with free ends of the electrically conductive protrusions.

A probe card device includes a printed circuit board (PCB), a space transformer, and a high-speed flexible printed circuit (FPC). The PCB includes a plurality of first connecting bodies coupled to a tester, and a plurality of second connecting bodies. The space transformer includes a plurality of connecting bodies disposed on a first surface of the space transformer and coupled to the plurality of second connecting bodies of the printed circuit board, a plurality of general contact pads disposed on a second surface of the space transformer and contacted with a plurality of first probes, and a plurality of high-speed contact pads disposed on the second surface of the space transformer and contacted with a plurality of second probes. The high-speed FPC has a first connecting terminal coupled to the tester, and a second connecting terminal coupled to the plurality of high-speed contact pads.

A method for electrically contacting components in a semiconductor wafer includes providing a flexible board comprising a first main surface on which a plurality of conductor tracks are arranged, positioning the board with respect to a semiconductor wafer such that the first main surface of the board faces the semiconductor wafer, the board is bent and pressed onto the semiconductor wafer in such a way that contact elements of a plurality of components arranged in a row in the semiconductor wafer come into contact with the conductor tracks, and electrical signals are applied to the components through the conductor tracks.

A probe card device and a disposable adjustment film thereof are provided. The disposable adjustment film is integrally formed as a single one-piece structure, and includes a probe hole and a plurality of first slots that are parallel to each other. The disposable adjustment film defines two predetermined lines respectively extending from two opposite lateral edges thereof to the probe hole. The two predetermined lines respectively extend across the first slots. In a plane that the disposable adjustment film is located thereon, when the disposable adjustment film is applied with forces that act in opposite directions and that are parallel to any one of the first slots, the disposable adjustment film is broken into two abandoned films along the two predetermined lines.

This disclosure describes an elastic multi-contact probe that includes conductive strips each of which comprises a conductive elastomer; dielectric strips formed on a back surface of a respective conductive strip; and a layer of a thermoplastic formed on back surfaces of the dielectric strips. The disclosure also describes a method that includes measuring a first I-V curve between a pair of inner probes of the an elastic multi-contact probe based on a first current applied to a pair of outer probes; determining a first slope of a linear region of the first I-V curve; measuring a second I-V curve between the pair of inner probes based on a second current applied to the pair of inner probes; determining a second slope of a linear region of the second I-V curve; and calculating a sheet resistance and a contact resistivity of the semiconductor material based on the first and second slopes.

A probe card for a test equipment of electronic devices includes a flexible membrane configured to carry high frequency signals between a device under test and a support plate. The flexible membrane is connected to the support plate through a peripheral zone, and a damping structure is arranged between the support plate and the flexible membrane. A plurality of micro contact probes include a body extending between a first end and a second end, and the second end is configured to abut onto contact pads of the device under test, and the damping structure and the first ends of the micro contact probes are in contact with opposite faces of a same contact zone of the flexible membrane. The flexible membrane includes at least one weakening zone arranged between the contact zone and the peripheral zone.

An electrical characteristics inspection tool capable of inspecting electrical characteristics even when an oxide film is formed on pads or bumps formed at a fine pitch. The electrical characteristics inspection tool includes: a flexible sheet; a through electrode having a recess that is recessed from one surface of the flexible sheet; and a conductive elastomer disposed in the recess of the through electrode. Electrical characteristics can be inspected even when an oxide film is formed on pads or bumps of an inspection object by bringing the conductive elastomer into contact with the pads or bumps and bringing a probe into contact with the through electrode since the conductive particles in the conductive elastomer break through the oxide film.