Embodiments herein relate to a test probe. The test probe may have a first plurality of beams and a second plurality of beams. An intermediate substrate may be positioned between the first plurality of beams and the second plurality of beams. In embodiments, both the first and second plurality of beams may be angled. Other embodiments may be described or claimed.

An elastic probe element, an elastic probe assembly, and a testing device are provided. The testing device includes a substrate, a guiding member, and multiple ones of the elastic probe elements. The guiding member has a plurality of through holes for the multiple ones of the elastic probe elements correspondingly passing through. The elastic probe element includes a main body, a first contact segment, and a second contact segment that are integrally formed. The main body has a plurality of needle structures, and any two adjacent needle structures have a gap arranged therebetween. The needle structures are connected to each other through a first connection part and a second connection part arranged at a first end and a second end of the elastic probe element, respectively. The first contact segment is arranged at the first end. The second contact segment is arranged at the second end.

A contact element system has a plurality of pin-type or needle-type and electrically conductive contact elements of equal length, which each have two end regions for electrically contacting contact positions and each have an intermediate region under longitudinal loading, overcoming their bending rigidity, and are designed with lamellar sections in the intermediate region such that they have at least two strips which are substantially parallel to each other and run at a distance from one another. At least two of the contact elements have different cross sectional surfaces and differently formed strips in the intermediate region, wherein the forms of the strips are chosen such that the contact elements have the same or approximately the same bending rigidity.

A probe card device and a self-aligned probe are provided. The self-aligned probe includes a fixing end portion configured to be abutted against a space transformer, a testing end portion configured to detachably abut against a device under test (DUT), a first connection portion connected to the fixing end portion, a second connection portion connected to the testing end portion, and an arced portion that connects the first connection portion and the second connection portion. The fixing end portion and the testing end portion jointly define a reference line passing there-through. The first connection portion has an aligned protrusion, and a maximum distance between the arced portion and the reference line is greater than 75 μm and is less than 150 μm.

A probe card and a probe module thereof are provided. The probe card includes a first strengthening board, a fixed frame, a probe module, and a slidable frame. The first strengthening board includes a top surface, a bottom surface, and a mounting hole. An inner wall of the mounting hole is formed with an inner flange. The fixed frame is disposed on the top surface of the first strengthening board and surrounds the mounting hole. The probe module is disposed in the mounting hole and includes an outer flange including a physical region and multiple gap regions. The physical region abuts against the inner flange of the first strengthening board. The slidable frame is disposed on an inner wall of the fixed frame and is slidable between a released position and a fixed position. Multiple pressing portions are disposed on an inner wall of the slidable frame.

A probe card device and a transmission structure are provided. The transmission structure includes a supporting layer, a plurality of metal conductors spaced apart from each other and slantingly inserted into the supporting layer, and an insulating resilient layer formed on the supporting layer. Each of the metal conductors includes a positioning segment held in the supporting layer, a connecting segment and an embedded segment respectively extending from two ends of the positioning segment, and an exposed segment extending from the embedded segment. Each of the embedded segments is embedded and fixed in the insulating resilient layer, and each of the exposed segments protrudes from the insulating resilient layer. When any one of the exposed segments is pressed by an external force, the insulating resilient layer is configured to absorb the external force through the corresponding embedded segment so as to have a deformation providing a stroke distance.

A method for retrieving a probe pin includes following operations. A probe head is received in a carrier. The probe head includes an upper die, a lower die, and at least a probe pin extending in a direction from the lower die to the upper die. A first bending delta between a probe tip of the probe pin and a pin tip of the probe pin is measured. The probe pin is bended by a bending fixture when the first bending delta is greater than a value to obtain a second bending delta between the pin tip and the pin head. The probe pin is pushed in the direction from the lower die tow the upper die by a plate. The probe pin is picked from the probe head by an arm.

Vertical transmission line probes having alternating capacitive and inductive sections are provided. These alternating sections can be designed to provide a desired transmission line impedance (e.g., between 10 and 100 Ohms, preferably 50 Ohms). Probe flexure in operation is mainly in the inductive sections, advantageously reducing flexure stresses on the dielectrics in the capacitive sections.

A vertical probe assembly having a resilient compliant probe, a first guide plate, a second guide plate, and a third guide plate is disclosed. The probe may include an upper portion, a lower portion, and a stopper structure positioned between the upper and lower portions of the first probe. The first, second, and third guide plates may be formed from a non-conductive substrate and separated by one or more spacers. The first, second, and third guide plates may also include a first, second, and third hole, respectively. The first, second, and third holes may be vertically aligned. The probe may be positioned within the first, second, and third holes such that the upper portion extends through the first hole, the lower portion extends through the second and third holes, and the stopper structure contacts a surface of the second guide plate that faces the first guide plate.

A coaxial wire interconnect architecture and associated methods are described. In one example, the coaxial wire interconnect architecture is used in a test socket interconnect array. Flexible bends are formed in one or more of the coaxial wire interconnects to provide compliant connections to an electronic device during testing.