The disclosure describes a probe card assembly for nondestructive integrated circuit testing. The probe card assembly includes an outer gimbal bearing with a tapered bearing surface being mounted on a top surface of a printed circuit board. The probe card assembly further includes an inner gimbal bearing with a spherical bearing surface which contacts the tapered bearing surface of the outer gimbal bearing at a single point of contact about a circumference thereof. The probe card assembly further includes a spring plate mounted to the outer gimbal bearing, providing a downward force to a substrate.

A probe unit according to the present invention is suitable for allowing a large current to flow. In the probe unit that accommodates a plurality of contact probes for electrically connecting an inspection target object and a signal processing device used to output an inspection signal, both ends of a large current probe (3) are electrically connected to electrodes of a contact target object, and a large current is made to flow via a metal block (50) that comes into contact with both end portions of the large current probe (3).

OBJECT

To improve the strength of a probe guide and improve the abrasion resistance of the probe guide.

MEANS FOR SETTLEMENT

A guide plate 20 is formed of a silicon plate 22 having guide holes 23 respectively adapted to support contact probes 13, the inner walls of the guide holes 23 include a guide film 25 formed on the inner wall surfaces of corresponding penetration-processed holes 24 of the silicon plate 22, the cross-sectional areas of the penetration-processed holes 24 gradually increase toward a first surface of the silicon plate 22, and the film thickness of the guide film 25 gradually increases toward the first surface of the silicon plate 22. By employing such a configuration, as compared with the tilts of the inner wall surfaces of the penetration-processed holes 24, the tilts of the inner wall surfaces of the guide holes 23 can be suppressed, and the strength of the silicon plate 20 can be improved. Accordingly, the abrasion resistance of a probe guide 100 can be improved.

A probe head comprises a plate-shaped support including respective pluralities of guide holes, a plurality of contact probes being slidingly housed in the respective pluralities of guide holes and including at least a first group of contact probes being apt to carry only one type of signal chosen between ground and power supply signals, a conductive portion realized on the support and including a plurality of the guide holes housing the contact probes of the first group, and at least one filtering capacitor having at least one capacitor plate being electrically connected to the conductive portion, the conductive portion electrically connecting the contact probes of the first group.

An inspection jig may include a frame, an electrode body provided with electrodes, conductive contactors having a wire shape, a support block having a facing surface opposite to which an inspection circuit board is disposed, guiding one ends of the contactors to the inspection points of the circuit board mounted on the facing surface, guiding other ends to the electrodes, and configured to move relatively to the frame in a moving direction which crosses the facing surface, biasing parts configured to bias the support block in a direction moving away from the electrode body and close to the circuit board, and a regulating plate disposed between the support block and the frame so as to extend in a direction from the support block to the frame, having elasticity, and having regulation of deformation in a first direction which is parallel to the facing surface and which crosses the extending direction.

A probe for testing a semiconductor device includes a post having a plate shape and connected to a test substrate. A beam has a first end connected to the post. A tip structure is connected to a second end of the beam. The post includes a front surface having a normal line extending in a first direction. A back surface is located opposite to the front surface. Bumps are disposed on the front surface and are spaced apart from each other. The beam extends in a second direction intersecting the first direction. Each of the bumps protrudes from the front surface in the first direction by a first length.

Provided are an inspection jig and an inspection apparatus in which a configuration for bending a plurality of contacts in the same direction can be simplified. The inspection jig includes a plurality of contacts each of which has a rod shape, a first support portion that supports the first end portion side of the plurality of contacts, and a second support portion that supports the second end portion side of the plurality of contacts. The first support portion includes a facing support plate that is disposed to face the second support portion in a manner separated from the second support portion and has a plurality of through holes through which the plurality of contacts are inserted, and a cross section of each of the through holes has an elliptical shape whose major axis extends in a predetermined specific direction along a plane direction of the facing support plate.

A system and method for disassembling a multiple contact probe head including a plurality of contact probes positioned by a first die at a first end of the plurality of probes and a second die at a second end of the plurality of probes, are provided. The system may include a manifold configured to sealingly receive an opposing side of the first die from the second die; and a vacuum source operatively coupled to the manifold to apply a vacuum to an interior of the manifold applying a force to the plurality of contact probes in position in the first die across. Where the probes include a paramagnetic material, a magnetic source may be employed to hold the probes during disassembly.

An electrical Kelvin contact assembly for testing IC testing apparatus that uses an assembly design that reduces the tolerance to a near negligible range. The assembly does not use any screws, dowel pins, adhesives or welding to fasten the electrical contacts to the housing. The design of the assembly uses rows of contacts with specially designed protrusions that sit snugly in openings located on three plate-like layers. These layers contain the contacts in the horizontal plane by securing the protrusions in the opening, as well as in the vertical plane by means of a sandwich between three separate layers. A second contact is slid into back slits formed by the three layers.

The present invention intends to suppress a contact probe from interfering with a guide plate to produce shavings. The present invention has stacked structure that sandwiches an intermediate metallic layer 12 between outer metallic layers 11 and 13, and includes: a contact part 2 that is brought into abutting with a test object; an elastic deformation part 4 that is elastically deformed so as to be curved in a predetermine direction of curvature N by compression force in the longer direction; and a fore end part 3 that is formed between the contact part 2 and the elastic deformation part 4 and supported by a through-hole 121 of a guide plate 120 so as to make the contact part 2 movable in the longer direction, in which side surfaces of the fore end part 3 formed in the direction of curvature N and a direction N′ opposite to the N of the elastic deformation part 4 are configured to include the three metallic layers 11 to 13, and on the side surfaces, the intermediate metallic layer 12 is configured to protrude relative to the outer metallic layers 11 and 13.