Provided is a probe device used for electrical inspection of a printed wiring board, the probe device including at least one probe group including a plurality of wire probes configured to be able to simultaneously abut against a wire provided on the printed wiring board and extending in a specified direction, the plurality of wire probes abutting against the wire along the direction and being electrically connected to each other.

An electric connection device includes: a probe (11); a probe head (12) that holds the probe (11); and an electrode substrate (13) on which an electrode pad (131) to be connected to a proximal end of the probe (11) is provided. The probe head (12) is provided with a guide pin (14) for alignment of the probe head (12) and the electrode substrate (13), and the electrode substrate (13) is provided with a guide hole group composed of a plurality of guide holes corresponding to the guide pin (14).

An electrical-test apparatus is provided, which includes a plurality of tester interconnect structures cantilevered from a first side of a substrate. A base may be coupled to a second side of the substrate via one or more interconnect layers. The tester interconnect structures may contact corresponding interconnect structures of a device under test (DUT). In an example, the substrate is laterally movable relative to the DUT along a plane of the substrate, upon contact between the tester interconnect structures and the interconnect structures of the DUT.

A semiconductor fabricating apparatus may include a probe card, a test head, a support and a chamber wall. The probe card may include a plurality of probing needles. The probe card may be installed at the test head. The support may be configured to receive a wafer including a plurality of test pads making contact with the probing needles. The chamber wall may be configured to receive the support. The chamber wall may define a chamber in which a probe test may be performed. At least one of the probe card and the support, the probe card and the test head, and the test head and the chamber wall may be combined with each other by a magnetic module.

A probe card device and a directivity probe thereof are provided. The directivity probe having an elongated shape includes a conductive pin and a ring-shaped insulator. The conductive pin includes a stroke segment and two end segments respectively extending from the stroke segment. The stroke segment has two broad side surfaces and two narrow side surfaces, and has only one transverse slot that is recessed in one of the two broad side surfaces and that extends from one of the two narrow side surfaces to the other narrow side surface. The transverse groove has a maximum depth that is 1%-10% of a maximum distance between the two broad side surfaces. The stroke segment of the directivity probe can be bent by applying a force to the two end segments, and an inflection point of the bent stroke segment is located in the transverse slot.

A probe card module including a probe card assembly and a strengthening structure is provided. The probe card assembly includes a first surface, a second surface opposite to the first surface, and a plurality of probes protruding from the first surface. The second surface includes a central zone and a peripheral zone surrounding the central zone. Projections of the probes on the second surface are located at the central zone. The strengthening structure is disposed on the second surface and includes two support bases which protrude from the peripheral zone and are away from each other, and the strengthening structure also includes an arc-shaped reinforcement assembly connected to the two support bases, where the arc-shaped reinforcement assembly protrudes toward and leans against the central zone.

A semiconductor device for testing a semiconductor wafer includes a circuit board, a probe disposed below the circuit board and facing the semiconductor wafer, an integrated substrate disposed between the circuit board and the probe, and signal-transmitting module disposed on the circuit board and next to the integrated substrate. The probe is electrically coupled to the circuit board through the integrated substrate, and the signal-transmitting module transmits a test signal to the probe through the integrated substrate and the circuit board to perform a test to the semiconductor wafer. Another semiconductor device including the integrated substrate and a manufacturing method thereof are provided.

Probe systems and methods are disclosed herein. The methods include directly measuring a distance between a first manipulated assembly and a second manipulated assembly, contacting first and second probes with first and second contact locations, providing a test signal to an electrical structure, and receiving a resultant signal from the electrical structure. The methods further include characterizing at least one of a probe system and the electrical structure based upon the distance. In one embodiment, the probe systems include a measurement device configured to directly measure a distance between a first manipulated assembly and a second manipulated assembly. In another embodiment, the probe systems include a probe head assembly including a platen, a manipulator operatively attached to the platen, a vector network analyzer (VNA) extender operatively attached to the manipulator, and a probe operatively attached to the VNA extender.

A wafer test probe system, probe card, and method to test back-to-back connected first and second transistors of a wafer. The probe card includes a waveform generator circuit and probe needles to couple the waveform generator circuit to provide a first pulse signal of a first polarity using a body diode of the first transistor to test the second transistor, and to provide a second pulse signal of a second polarity using a body diode of the second transistor to the test the first transistor. One example includes a resistor connected between the waveform generator circuit and one of the probe needles. The probe card includes a probe needle to connect a sense transistor of the wafer to the first transistor during wafer probe testing.

An automated test equipment for testing one or more DUTs comprises a test head and a DUT interface. The DUT interface comprises a plurality of blocks of spring-loaded pins, for example groups or fields of spring-loaded pins. For example, the DUT interface is configured for establishing an electronic signal path between the test head and a DUT board or load board, which holds the DUT or which provides a connection to the DUT. The automated test equipment is configured to allow for a variation of a distance between at least two blocks of spring-loaded pins.