A stand-alone active thermal interposer device for use in testing a system-in-package device under test (DUT), the active thermal interposer device includes a body layer having a first surface and a second surface, wherein the first surface is operable to be disposed adjacent to a cold plate, and a plurality of heating zones defined across a second surface of the body layer, the plurality of heating zones operable to be controlled by a thermal controller to selectively heat and maintain respective temperatures thereof, the plurality of heating zones operable to heat a plurality of areas of the DUT when the second surface of the body layer is disposed adjacent to an interface surface of the DUT during testing of the DUT.

A method of controlling a component handler includes acquiring and using calibration data. The component handler includes a calibrated actuator comprising a stationary part, a movable part, coil(s), and an actuating member, and a component holder comprising a distal end and an elastic member. The component holder is actuable from a resting to an extended position by the actuating member and in reverse by the elastic member. The calibration data is acquired by: bringing the actuating member into contact with an actuable portion of the component holder, moving the component holder in a position within the resting and extended position, measuring a required current in the coil(s) to maintain or move the component holder in the position, and determining the calibration data from the current, which is used to control the actuator such that the distal end applies a predetermined force on the component in a pick-up position.

The present invention relates to a system level test device for memory. A memory module system level tester device according to the present invention makes the motherboard and the memory modules be in contact with each other by using the test tray, thereby minimizing a time required for attaching and detaching the memory modules and omitting an additional configuration for attaching and detaching the memory modules. Accordingly, space limitations can be minimized, and as a result, test units can be arranged in two or more stages in the vertical direction to configure a compact layout to thereby increase space efficiency.

A mechanical arm includes a body and an operating arm. The operating arm includes a connector connected to the body, as well as a first adapting part and a second adapting part which are connected to the connector. The first adapting part is configured to mount a first operating mechanism for opening and closing the socket. The second adapting part is configured to mount a second operating mechanism for grabbing and releasing a semiconductor device. After the first adapting part drives the first operating mechanism to open the socket, the second adapting part is able to drive the second operating mechanism to put the semiconductor device into the socket or take the semiconductor device out from the socket.

An inspection apparatus includes: an acquisition part configured to acquire first coordinate information indicating a position of an inspection object on a stage and a plurality of pieces of second coordinate information indicating positions of a plurality of temperature sensors on the stage when performing an inspection of the inspection object; a calculation part configured to calculate a Mahalanobis distance between a position specified by an average vector of the first coordinate information and the positions of the plurality of temperature sensors; a selection part configured to select at least one temperature sensor including a temperature sensor having a smallest Mahalanobis distance, among the plurality of temperature sensors; and a controller configured to control a temperature of the inspection object using temperature data measured by the selected at least one temperature sensor.

A testing apparatus comprises a test interface board comprising a plurality of socket interface boards, wherein each socket interface board comprises: a) an open socket to hold a DUT; b) a discrete active thermal interposer comprising thermal properties and operable to make thermal contact with the DUT; c) a superstructure operable to contain the discrete active thermal interposer; and d) an actuation mechanism operable to provide a contact force to bring the discrete active thermal interposer in contact with the DUT.

A tester apparatus is described. Various components contribute to the functionality of the tester apparatus, including an insertion and removal apparatus, thermal posts, independent gimbaling, the inclusion of a photo detector, a combination of thermal control methods, a detect circuitry in a socket lid, through posts with stand-offs, and a voltage retargeting.

According to one aspect of the present disclosure, a transport system includes a mobile cassette unit capable of storing a plurality of structures and supplying the structures to an inspection unit, wherein each of the structures includes a substrate on which a plurality of devices are formed, and an interconnect member including a contact section that electrically contacts an electrode of the plurality of devices.

An electronic component handling apparatus, for handling a DUT having a temperature detection circuit and pressing the DUT against a socket electrically connected to a tester testing the DUT, includes: a temperature adjuster adjusting a temperature of the DUT; a first calculator calculating the temperature of the DUT based on a detection result of the temperature detection circuit; a temperature controller controlling the temperature adjuster; and a first receiver receiving a first signal output from the tester, a temperature control including a first temperature control based on the temperature of the DUT calculated by the first calculator and a second temperature control, and the temperature controller switching the temperature control of the DUT from the first temperature control to the second temperature control when the first receiver receives the first signal after the temperature controller starts the first temperature control.

A chip testing device and a chip testing system are provided. The chip testing system includes a chip testing device and a plurality of environment control apparatuses. A plurality of electrical connection sockets are disposed on one side of a circuit board, and a plurality of testing modules are disposed on another side of the circuit board. A first fixing member and a second fixing member fix the electrical connection sockets on one side of the circuit board, and no screwing members are required to be screwed between the electrical connection sockets and the circuit board. Each of the electrical connection sockets with a chip disposed thereon can be disposed in a high temperature environment or a low temperature environment for testing along with the chip testing device, so that each of the chips does not need to be detached repeatedly.