A dual loop type temperature control module and an electronic device testing apparatus having the same are provided. The temperature control module comprises a first loop through which a first working fluid of a first temperature flows, a second loop through which a second working fluid of a second temperature flows, a controller for controlling a first switching valve such that the first or second working fluid flows through a temperature regulating device, and a second switching valve such that the working fluid flowing through the temperature regulating device returns to the first or second loop. The temperature regulating device adjusts a thermoelectric cooling device to reach two different reference temperatures based on the rise/fall of its temperature dependent on the working fluid. The thermoelectric cooling device regulates the temperature of the tested object under a wide range of temperature difference and with accuracy based on the reference temperatures to facilitate the detection of high/low temperature.

A testing environment may have at least one controller connected to at least first and second testing slots positioned in a housing. The first testing slot can be configured with a first thermal range capability and the second testing slot may be configured with a second thermal range capability that differs from the first thermal range capability.

To provide a sensor device which is capable of high temperature detection using self-heat generation without providing a dedicated terminal and suppresses an increase in cost with an increase in chip occupation area due to the addition of a test pad. A sensor device is configured to include an active logic switching circuit for switching an active logic of an output driver and perform a heating inspection while switching the active logic of the output driver during an inspection process with the output driver as a heat generation source.

A thermal test head for an integrated circuit device includes a heat exchanger assembly, a contact assembly configured to contact the integrated circuit, and a thermal control assembly disposed between the heat exchanger assembly and the contact assembly. The thermal control assembly includes a Peltier device in thermal contact with opposing surfaces of the heat exchanger assembly and the contact assembly, and a spacer in physical contact with the opposing surfaces of the heat exchanger assembly and the contact assembly.

An apparatus according to an embodiment comprises: a laser source that outputs a laser beam; an optical system that modifies the laser beam, and directs the modified laser beam onto a test object; a signal detector that detects a change of signal in the process of irradiating the test object with the modified laser beam; and a computer system that performs a failure analysis based on the change detected by the signal detector, wherein the optical system modifies the laser beam so that the modified laser beam generates an irradiation zone that includes a first intensity component of which peak intensity is near an irradiation axis and a second intensity component of which peak intensity is around the irradiation axis.

There is provided a prober including inspection rooms. Each of the inspection rooms includes: a probe card having probes; a chuck top configured to mount a wafer; and a temperature adjuster configured to adjust a temperature of the chuck top. At least one of the probe card and the chuck top includes a gap adjustment member configured to maintain a constant gap between the probe card and the chuck top. The probe card is preheated by heat of the chuck top whose temperature is adjusted by the temperature adjuster, in a state in which the wafer is not mounted on the chuck top and in a state in which the probe card and the chuck top are connected with each other via the gap adjustment member.

A stand-alone active thermal interposer device for use in testing a system-in-package device under test (DUT), the active thermal interposer device includes a body layer having a first surface and a second surface, wherein the first surface is operable to be disposed adjacent to a cold plate, and a plurality of heating zones defined across a second surface of the body layer, the plurality of heating zones operable to be controlled by a thermal controller to selectively heat and maintain respective temperatures thereof, the plurality of heating zones operable to heat a plurality of areas of the DUT when the second surface of the body layer is disposed adjacent to an interface surface of the DUT during testing of the DUT.

A tester apparatus is provided. Slot assemblies are removably mounted to a frame. Each slot assembly allows for individual heating and temperature control of a respective cartridge that is inserted into the slot assembly. A closed loop air path is defined by the frame and a heater and cooler are located in the closed loop air path to cool or heat the cartridge with air. Individual cartridges can be inserted or be removed while other cartridges are in various stages of being tested or in various stages of temperature ramps.

A testing apparatus comprises a test interface board comprising a plurality of socket interface boards, wherein each socket interface board comprises: a) an open socket to hold a DUT; b) a discrete active thermal interposer comprising thermal properties and operable to make thermal contact with the DUT; c) a superstructure operable to contain the discrete active thermal interposer; and d) an actuation mechanism operable to provide a contact force to bring the discrete active thermal interposer in contact with the DUT.

An inspection apparatus includes: inspection chamber rows in each of which inspection chambers are arranged, the inspection chamber rows arranged in multiple stages and each of the inspection chambers being configured to accommodate therein a tester configured to inspect an inspection object on a chuck top; a refrigerant supplier configured to supply a refrigerant gas; and a controller. The refrigerant supplier includes: a refrigerant gas pipe connecting the chuck tops in each inspection chamber row to allow the refrigerant gas to pass therethrough; and a first heat exchanger disposed in the refrigerant gas pipe between the chuck tops to exchange heat with the refrigerant gas discharged from the chuck tops. Each of the chuck tops includes a heater configured to heat the inspection object and a temperature sensor. The controller is configured to control the heater based on a temperature detected by the temperature sensor.