A system includes a plurality of thermally-coupled zones and a plurality of thermal control devices, each controllable to thermally control one of the plurality of zones, and a plurality of temperature sensors, each configured to measure temperature of one of the plurality of zones. The system includes a control circuit configured to receive a temperature measurement for each of the plurality of zones, collect the temperature measurements in a temperature vector in a real coordinate system, and transform the temperature vector to a normal coordinate system that provides a plurality of uncoupled equations. The control circuit is configured to determine, based on the plurality of uncoupled equations and a desired temperature gradient, a desired power vector in the normal coordinate system, transform the desired power vector to the real coordinate system to generate a power vector, and control the plurality of heaters in accordance with the power vector.

Disposing a DUT between a cold plate and an active thermal interposer device of the thermal management head. The DUT includes a plurality of modules and the active thermal interposer device includes a plurality of zones, each zone of the plurality of zones corresponding to a respective module of the plurality of modules and operable to be selectively heated. Receiving a respective set of inputs corresponding to each zone of the plurality of zones. Performing thermal management of the plurality of modules of the DUT by separately controlling temperature of each zone of the plurality zones by controlling a supply of coolant to a cold plate, and individually controlling heating of each zone of the plurality zones.

Heat spreaders for use in semiconductor device testing, such as burn-in testing, are disclosed herein. In one embodiment, a heat spreader is configured to be coupled to a burn-in testing board including a plurality of sockets. The heat spreader includes (i) a frame having a plurality of apertures, and (ii) a plurality of heat sinks movably positioned within corresponding ones of the apertures. When the heat spreader is coupled to the burn-in testing board, the heat sinks are configured to extend into corresponding ones of the sockets to thermally contact semiconductor devices positioned within the sockets. The heat spreader can promote a uniform temperature gradient across the burn-in board during testing of the semiconductor devices.

An inspection apparatus for an electronic device is provided. The electronic device includes a substrate and an electrode located on the substrate. The inspection apparatus includes a support to support the electronic device, a probe to be brought into contact with a surface of the electrode, a temperature adjusting device configured to adjust at least one of a temperature of the surface of the electrode and a temperature of the probe such that the temperature of the surface of the electrode and the temperature of the probe are different from each other, and a temperature measuring device configured to measure the temperature of the surface of the electrode.

Disclosed herein is a high-performance thermal chuck for enhanced thermal management of high-power integrated circuit (IC) devices. The disclosed high-performance thermal chuck provides active heating and cooling for post-manufacture device testing. A high-performance heatsink comprises microfluidic channels in a high thermal conductivity silicon carbide (SiC) body for providing enhanced active cooling of an IC device. A refractory heating element is embedded between an integrated heat spreader comprising diamond and the heatsink for providing active heating. The integrated heat spreader is bonded to the heatsink. Closely matched coefficients of thermal expansion between the diamond heat spreader and the heatsink mitigate thermally-induced warpage.

A burn-in board capable of realizing a uniform temperature distribution inside a burn-in board is provided. A burn-in board includes: a plurality of sockets; a burn-in board body including an upper surface for mounting the sockets thereon and a lower surface on the side opposite to the upper surface; a reinforcement frame contacting the lower surface; a bottom cover contacting the reinforcement frame; a heat conduction plate interposed between the burn-in board body and the bottom cover; and a heat conduction sheet thermally connecting the burn-in board body to the heat conduction plate, in which the reinforcement frame presses the heat conduction plate toward the heat conduction sheet.

An integrated circuit (IC) includes functional logic therein that can be enabled by application of a predefined thermal cycle. The IC includes an enabling fuse operatively coupled to the functional logic, the functional logic being disabled unless enabled by activation of the enabling fuse. A set of thermal sensors are arranged in a physically distributed manner through at least a portion of the IC. A test control macro operatively couples to the set of thermal sensors and the enabling fuse for activating the enabling fuse to enable the functional logic in response to application of a thermal cycle that causes the set of thermal sensors to sequentially experience a thermal condition matching a thermal sequence enabling test. A related method and system for applying the predefined thermal cycle are also provided.

A heating device using an LED is provided. The heating device includes a heater for heating a target with LED light, an LED controller for controlling power supplied to the LED such that a temperature of the target is adjusted with the power being in the range where a current thereof does not exceed an allowable current Imax, a correction unit for correcting Imax, and a voltage measurement unit for measuring a voltage of the LED. The correction unit estimates a junction temperature Tjm of the LED when Imax is supplied based on a measurement result by the voltage measurement unit when an estimation current Ie is supplied after Imax is supplied to the LED for correction. When Tjm of the LED when Imax is supplied exceeds Tmax corresponding to Imax, the correction unit corrects Imax.

Laser-assisted integrated circuit (IC) device testing apparatus capable of inducing hot carrier injection (HCI) within selected transistors of an IC device. A laser source of sufficiently high output power (e.g., 1W) and short pulse duration (e.g., 100 fs) can generate enough hot carriers through a multi-photon (e.g., TPA) carrier injection mechanism to significantly accelerate HCI aging even at low transistor voltage bias (e.g., <1.5V). Rapid laser-assisted HCI transistor aging can selectively degrade transistors of individual functional IC blocks within an IC device.

A power supply for supplying a power to a heating mechanism used for heating a measurement target that emits a measurement signal includes an input device configured to output an input signal that reflects a control signal in a differentiable periodic waveform having a frequency of 1 kHz or less. The power supply includes a switching amplifier configured to amplify the input signal from the input device and output the amplified signal.