A test coverage rate improvement system for pins of tested circuit board and a method thereof are disclosed. In the system, partial pins of a circuit board connector in a tested circuit board are not electrically connected to the boundary scan chip, test pins of the test pin board are pressed with the partial pins by a fixture of a boundary scan interconnect testing workstation to electrically connect the test pins to the partial pins. A test access port controller receives a detection signal for detecting the partial pins, which are not electrically connected to the boundary scan chip, of the circuit board connector through the test pin board from the test adapter card, and determines whether conduction is formed based on the detection signal, thereby achieving the technical effect of improving a test coverage rate for the pins of the tested circuit board.

Embodiments of the disclosure provide a method and device for testing an integrated circuit (IC). Calibration parameters of test boards are determined respectively by acquiring identification information of the test boards, and then each of to-be-tested devices in each of the test boards is tested respectively based on the calibration parameters of the test boards. According to the embodiments of the disclosure, the calibration parameters of the test boards are determined respectively according to the identification information corresponding to the test boards, therefore when different types of test boards are adopted by a test machine, each type of test boards may acquire the accurate calibration parameter, so that the accuracy of a test result is ensured, the mixed test of multiple types of test boards is implemented, furthermore, the test efficiency is improved and the test cost is reduced.

The present disclosure provides an automatic chip testing system and method. The automatic chip testing system includes: a client, which is used to send a test instruction regarding the chip; a server, which includes a main board and a chip connected to it. The main board is used to receive the test instruction, convert the test instruction into a test file, and transmit the test file to the chip; the chip is used to trigger test items related to the test file after receiving the test file, the function test result of the chip is generated, and the function test result of the chip is shared to the client through the main board. The disclosure improves the reliability of the chip test result, and saves the test time.

A core partition circuit comprises a first decompression circuit, a second decompression circuit, a first switching circuit, an wrapper scanning circuit, a first compression circuit, a second compression circuit and a second switching circuit. The first and second decompression circuits decompress an input signal. The first switching circuit outputs the output signal of the first decompression circuit or the second decompression circuit according to a first control signal. The wrapper scanning circuit receives the output signal of the first decompression circuit or the second decompression circuit to scan the internal or the port of the core partition circuit. The first and second compression circuits respectively compress the internal logic and the port logic of the core partition circuit. The second switching circuit outputs the compressed internal logic or port logic of the core partition circuit according to the first control signal.

The present invention provides a reliable method and arrangement for boundary scan testing and debugging newly manufactured multi-chip modules (MCMs) made to identical design specifications with no Known Good Die therein. Advantageously, a first and a second MCM are temporarily linked in tandem for boundary scan testing through a motherboard and daisy-chaining their internal dice, and interlinking the corresponding boundary scan cells of the identical dice of the first and second MCM to (1) run self-test on individual MCMs and mutual test on the MCMs connected in tandem in order to generate an extended Truth Table that includes responses from an array of combined netlists of the first and second MCMs, and (2) to diagnose mismatched bits in the extended Truth Table using a Boundary Scan Diagnostics software so as to identify defects in the first and second MCMs.

This disclosure describes a test architecture that supports a common approach to testing individual die and dies in a 3D stack arrangement. The test architecture uses an improved TAP design to facilitate the testing of parallel test circuits within the die.

According to a certain embodiment, the test system includes a first test board, a test executable integrated circuit, and a first measuring apparatus. A device under test (DUT) is mounted on the first test board. The test executable integrated circuit is mounted on the first test board, and is configured to read firmware stored in the DUT in advance and to test the DUT. The first measuring apparatus instructs the test executable integrated circuit to start a test of the DUT. There are provided the test system, the test method, and the non-transitory computer readable medium, capable of reducing costs required for tests and also of shortening test time.

This disclosure describes a test architecture that supports a common approach to testing individual die and dies in a 3D stack arrangement. The test architecture uses an improved TAP design to facilitate the testing of parallel test circuits within the die.

In various examples, a test system is provided for executing built-in-self-test (BIST) according to JTAG and IEEE 1500 on chips deployed in-field. Hardware and software selectively connect onto the IEEE 1500 serial interface for running BIST while the chip is being used in deployment—such as in an autonomous vehicle. In addition to providing a mechanism to connect onto the serial interface, the hardware and software may reduce memory requirements and runtime associated with running the test sequences, thereby making BIST possible in deployment. Furthermore, some embodiments include components configured to store functional states of clocks, power, and input/output prior to running BIST, which permits restoration of the functional states after the BIST.

The present invention provides a reliable method and arrangement for boundary scan testing and debugging newly manufactured multi-chip modules (MCMs) made to identical design specifications with no Known Good Die therein. Advantageously, a first and a second MCM are temporarily linked in tandem for boundary scan testing through a motherboard and daisy-chaining their internal dice, and interlinking the corresponding boundary scan cells of the identical dice of the first and second MCM to (1) run self-test on individual MCMs and mutual test on the MCMs connected in tandem in order to generate an extended Truth Table that includes responses from an array of combined netlists of the first and second MCMs, and (2) to diagnose mismatched bits in the extended Truth Table using a Boundary Scan Diagnostics software so as to identify defects in the first and second MCMs.