Embodiments herein relate to apparatus, systems, and methods to compress a test pattern onto a field programmable gate array to test a device under test. This may include identifying values of a plurality of drive pins for a plurality of test cycles to apply to an input of the DUT for each of the plurality of test cycles, identifying values of a plurality of compare pins for the plurality of test cycles to compare an output of the DUT, respectively, for each of the plurality of test cycles, analyzing the identified values, compressing, based on the analysis, the values of the plurality of drive pins and the plurality of compare pins, and storing the compressed values on the FPGA.

A basic logic element (1) includes: a calculation unit (11) configured to perform calculation processing; a self-diagnosis unit (12) configured to self-diagnose whether or not there is an abnormality in a result of the calculation output from the basic logic element; a management unit (13) configured to determine whether or not to retain authority to output the result of the calculation based on a result of the diagnosis performed by the self-diagnosis unit (12) and output a result of the determination as an authority signal; and an output control unit (14) configured to control whether or not to output the result of the calculation performed by the calculation unit (11) based on whether or not the authority to output data is retained by the management unit (13).

Presented embodiments facilitate efficient and effective flexible implementation of different types of testing procedures in a test system. In one embodiment, a test system configuration adapter includes a tester side socket, a break out pin, and a device under test side slot. The tester side socket is configured to couple with a test equipment socket. The break out pin is configured to couple with the supplemental equipment. The device under test side slot is configured to couple with the tester side socket, the break out pin, and a device under test, wherein the tester side socket. The test system configuration adapter is configured to enable communication between test equipment coupled to the test equipment socket and supplemental equipment coupled to the breakout pin while the device under test remains coupled to the device under test side slot. In one exemplary implementation, the breakout pin and tester side socket are selectively coupled to the device under test side slot. The test system configuration adapter can include a switch configured to switch a portion of the coupling of the device under test side slot to the tester side socket and the break out pin.

An integrated circuit comprising a field programmable gate array including a plurality of logic tiles, wherein, during operation, each logic tile is configurable to connect with at least one other logic tile, and wherein each logic tile includes: (1) a normal operating mode and test mode, (2) an interconnect network including a plurality of multiplexers, wherein during operation, the interconnect network of each logic tile is configurable to connect with the interconnect network of at least one other logic tile in the normal operating mode and (3) bitcells to store data. The FPGA also includes control circuitry, electrically connected to each logic tile, to configure each logic tile in a test mode and enable concurrently writing configuration test data into each logic tile of the plurality of logic tiles when the FPGA is in the test mode.

A full-path circuit delay measurement device for a field-programmable gate array (FPGA) and a measurement method are provided. The measurement device includes two shadow registers and a phase-shifted clock, where the two shadow registers take an output of a measured combinational logic circuit as a clock and sample the phase-shifted clock SCLK as data; the two shadow registers are respectively triggered on rising and falling edges of the output of the measured combinational logic circuit to sample the phase-shifted clock; outputs of the two shadow registers are delivered by an OR gate as an input into a synchronization register; a clock of the synchronization register serves as a clock MCLK of the measured combinational logic circuit; an output of the synchronization register serves as that of the circuit delay measurement device; the phase-shifted clock SCLK and the clock MCLK of the measured combinational logic circuit have the same frequency.

A method for detecting errors of a first field-programmable gate array (FPGA) program includes: receiving, by a monitoring program executed on a processor connected to an FPGA on which the first FPGA program is executed, a signal value read out from the first FPGA program; and comparing, by the monitoring program executed on the processor, the signal value to a reference value from a source other than the first FPGA program in order to detect errors of the first FPGA program.

Aspects of the invention include systems and methods directed to a portable chip tester. A non-limiting example of a system includes a housing, a printed circuit board mounted on the housing, in which the printed circuit board includes a first interface operable to permit electrical communication between the printed circuit board and a device under test. The system further includes a mount operable to enable an electrical connection with an integrated circuit, in which the integrated circuit is operable to manage testing the device under test under a testing protocol. The system further includes a power supply and a software platform that includes a memory having computer readable instructions and one or more processors for executing the computer readable instructions. The computer readable instructions controlling the processors to perform operations including directing the integrated circuit to manage testing of the device under test pursuant to the testing protocol.

Provided is a method for enabling a semiconductor test system for testing field programmable gate arrays (FPGAs) to operate as a device programmer by converting a serial vector format (SVF) file containing a bitstream and converting the file to a vector compatible with the semiconductor test system. When executed on an HP93K test system, as an example, the vector generates JTAG (Joint Test Action Group) signals, which program the bitstream into a Field Programmable Gate Array (FPGA). The inventive method eliminates the need for a separate computer system that is normally required to run FPGA programming software and also eliminates the need to use FPGA vendor provided JTAG programming pods. Eliminating the need for the vendor software, a separate computer system, and programming pods reduces equipment cost, maintenance, and streamlines the electrical test, evaluation, and characterization of FPGAs.

The present disclosure discloses a method and an apparatus for testing an artificial intelligence chip test, a device and a storage medium, and relates to the field of artificial intelligence. The specific implementation solution is: the target artificial intelligence chip has multiple same arithmetic units, the method includes: obtaining scale information of the target artificial intelligence chip; determining whether the target artificial intelligence chip satisfies a test condition of an arithmetic unit array level according to the scale information; dividing all the arithmetic units into multiple same arithmetic unit arrays, and performing a DFT test on the arithmetic unit arrays, respectively, if it is determined that the test condition of the arithmetic unit array level is satisfied; performing the DFT test on the arithmetic units, respectively, if it is not determined that the test condition of the arithmetic unit array level is not satisfied.

A production method for producing a circuit optimized to be protected against radiation includes a preliminary characterization stage performed on a reference circuit. The preliminary characterization stage includes the steps of: irradiating the reference circuit a plurality of times; after each irradiation, if one or more reference elements of the reference circuit have failed, locating said reference element(s); and mapping the impact of the irradiations on the reference surface of the reference circuit. The production method further includes an optimization stage comprising the step of adapting the position of at least one optimized radiation-sensitive element on at least one optimized surface of the optimized circuit as a function of the mapping performed on the reference circuit.