A scan test device includes a scan flip flop circuit and a clock gating circuit. The scan flip flop circuit is configured to receive a scan input signal according to a scan clock signal, and to output the received scan input signal to be a test signal. The clock gating circuit is configured to selectively mask the scan clock signal according to a predetermined bit of the test signal and a scan enable signal, in order to generate a test clock signal for testing at least one core circuit.

A falling edge controller includes a controller having an inverted TCK (Test Clock) input, a TMS (Test Mode Select) input, a shift register control output, an update register control output, and a shift output; a shift register having a TDI (Test Data In) input, a shift register control input coupled to the shift register control output, address inputs, a select input, address and select outputs, and a TDO (Test Data Out) output; an update register having address and select inputs coupled to the address and select outputs, an update register control input coupled to the update register control output, address outputs coupled to the address inputs, and a select output coupled to the select input; and address circuitry having address inputs coupled to the address outputs, and having an enable output.

An aspect of the disclosure relates to an integrated circuit (IC). The IC includes a first set of test clock controllers (TCCs) including a first set of clock outputs, respectively; and a first set of functional cores including a first set of clock inputs coupled to the first set of clock outputs of the first set of TCCs, respectively.

Methods and systems for performing data correction and phase optimization are disclosed herein. In some implementations, a system for performing data correction comprises: an analog to digital converter (ADC) configured to receive differential data from a continuous time linear equalizer (CTLE) and generate a bitstream comprising a plurality of data bits and a corresponding plurality of data sign bits; a decision feedback equalization (DFE) block configured to receive the bitstream from the ADC and provide data to a clock and data recovery (CDR) block; and data correction circuitry. In some implementations, the data correction circuitry is configured to: receive the bitstream from the ADC; determine whether to correct a data sign bit; responsive to determining the data sign bit is to be corrected, flip the data sign bit; and provide the plurality of data sign bits, including the flipped data sign bits, to the DFE.

Disclosed herein is a pseudo-random binary sequence (PRBS) generator (200) for performing on-chip testing. It comprises of a plurality of lanes (L1-L4), wherein each lane comprises a latch group (Lg1-Lg4) capable of receiving clock signals, wherein a number of latches in each latch group is based on an output sequence to be generated for performing the on-chip testing. Each latch group is having at least one of a flip-flop and a latch is further connected with a plurality of logic gates in such a manner that an output, generated by the at least one of the flip-flop and the latch of each latch group, is provided as an input to the plurality of logic gates.

A test circuit includes a scan chain and a wrapper chain. The wrapper chain shifts in a test pattern according a first clock. The scan chain is coupled to the wrapper chain via a logic combination of a circuit under test. The wrapper chain is configured to transmit the test pattern to the scan chain via the logic combination according to a second clock in a capture phase. The wrapper chain includes a first, a second wrapper cell, and an asynchronous register. The first wrapper cell sequentially shifts in two bits of the test pattern in the shift-in phase. The second wrapper cell shifts in the first bit of the test pattern in the shift-in phase. The asynchronous register conducts the first wrapper cell to the second wrapper cell in the shift-in phase, and latches the second wrapper cell in the capture phase.

The disclosure relates to a scan chain circuit comprising cascaded flip-flops having a functional input node and a test input node configured to be selectively coupled to logic circuitry at a clock edge time. A clock line is provided configured to distribute one or more clock signals to the flip-flops in the chain, wherein the flip-flops in the chain have active clock edges applied thereto at respective clock edge times. The chain of flip-flops comprise a set of flip-flops configured to receive an edge inversion signal and to selectively invert their active clock edges in response to the edge inversion signal being asserted.

A method and an apparatus for testing a chip, as well as a storage medium, and a chip thereof are provided. The chip includes an operation module. The method includes receiving, via a first pin of the chip, a test control signal indicating a test type of the operation module; performing a first test for the operation module using a first test vector based on the test type; or performing a second test for the operation module using a second test vector, where the first test is a test for the memory included in the operation module and the second test is a test for the functional logic in included in the operation module.

This disclosure describes die test architectures that can be implemented in a first, middle and last die of a die stack. The die test architectures are mainly the same, but for the exceptions mentioned in this disclosure.

A test control port (TCP) includes a state machine SM, an instruction register IR, data registers DRs, a gating circuit and a TDO MX. The SM inputs TCI signals and outputs control signals to the IR and to the DR. During instruction or data scans, the IR or DRs are enabled to input data from TDI and output data to the TDO MX and the top surface TDO signal. The bottom surface TCI inputs may be coupled to the top surface TCO signals via the gating circuit. The top surface TDI signal may be coupled to the bottom surface TDO signal via TDO MX. This allows concatenating or daisy-chaining the IR and DR of a TCP of a lower die with an IR and DR of a TCP of a die stacked on top of the lower die.