Testing of die on wafer is achieved by; (1) providing a tester with the capability of externally communicating JTAG test signals using simultaneously bidirectional transceiver circuitry, (2) providing die on wafer with the capability of externally communicating JTAG test signals using simultaneously bidirectional transceiver circuitry, and (3) providing a connectivity mechanism between the bidirectional transceiver circuitry's of the tester and a selected group or all of the die on wafer for communication of the JTAG signals.

This disclosure describes die test architectures that can be implemented in a first, middle and last die of a die stack. The die test architectures are mainly the same, but for the exceptions mentioned in this disclosure.

A test control port (TCP) includes a state machine SM, an instruction register IR, data registers DRs, a gating circuit and a TDO MX. The SM inputs TCI signals and outputs control signals to the IR and to the DR. During instruction or data scans, the IR or DRs are enabled to input data from TDI and output data to the TDO MX and the top surface TDO signal. The bottom surface TCI inputs may be coupled to the top surface TCO signals via the gating circuit. The top surface TDI signal may be coupled to the bottom surface TDO signal via TDO MX. This allows concatenating or daisy-chaining the IR and DR of a TCP of a lower die with an IR and DR of a TCP of a die stacked on top of the lower die.

A method for testing a chip comprising receiving N scan-in chains of test data; using the N scan-in chains of test data to perform tests on the chip; receiving a merged expected test-result and masking-instruction signal on X pins of the chip from the off-chip test equipment, X being less than 2*N; decoding the merged expected test-result and masking-instruction signal to extract N decoded output signals, each of the N decoded output signals corresponding to a respective chain of test results.

In an embodiment, a method for performing scan testing includes: generating first and second scan clock signals; providing the first and second scan clock signals to first and second scan chains, respectively, where the first and second scan clock signals includes respective first shift pulses when a scan enable signal is asserted, and respective first capture pulses when the scan enable signal is deasserted, where the first shift pulse of the first and second scan clock signals correspond to a first clock pulse of a first clock signal, where the first capture pulse of the first scan clock signal corresponds to a second clock pulse of the first clock signal, and where the first capture pulse of the second scan clock signal corresponds to a first clock pulse of a second clock signal different from the first clock signal.

Provided are scan device and method of diagnosing scan chain fault. The scan device for diagnosing a fault includes a scan partition including a plurality of scan chains which include path control scan flipflops connected to scan flipflops in cascade. In the scan partition, connection paths of the scan flipflops are controllable. The connection paths of the path control scan flipflops are controlled to detect a position of a fault such that a fault range in the scan partition is reduced to diagnose the fault.

A test control port (TCP) includes a state machine SM, an instruction register IR, data registers DRs, a gating circuit and a TDO MX. The SM inputs TCI signals and outputs control signals to the IR and to the DR. During instruction or data scans, the IR or DRs are enabled to input data from TDI and output data to the TDO MX and the top surface TDO signal. The bottom surface TCI inputs may be coupled to the top surface TCO signals via the gating circuit. The top surface TDI signal may be coupled to the bottom surface TDO signal via TDO MX. This allows concatenating or daisy-chaining the IR and DR of a TCP of a lower die with an IR and DR of a TCP of a die stacked on top of the lower die.

A controller for a memory component comprises a processing unit and at least one memory unit coupled to the processing unit, the memory unit comprising at least a first area for storing a user firmware and a second area for storing a controller firmware; the processing unit is configured to capture a memory address of a program instruction to be executed, compare the memory address with a reference value, and, based on that comparison, enable/restricting actions associated with the program instruction. A related memory component and related methods are also disclosed.

A test control port (TCP) includes a state machine SM, an instruction register IR, data registers DRs, a gating circuit and a TDO MX. The SM inputs TCI signals and outputs control signals to the IR and to the DR. During instruction or data scans, the IR or DRs are enabled to input data from TDI and output data to the TDO MX and the top surface TDO signal. The bottom surface TCI inputs may be coupled to the top surface TCO signals via the gating circuit. The top surface TDI signal may be coupled to the bottom surface TDO signal via TDO MX. This allows concatenating or daisy-chaining the IR and DR of a TCP of a lower die with an IR and DR of a TCP of a die stacked on top of the lower die.

A circuit is described that can include: a first register to store a first value that specifies a first subset of a set of scan chains, wherein the first subset of the set of scan chains includes scan cells that are desired to be masked; a second register to store a second value that specifies, in each shift cycle, a second subset of the set of scan chains, wherein the second subset of the set of scan chains includes scan cells that are desired to be masked; and a masking circuit to mask, in each shift cycle, scan cells in a third subset of the set of scan chains that is an intersection of the first subset of the set of scan chains and the second subset of the set of scan chains.