In one example, a driver circuit includes a differential transistor pair configured to be biased by a current source and including a differential input and a differential output. The driver circuit further includes a resistor pair coupled between a node pair and the differential output, a transistor pair coupled between a voltage supply and the node pair, and a bridge transistor coupled between the node pair. The driver circuit further includes a pair of three-state circuit elements having a respective pair of input ports, a respective pair of control ports, and a respective pair of output ports. The pair of output ports is respectively coupled to the node pair. The pair of control ports is coupled to a common node comprising each gate of the transistor pair and a gate of the bridge transistor.

There is provided a semiconductor apparatus including a memory controller; a CPU; a high-speed communication controller; a memory operation terminal group that includes a plurality of memory operation terminals for inputting a first signal propagating between an external memory group and the memory controller; a high-speed communication terminal group that includes a plurality of high-speed communication terminals for inputting a second signal to the high-speed communication controller; an inspection terminal group that includes a plurality of inspection terminals for acquiring information from the CPU and performing debugging; and a terminal mounting surface at which the memory operation terminal group, the high-speed communication terminal group, and the inspection terminal group are provided, in which at the terminal mounting surface, a first inspection terminal among the plurality of inspection terminals is located between the memory operation terminal group and the high-speed communication terminal group.

A server Joint Test Action Group (JTAG) component adaptive interconnection system and method. The system includes a JTAG master device, a programmable device, and a plurality of JTAG components. The programmable device is configured to simulate JTAG timing according to a JTAG protocol and test JTAG channels of the JTAG components connected to the programmable device one by one. The programmable device connects in series a Test Data Output (TDO) signal of a previous JTAG component with a Test Data Input (TDI) signal of a next JTAG component in the programmable device, connects a TDI signal of a first JTAG component with a TDI signal of the JTAG master device, and connects a TDO signal of a last JTAG component with a TDO signal of the JTAG master device, so as to form a JTAG interconnection chain.

An address and command port interface selectively enables JTAG TAP domain operations and Trace domain operations within an IC. The port carries TMS and TDI input and TDO output on a single pin and receives a clock signal on a separate pin. The addressable two pin interface loads and updates instructions and data to the TAP domain within the IC. The instruction or data update operations in multiple ICs occur simultaneously. A process transmits data from an addressed target device to a controller using data frames, each data frame comprising a header bit and data bits. The logic level of the header bit is used to start, continue, and stop the data transmission to the controller. A data and clock signal interface between a controller and multiple target devices provides for each target device to be individually addressed and commanded to perform a JTAG or Trace operation.

The present disclosure describes novel methods and apparatuses for directly accessing JTAG Tap domains that exist in a scan path of many serially connected JTAG Tap domains. Direct scan access to a selected Tap domain by a JTAG controller is achieved using auxiliary digital or analog terminals associated with the Tap domain and connected to the JTAG controller. During direct scan access, the auxiliary digital or analog terminals serve as serial data input and serial data output paths between the selected Tap domain and the JTAG controller.

An integrated circuit, comprising functional circuitry and testing circuitry. A first set of pads is operable in a first state for communicating testing signals to the testing circuitry and operable in a second state for communicating input/output signals to the functional circuitry. A second set of pads, differing from the first set of pads, is operable in the second state for communicating testing signals to the testing circuitry for testing signals associated in the second state with the first set of pads.

A test and measurement instrument includes a current measurement device having an input to accept an electrical current for measurement, an output to pass an output current output from the current measurement device, a sense path through which the electrical current is measured, and an active bypass device to pass an amount of current from the input of the current measurement device to the output of the current measurement device without passing through the sense path. The active bypass device may be tuned to allow the current sense device to operate without bypass within a specific range of target current values. Some current measurement devices may include more than one active bypass circuits, each tuned for a different range of input current values.

Testing of die on wafer is achieved by; (1) providing a tester with the capability of externally communicating JTAG test signals using simultaneously bidirectional transceiver circuitry, (2) providing die on wafer with the capability of externally communicating JTAG test signals using simultaneously bidirectional transceiver circuitry, and (3) providing a connectivity mechanism between the bidirectional transceiver circuitry's of the tester and a selected group or all of the die on wafer for communication of the JTAG signals.

A system on a chip including a processor and an in-circuit emulator located within the processor. The processor is to perform processing functions associated with controlling operation of the system on a chip. The in-circuit emulator includes instrumentation logic to take over controlling the operation of the SOC from the processor, perform debugging and emulation functions, and output data including results of the debugging and emulation functions. A frame capture module is to package the data including the results of the debugging and emulation functions into frames having a parallel format. A serializer is to convert the frames from the parallel format to a serial format and output the frames having the serial format from the system on a chip.

Systems and methods for latches are presented. In one embodiment a system includes scan in propagation component, data propagation component, and control component. The scan in propagation component is operable to select between a scan in value and a recirculation value. The data propagation component is operable to select between a data value and results forwarded from the scan in propagation component, wherein results of the data propagation component are forwarded as the recirculation value to the scan in propagation component. The control component is operable to control an indication of a selection by the scan in propagation component and the data propagation component.