A circuit device is provided with a first codec including a first portion of a logic circuit and a second codec including a second portion of the logic circuit. The circuit device can also include a plurality of first scan chains coupled to the first codec and configured to shift a delayed test vector onto the first codec, wherein the delayed test vector is a test vector with a phase delay. A plurality of second scan chains can be coupled to the second codec and configured to shift the test vector onto the second codec.

According to one general aspect, an apparatus may include a first power signal having a high voltage. The apparatus may include a second power signal having a low voltage. The apparatus may include a third power signal having a voltage configured to switch between the high voltage and the low voltage. The apparatus may include a latching circuit powered by the first power signal and the second power signal. The apparatus may include a selection circuit configured to select between, at least, a first data signal and a second data signal, and powered by the first power signal, the second power signal, and the third power signal.

A semiconductor integrated circuit includes: scan chains each of which includes a serial connection of sequential circuits and performs a shift register operation in a scan test; and an ICG chain composed by coupling, to one another, ICG circuits each of which individually supplies any of the scan chains with a circuit clock signal for operating the sequential circuits. In the ICG chain, an ICG enable propagation signal for controlling timing when the ICG circuits output the circuit clock signals propagates through a signal line and is input sequentially to the ICG circuits. The ICG circuits output the circuit clock signals at pieces of timing which are different between the scan chains.

A method of testing a multiple power domain device includes sending a control signal from a test controller powered by a switchable power domain to a non-scan test data register powered by an always on power domain. The method further includes setting, using the control signal, a test data register value of the register to enable scan mode by bypassing an isolation cell between an output of the switchable domain and an input of the always on domain and, while the register value continuously enables scan mode: shifting a test pattern into a scan chain including a flip-flop coupled to the isolation cell, capturing a test result from the scan chain, and shifting the test pattern out of the scan chain to observe the test result. The isolation cell is configured to allow or disallow propagation of a signal from the output to the input.

A system comprises a testing mode register, a set of pins, and a test access port controller. The test access port controller initiates a first testing mode by configuring the set of pins according to a first pin protocol. The test access port controller configures a first pin to receive first test pattern data based on a first convention and configures a second pin to output first test result data based on the first test pattern data. Based on detecting a register command stored in the testing mode register, the test access port controller initiates a second testing mode by configuring the set of pins according to a second pin protocol. The test access port controller configures the first pin to receive a second test pattern data generated based on a second convention and configures the second pin to output a second test result data based on the second test pattern data.

An integrated circuit includes intellectual property (IP) processing circuitries each including a separate, respective at least one scan chain, and temperature management controller circuitry configured to transmit an input pattern including a plurality of bits to at least one scan chain of a first IP processing circuitry among the IP processing circuitries, detect a temperature of the first IP processing circuitries based on an output pattern received from the at least one scan chain in response to the input pattern being transmitted to the at least one scan chain of the first IP processing circuitry, and control at least one of an operation frequency or an operation voltage of the first IP processing circuitry based on the detected temperature of the first IP processing circuitry.

Testing of die on wafer is achieved by; (1) providing a tester with the capability of externally communicating JTAG test signals using simultaneously bidirectional transceiver circuitry, (2) providing die on wafer with the capability of externally communicating JTAG test signals using simultaneously bidirectional transceiver circuitry, and (3) providing a connectivity mechanism between the bidirectional transceiver circuitry's of the tester and a selected group or all of the die on wafer for communication of the JTAG signals.

An integrated circuit includes first and second cores. Each core has a power-switchable portion in a first power domain in which an operating power is turned on or off in response to a power control signal. The first power domain includes a first scan chain, and the first power domain also includes a plurality of outputs. Each core also includes an always-on portion in a second power domain in which the operating power is maintained during testing of the integrated circuit. The second power domain also has a second scan chain. The second power domain further includes respective isolation gates coupled to the plurality of outputs of the first power domain, and the second scan chain includes a respective wrapper cell coupled to some isolation gates. The integrated circuit is configured to power off and isolate the power-switchable portion in the first power domain based on a scan test result.

A semiconductor device comprises a central processing device, a first logical circuit, and a serial memory interface circuit. The first logical circuit has a first scan chain in which a first scan pattern is set, is configured to suppress a leakage current when the first scan pattern for power saving is set in the first scan chain. The serial memory interface circuit is configured to acquire the first scan pattern for power saving from an external storage device. The leakage current of the first logical circuit is suppressed by transferring the first scan pattern for power saving acquired by the serial memory interface circuit to the first logical circuit and setting the first scan pattern for power saving in the first scan chain under control of the central processing device.

An apparatus has a control domain comprising functional circuitry to perform logical operations when in an operational state. The functional circuitry comprises at least one output and a state of the output depends on the logical operations. Domain control circuitry controls the control domain to put the functional circuitry in one of the operational state and a non-operational state. Isolation circuitry isolates the functional circuitry within the apparatus by holding the state of the output at a predetermined value when the domain control circuitry puts the functional circuitry in the non-operational state. Self-test control circuitry causes the domain control circuitry to control the control domain to put the functional circuitry in the non-operational state and to cause a self-test procedure to be carried out with respect to the functional circuitry.