Testing of die on wafer is achieved by; (1) providing a tester with the capability of externally communicating JTAG test signals using simultaneously bidirectional transceiver circuitry, (2) providing die on wafer with the capability of externally communicating JTAG test signals using simultaneously bidirectional transceiver circuitry, and (3) providing a connectivity mechanism between the bidirectional transceiver circuitry's of the tester and a selected group or all of the die on wafer for communication of the JTAG signals.

The present disclosure discloses a method and an apparatus for testing an artificial intelligence chip test, a device and a storage medium, and relates to the field of artificial intelligence. The specific implementation solution is: the target artificial intelligence chip has multiple same arithmetic units, the method includes: obtaining scale information of the target artificial intelligence chip; determining whether the target artificial intelligence chip satisfies a test condition of an arithmetic unit array level according to the scale information; dividing all the arithmetic units into multiple same arithmetic unit arrays, and performing a DFT test on the arithmetic unit arrays, respectively, if it is determined that the test condition of the arithmetic unit array level is satisfied; performing the DFT test on the arithmetic units, respectively, if it is not determined that the test condition of the arithmetic unit array level is not satisfied.

The disclosure provides using test processors to provide a more flexible solution compared to the existing DFX blocks that are used for controlling test networks in chips. The test processors provide a highly flexible solution since programming of the test processors can be changed at any time; even after manufacturing, and can support practically an unlimited number of core chips in any configuration. The high flexibility provided via the test processors can reduce engineering effort needed in design and verification, accelerate schedules, and may prevent additional tapeouts in case of DFX design bugs. By making debug and diagnosis easier by providing an opportunity to change debug behavior as needed, the time-to-market timeline can be accelerated. Accordingly, the disclosure provides a chip with a test processor, a multi-chip processing system with a test processor, and a method of designing a chip having a test processor.

Methods of a scan partitioning a circuit are disclosed. One method includes calculating a power score for circuit cells within a circuit design based on physical cell parameters of the circuit cells. For each of the circuit cells, the circuit cell is assigned to a scan group according to the power score for the circuit cell and a total power score for each scan group. A plurality of scan chains is formed. Each of the scan chains is formed from the circuit cells in a corresponding scan group based at least in part on placement data within the circuit design for each of the circuit cells. Interconnect power consumption can be assessed to determine routing among circuit cells in the scan chains.

A chip, a chip testing method and an electronic device are provided. The chip includes a combinational logic and a data path gating; the data path gating includes a first input terminal and an output terminal, the first input terminal of the data path gating detects a test enable signal, and the output terminal of the data path gating is connected to the combinational logic; the test enable signal is used to switch a test mode of the chip; the data path gating is configured to output a data path gating control signal to the combinational logic, in a case where the detected test enable signal indicates that a current test mode is irrelevant to a data path function of the combinational logic; and the combinational logic is configured to disable the data path function after receiving the data path gating control signal, to disable data path toggling.

In an embodiment, a method for performing scan includes: entering scan mode; receiving a test pattern; applying the test pattern through a first scan chain by asserting and deasserting a scan enable signal to respectively perform shift and capture operations to the first scan chain; while applying the test pattern through the first scan chain, controlling a further scan flip-flop with the first scan chain without transitioning a further scan enable input of the further scan flip-flop; and evaluating an output of the first scan chain to detect faults.

A system for optimizing scan pipelining may include a processor and a memory. The processor may generate and insert, based on prior analysis of the physical layout of the circuit, an optimized number of pipeline stages between a first block and a second block in a hardware test design, a first scan chain including at least one pipeline stage of a head pipeline stage or a tail pipeline stage. The processor may insert a plurality of flip-flops into the first scan chain. The processor may determine at least one clock to be used for the at least one pipeline stage, using the plurality of flip-flops so as to eliminate the need of a lockup element between the at least one pipeline stage and the plurality of flip-flops. The processor may generate, based on the at least one clock, a second scan chain that connects the at least one pipeline stage and the plurality of flip-flops.

This application discloses a computing system implementing an automatic test pattern generation tool to perform scan chain diagnosis-driven compaction setting. The computing system can perform fault simulation on scan chains in a circuit design describing an integrated circuit, which loads test patterns to the simulated scan chains and unloads test responses from the simulated scan chains. The computing system can determine locations of sensitive bits and locations of unknown bits in each of the scan chains based on the test responses from the simulated scan chains, and generate a configuration for a compactor in the integrated circuit based, at least in part, on the locations of the sensitive bits and the locations of the unknown bits in each of the scan chains, wherein the compactor is configured to compact test responses from the scan chains in the integrated circuit based on the configuration.

Testing of die on wafer is achieved by; (1) providing a tester with the capability of externally communicating JTAG test signals using simultaneously bidirectional transceiver circuitry, (2) providing die on wafer with the capability of externally communicating JTAG test signals using simultaneously bidirectional transceiver circuitry, and (3) providing a connectivity mechanism between the bidirectional transceiver circuitry's of the tester and a selected group or all of the die on wafer for communication of the JTAG signals.

A system for performing a scan test of a processor core includes a scan test module and a processor including a processor core and an input/output die, where the input/output die is coupled to the processor core. The scan test module transmits, in parallel to the input/output die, scan test input data. A serializer/deserializer module of the input/output die receives the input data, serializes the input data, and transmits the serialized input data to the processor core. A serializer/deserializer module of the processor core receives the serialized scan test input data, deserializes the input data, receives result data generated in dependence upon the input data, serializes the result data, and transmits the serialized result data to the input/output die. The input/output die serializer/deserializer module receives the result data, deserializes the result data, and provides the result data to the scan test module. Error detection can be carried out through redundancy.