A system on chip includes a one-time programmable (OTP) memory configured to store secure data, an OTP controller including at least one shadow register configured to read the secure data from the OTP memory and to store the secure data, a power management unit configured to receive an operation mode signal from an external device and to output test mode information indicating whether an operation mode is a test mode according to the operation mode signal and a test valid signal corresponding to the secure data, and a test circuit configured to receive the test mode information from the power management unit, to receive test data from the external device, and to output a scan mode signal and a test mode signal according to the test data and a test deactivation signal, wherein the test deactivation signal corresponds to development state data indicating a chip development state in the secure data.

This disclosure describes a test architecture that supports a common approach to testing individual die and dies in a 3D stack arrangement. The test architecture uses an improved TAP design to facilitate the testing of parallel test circuits within the die.

A falling edge controller includes a controller having an inverted TCK (Test Clock) input, a TMS (Test Mode Select) input, a shift register control output, an update register control output, and a shift output; a shift register having a TDI (Test Data In) input, a shift register control input coupled to the shift register control output, address inputs, a select input, address and select outputs, and a TDO (Test Data Out) output; an update register having address and select inputs coupled to the address and select outputs, an update register control input coupled to the update register control output, address outputs coupled to the address inputs, and a select output coupled to the select input; and address circuitry having address inputs coupled to the address outputs, and having an enable output.

There is provided a semiconductor apparatus including a memory controller; a CPU; a high-speed communication controller; a memory operation terminal group that includes a plurality of memory operation terminals for inputting a first signal propagating between an external memory group and the memory controller; a high-speed communication terminal group that includes a plurality of high-speed communication terminals for inputting a second signal to the high-speed communication controller; an inspection terminal group that includes a plurality of inspection terminals for acquiring information from the CPU and performing debugging; and a terminal mounting surface at which the memory operation terminal group, the high-speed communication terminal group, and the inspection terminal group are provided, in which at the terminal mounting surface, a first inspection terminal among the plurality of inspection terminals is located between the memory operation terminal group and the high-speed communication terminal group.

This disclosure describes a test architecture that supports a common approach to testing individual die and dies in a 3D stack arrangement. The test architecture uses an improved TAP design to facilitate the testing of parallel test circuits within the die.

An integrated circuit (IC) having a memory for storing data also has a memory built in self-test (MBIST) unit coupled to the memory for testing an operation of the memory. A test interface provides test data. Flip-flops of the IC are connected together into at least one serial scan chain. The test interface unit receives test data including MBIST configuration data. The MBIST unit, in a first mode, tests the memory based on the MBIST configuration data at least partly in parallel with a scan test using the scan chain. Thus, both the memory and the logic circuitry can be tested in parallel.

This disclosure describes a test architecture that supports a common approach to testing individual die and dies in a 3D stack arrangement. The test architecture uses an improved TAP design to facilitate the testing of parallel test circuits within the die.

A programming system includes an upper computer, a calculation module, and a first signal conversion module. The calculation module includes a second signal conversion module and a programming interface. The upper computer is configured to convert programming data into first bus signals. When the calculation module is in a normal programming state, the second signal conversion module converts the first bus signals into first clock signals and first data signals to program the calculation module. When the calculation module is in a non-normal programming state, the first signal conversion module converts the first bus signals into second clock signals and second data signals to program the calculation module. A programming method is also provided.

A built-in self-test (BIST) circuit is disclosed which integrates the functions of pins for test input data TDI, test output data TDO and an analog input signal VPP into a single digital/analog input/output module, and internally produces a test trigger signal STROBE and a digital-analog conversion signal ANA. In addition, when there is a need to power the test chip with a voltage or current, a data generation circuit of the BIST circuit can generate a digital-analog conversion signal to change an operating mode of the digital/analog input/output module and hence enable the transmission of analog data. According to the present invention, the testing can be performed with only two pins, which leads to an improvement in test efficiency and a reduction in test cost.

A system comprises a testing mode register, a set of pins, and a test access port controller. The test access port controller initiates a first testing mode by configuring the set of pins according to a first pin protocol. The test access port controller configures a first pin to receive first test pattern data based on a first convention and configures a second pin to output first test result data based on the first test pattern data. Based on detecting a register command stored in the testing mode register, the test access port controller initiates a second testing mode by configuring the set of pins according to a second pin protocol. The test access port controller configures the first pin to receive a second test pattern data generated based on a second convention and configures the second pin to output a second test result data based on the second test pattern data.