A test and measurement device having a signal source, including an impairment generator configured to output an impairment and a waveform synthesizer. The waveform synthesizer receives an input digital signal to be synthesized, receives the impairment, and synthesizes a synthesized digital signal based on the input digital signal and the impairment. The test and measurement instrument also includes a fixed sample rate digital-to-analog converter configured to receive a clock signal and the synthesized digital signal and output an analog signal.

Technologies and methods for detecting voltage spikes on a semiconductor device include detecting a voltage spike in a first analog signal from a semiconductor device based on a comparison of the first analog signal and a first voltage threshold, and converting the first analog signal to a digital signal with a first pulse representing the voltage spike, and transforming the first pulse to a stretched pulse defining a greater width than the first pulse. More specific embodiments include receiving a second analog signal from a first pin on the semiconductor device during a capture time period, receiving a reference analog signal from a reference pin on the semiconductor device during the capture time period, and prior to detecting the voltage spike, generating the first analog signal by computing a difference between the second analog signal and the reference analog signal.

Aspects of the present application are directed to an automated test equipment (ATE) and methods for operating the same for testing high-power electronic components. The inventor has recognized and appreciated an ATE that provides both high-power alternating-current (AC) and direct-current (DC) testing in a single test system can lead to high throughput testing for high-power components with reduced system hardware complexity and cost. Aspects of the present application provide a synchronized inductor switch module and both a high-precision digitizer and a high-speed digitizer for capturing DC and AC characteristics of a high-power transistor.

An exemplary system includes a photodetector configured to generate a plurality of photodetector output pulses over time as a plurality of light pulses are applied to and scattered by a target, a TPSF generation circuit configured to generate, based on the photodetector output pulses, a TPSF representative of a light pulse response of the target, and a control circuit configured to direct the TPSF generation circuit to selectively operate in different resolution modes.

An indication of an operating mode of an asynchronous circuit may be received. A determination may be made as to whether the operating mode of the asynchronous circuit corresponds to a self-test of the asynchronous circuit. In response to determining that the operating mode of the asynchronous circuit corresponds to the self-test, a first clock signal may be provided to a first portion of a self-test component in a feedback path of the asynchronous circuit and a second clock signal may be provided to a second portion of the self-test component in the feedback path of the asynchronous circuit. Furthermore, a test value may be generated based on the first clock signal and the second clock signal.

A test device includes a test mounting circuit having a plurality of semiconductor devices mounted thereon as respective devices-under-test. Each device-under-test includes a corresponding delay control circuit and a target circuit therein. Test logic is provided, which is electrically coupled to the test mounting circuit. The test logic is configured to generate a test input(s), which is provided in parallel to the delay control circuits within the plurality of devices-under-test. The delay control circuits include at least first and second delay control circuits, which are configured to pass the test input(s) to corresponding first and second target circuits during respective first and second test time intervals that are out-of-phase relative to each other in order to achieve more uniform power consumption requirements of the test mounting circuit during testing.

An equivalent time network analyzer and method estimates a device-under-test's frequency response by acquiring its time domain response through equivalent time over-sampling. The analyzer has a timing system producing two time bases differing in period by less than one part per million, resulting in a linearly varying phase difference. A high frequency stimulus generator, synchronized to the first time basis, creates a periodic waveform that contains energy at harmonics of the first time basis. An output capture cell that captures the response of the device-under-test includes a high bandwidth input comparator, a memory element clocked to the second time basis, and a low bandwidth feedback filter that provides a low frequency analog estimate of the time domain response of the device-under-test as feedback to the input comparator and as output from the capture cell. The analyzer may also include input capture cells, multiple stimulus generators, and/or multiple output capture cells.

A method can be used to test an electronic circuit. The method includes applying a test stimulus signal to the input node, collecting a sequence of N-bit digital test data at the output port. The N-bit digital test data is determined by the test stimulus signal applied to the input node. The method also includes applying N-bit to R-bit lossless compression to the N-bit digital test data to obtain R-bit compressed test data (R is less than N) and making the R-bit compressed test data available in parallel format over R output pins of the circuit.

A chip test device and a chip test method are provided. The chip test device may include a chip socket and an interface card comprising a signal synthesizer, a plurality of first interfaces and a second interface. The signal synthesizer may be configured to synthesize a plurality of low-frequency first signals output from a plurality of testers into a high-frequency second signal and transmit the second signal to the chip socket. The plurality of first interfaces may be arranged in a plurality of inputs of the signal synthesizer for connecting the testers, and the second interface may be arranged in an output of the signal synthesizer for connecting the chip socket. By synthesizing the low-frequency first signals into the high-frequency second signal, a high-frequency test may be conducted using a plurality of low-frequency testers.

A test apparatus may include transceivers and a global de-skew circuit. In a training mode, the transceivers provide first timing information obtained by delaying a first data signal in the range of up to a preset unit interval based on a clock signal and receive second timing information corresponding to timing differences between a slowest transceiver and the remaining transceivers. In an operation mode, the transceivers provide compensation data to a plurality of DUTs (Devices Under Test) substantially simultaneously. The compensation data may be obtained by delaying a second data signal by multiples of the preset unit interval in response to the second timing information. In the training mode, the global de-skew circuit receives the first timing information, calculates, using the first timing information, the timing differences between the slowest transceiver and the remaining transceivers, and provides the second timing information corresponding to the timing differences to the transceivers.