The present disclosure provides a wafer test system and methods thereof. The test system includes a probe apparatus, a data server, an automation subsystem, and a probe mark assessment subsystem. The probe apparatus includes a probe card, a tester, and a camera. The probe card includes probe pins for contacting test pads in the wafer, and the camera captures an image of the test pads. The automation subsystem obtains an image specification from the probe apparatus and triggers an automated assessment of a probe mark in the image of the test pads. The probe mark assessment subsystem performs the automated assessment of the probe mark in the image of the test pads. The probe mark assessment subsystem performs an image-processing operation to obtain a probe mark assessment result, and the automation subsystem stops the probe apparatus if the probe mark assessment result indicates a probe test failure.

A testing system for monitoring a machine under test is disclosed and includes one or more high frequency sensors configured to generate a sensor signal that is representative of an operating parameter of the machine. The high frequency sensors have a required high frequency sampling rate. The testing system also includes a notification device configured to generate a notification indicating the operating parameter monitored by the high frequency sensors has exceeded a predefined threshold value and a data acquisition control module configured to monitor the high frequency sensors at a first sampling rate. The testing system also includes a monitoring control module in electronic communication with the notification device. The monitoring control module is configured to monitor the high frequency sensors at a second sampling rate that is greater than the first sampling rate and at least equal to the required high frequency sampling rate.

A method tests at least three devices, each device including a test chain having a plurality of positions storing test data. The testing includes comparing test data in a last position of the test chain of each of the devices, and shifting test data in the test chains of each of the devices and storing a result of the comparison in a first position of the test chains of each of the devices. The comparing and the shifting and storing are repeated until all the stored test data has been compared. The at least three devices may have a same functionality and a same structure.

A memory device may be provided. The memory device may include a test data output circuit configured to compare lower data output from a lower data storage region with upper data output from an upper data storage region and make a decision. The memory device may include a data transmitter configured to output the lower data by inverting or noninverting the lower data according to the decision. The memory device may include a test control circuit generates a test control signal according to a test read signal and an address signal.

Disclosed in some examples are methods, systems, memory devices, machine readable mediums configured to intentionally degrade NAND performance when a value of a NAND health metric indicates a potential for failure to encourage users to replace or backup their devices before data loss occurs. For example, the system may track a NAND health metric and when that metric reaches a predetermined threshold or state, the system may intentionally degrade performance. This performance degradation may be more effective than a warning to effect device backup or replacement.

An automated test equipment for testing one or more devices under test comprising a plurality of port processing units, comprising at least a respective buffer memory, and a respective high-speed-input-output, HSIO, interface for connecting with at least one of the devices under test. The port processing units are configured to receive data, store the received data in the respective buffer memory, and provide the data stored in the respective buffer memory to one or more of the connected devices under test via the respective HSIO interface for testing the one or more connected devices under test. A method and computer program for automated testing of one or more devices under test are also described.

An automated test equipment for testing one or more devices under test, comprises at least one port processing unit, comprising a high-speed-input-output interface, HSIO, for connecting with at least one of the devices under test, a memory for storing data received by the port processing unit from one or more connected devices under test, and a streaming error detection block, configured to detect a command error in the received data, wherein the port processing unit is configured to, in response to detection of the command error, limit the storing in the memory of data following, in the received data, after the command which is detected to be erroneous. A method and computer program for automated testing of one or more devices under test are also described.

The disclosure provides an online test data record and offline data conversion analysis system and a method thereof. In the present disclosure, the test process information of the production line testing system performed on the circuit board to be tested is generated into online test result data in a database file format, and the offline analysis system receives the online test data from the production line testing system. The offline analysis system reads the corresponding data in the online test result data according to the designated data in the data designated instruction, and generates the offline test result data in the designated file format of the data designated instruction, and the offline analysis system perform the data analysis for the offline test result according to the analysis instruction.

A semiconductor test apparatus is provided. The semiconductor test apparatus includes: a test management unit determining a test mode, generating a test signal in accordance with the determined test mode, and transmitting the test signal to fail memories; and one or more fail memory boards including the fail memory, which store fail signals generated as a result of a test conducted in accordance with the test signal and address information of the fail signals, wherein if the determined test mode is a first test mode, at least some of the failure memory boards are powered off.

A method and an apparatus for testing a chip, as well as a storage medium, and a chip thereof are provided. The chip includes an operation module. The method includes receiving, via a first pin of the chip, a test control signal indicating a test type of the operation module; performing a first test for the operation module using a first test vector based on the test type; or performing a second test for the operation module using a second test vector, where the first test is a test for the memory included in the operation module and the second test is a test for the functional logic in included in the operation module.