A sensor installed into a mold including a cable insertion member having a fixing portion with a fitting recess is provided. The sensor includes an optical fiber a part of which is bendable, and a fiber holder having a fiber insertion portion through which the optical fiber is inserted and a to-be-fixed portion extending from the fiber insertion portion. Further, the to-be-fixed portion is fixed to the fixing portion while being fitted to the fitting recess.

An optical module has an optical port and an electrical port, and includes a shell, a circuit board, a circuit adapter board, a silicon optical chip, a light source and an optical fiber socket. The circuit board is disposed in the shell. One end of the circuit board is provided with a connecting finger located in the electrical port. The circuit adapter board is disposed on and electrically connected to the circuit board. A thermal expansion coefficient of the circuit adapter board is lower than that of the circuit board. The silicon optical chip is disposed on and electrically connected to the circuit adapter board. The light source is disposed on the circuit board, is electrically connected to the circuit board, and is optically connected to the silicon optical chip. The optical fiber socket is optically connected to the silicon optical chip, and is configured to form the optical port.

A temperature compensation module mounted in an arrayed waveguide grating (AWG) comprises a base attached to the AWG and a moving member attached to the base, wherein the base comprises: a first fixing part attached to a first sub chip of the AWG; a second fixing part attached to a second sub chip of the AWG; a hole which is a gap between the first fixing part and the second fixing part, and is disposed to include, within the gap, a cut surface for dividing the AWG into the first sub chip and the second sub chip; and a ‘’-shaped elastic part, wherein the moving member is attached to the first fixing part so as to horizontally move the first sub chip of the AWG in the direction of decreasing central wavelength changes caused by temperature changes.

A sensor installed into a mold including a cable insertion member having a fixing portion with a fitting recess is provided. The sensor includes an optical fiber a part of which is bendable, and a fiber holder having a fiber insertion portion through which the optical fiber is inserted and a to-be-fixed portion extending from the fiber insertion portion. Further, the to-be-fixed portion is fixed to the fixing portion while being fitted to the fitting recess.

An apparatus and method for temperature compensation, belonging to the technical field of optical communications, and particularly an apparatus and method for implementing bilinear temperature compensation of an arrayed waveguide grating is disclosed. The apparatus consists of two drivers. A first driver performs linear compensation in a range lower than normal temperature 25° C. to −40° C. (low-temperature area) or a range higher than ambient temperature 25° C. to 85° C. (high-temperature area). A second driver is used to realize nonlinear compensation of superimposed effect of AWG chip wavelength/temperature in another temperature area. Two parts of the chip after being divided have different relative displacement/effective compensation amounts in different temperature ranges, having over-compensation in the high-temperature area and under-compensation in the low-temperature area, so that a center wavelength of the AWG chip appears as two gentle curves with temperature change. The residual nonlinear temperature effect is effectively reduced.

An apparatus and method for temperature compensation, belonging to the technical field of optical communications, and particularly an apparatus and method for implementing bilinear temperature compensation of an arrayed waveguide grating is disclosed. The apparatus consists of two drivers. A first driver performs linear compensation in a range lower than normal temperature 25 C. to 40 C. (low-temperature area) or a range higher than ambient temperature 25 C. to 85 C. (high-temperature area). A second driver is used to realize nonlinear compensation of superimposed effect of AWG chip wavelength/temperature in another temperature area. Two parts of the chip after being divided have different relative displacement/effective compensation amounts in different temperature ranges, having over-compensation in the high-temperature area and under-compensation in the low-temperature area, so that a center wavelength of the AWG chip appears as two gentle curves with temperature change. The residual nonlinear temperature effect is effectively reduced.

A temperature compensation module mounted in an arrayed waveguide grating (AWG) comprises a base attached to the AWG and a moving member attached to the base, wherein the base comprises: a first fixing part attached to a first sub chip of the AWG; a second fixing part attached to a second sub chip of the AWG; a hole which is a gap between the first fixing part and the second fixing part, and is disposed to include, within the gap, a cut surface for dividing the AWG into the first sub chip and the second sub chip; and a -shaped elastic part, wherein the moving member is attached to the first fixing part so as to horizontally move the first sub chip of the AWG in the direction of decreasing central wavelength changes caused by temperature changes.

An athermal optical waveguide structure such as an optical add drop multiplexer (OADM) or the like is fabricated by a method that includes forming a lower cladding layer on a substrate. A waveguiding core layer is formed on the lower cladding layer. An upper cladding layer is formed on the waveguiding core layer and the lower cladding layer a sol-gel material. The sol-gel material includes an organically modified siloxane and a metal oxide. A thermo-optic coefficient of the sol-gel material is adjusted by curing the sol-gel material for a selected duration of time at a selected temperature such that the thermo-optic coefficient of the sol-gel material compensates for a thermo-optic coefficient of at least the waveguiding core layer such that an effective thermo-optic coefficient of the optical waveguide structure at a specified optical wavelength and over a specified temperature range is reduced.

In an example, an Echelle grating wavelength division multiplexing (WDM) device includes a first waveguide, a slab waveguide, multiple second waveguides, an Echelle grating, and a metal-filled trench. The first waveguide includes either an input waveguide or an output waveguide. The multiple second waveguides are optically coupled to the first waveguide through the slab waveguide. The multiple second waveguides include multiple output waveguides if the first waveguide includes the input waveguide or multiple input waveguides if the first waveguide includes the output waveguide. The Echelle grating includes multiple grating teeth formed in the slab waveguide. The metal-filled trench forms a mirror at the grating teeth to reflect incident light from the first waveguide toward the multiple second waveguides or from the multiple second waveguides toward the first waveguide.

An optical module has an optical port and an electrical port, and includes a shell, a circuit board, a circuit adapter board, a silicon optical chip, a light source and an optical fiber socket. The circuit board is disposed in the shell. One end of the circuit board is provided with a connecting finger located in the electrical port. The circuit adapter board is disposed on and electrically connected to the circuit board. A thermal expansion coefficient of the circuit adapter board is lower than that of the circuit board. The silicon optical chip is disposed on and electrically connected to the circuit adapter board. The light source is disposed on the circuit board, is electrically connected to the circuit board, and is optically connected to the silicon optical chip. The optical fiber socket is optically connected to the silicon optical chip, and is configured to form the optical port.