A deformable mirror and capacitive array controller is capable of controlling a plurality of individual actuators by applying independent voltages from 0V to 240V to each actuator. The device utilizes a distributed microcontroller (MCU) architecture, including a main microcontroller and a plurality of slave microcontrollers to maximize actuator voltage refresh rate. One Slave MCU may be used for up to 384 actuators. For maximizing actuator refresh rate, each Slave MCU may be limited to 192 actuators. The final circuit stage includes a digital/analog converter, a voltage sample and hold and a high voltage amplifier, all packaged in a single integrated circuit. These integrated circuits are referred hereinafter as HV S&H (high voltage sample and hold). A flexible, stacked PCB assembly significantly reduces overall footprint and weight compared to conventional devices. The device's power consumption is nearly an order of magnitude less than that of a conventions adaptive optical system.

An apparatus for driving and position sensing in a comb-drive actuator includes a generator, a driver circuit, sensing circuitry, and signal processing circuitry. The generator is configured to apply a sensing-voltage to a first electrode of the comb-drive actuator. The driver circuit is configured to apply a drive-voltage to a second electrode of the comb-drive actuator, having an opposite polarity relative to the first electrode. The sensing circuitry is configured to measure at the second electrode a sensed-waveform resulting from the sensing-voltage applied to the first electrode. The signal processing circuitry is configured to estimate a position of the first electrode relative to the second electrode based on the sensed-waveform.

An optical device includes a first waveguide having a longitudinal axis and a first end facet inclined at a non-normal angle to the longitudinal axis, and a second waveguide, which has a second end facet and is fixed with the second end facet in proximity to and parallel with the first end facet. An actuator is coupled to move the first end facet of the first waveguide in a direction transverse to the longitudinal axis between a first position in which a distance between the first and second end facets is less than 25 nm, and a second position in which the distance between the first and second end facets is greater than 300 nm.

Hybrid optical integration places very strict manufacturing tolerances and performance requirements upon the multiple elements to exploit passive alignment techniques as well as having additional processing requirements. Alternatively, active alignment and soldering/fixing where feasible is also complex and time consuming with 3, 4, or 6-axis control of each element. However, microelectromechanical (MEMS) systems can sense, control, and activate mechanical processes on the micro scale. Beneficially, therefore the inventors combine silicon MEMS based micro-actuators with silicon CMOS control and drive circuits in order to provide alignment of elements within a silicon optical circuit either with respect to each other or with other optical elements hybridly integrated such as compound semiconductor elements. Such inventive MEMS based circuits may be either maintained as active during deployment or powered off once the alignment has been locked through an attachment/retention/latching process.

Wavelength division multiplexing (WDM) has enabled telecommunication service providers to provide multiple independent multi-gigabit channels on one optical fiber. To meet demands for improved performance, increased integration, reduced footprint, reduced power consumption, increased flexibility, re-configurability, and lower cost monolithic optical circuit technologies and microelectromechanical systems (MEMS) have become increasingly important. However, further integration via microoptoelectromechanical systems (MOEMS) of monolithically integrated optical waveguides upon a MEMS provide further integration opportunities and functionality options. Such MOEMS may include MOEMS mirrors and optical waveguides capable of deflection under electronic control. In contrast to MEMS devices where the MEMS is simply used to switch between two positions the state of MOEMS becomes important in all transition positions. Improvements to the design and implementation of such MOEMS mirrors, deformable MOEMS waveguides, and optical waveguide technologies supporting MOEMS devices are presented where monolithically integrated optical waveguides are directly supported, moved and/or deformed by a MEMS.

An optical device includes a first waveguide having a longitudinal axis and a first end facet inclined at a non-normal angle to the longitudinal axis, and a second waveguide, which has a second end facet and is fixed with the second end facet in proximity to and parallel with the first end facet. An actuator is coupled to move the first end facet of the first waveguide in a direction transverse to the longitudinal axis between a first position in which a distance between the first and second end facets is less than 25 nm, and a second position in which the distance between the first and second end facets is greater than 300 nm.

The invention provides a device comprising a movable micromirror adapted to receive light from one or more light source(s) and manipulate the reflected light. The micromirror can be actuated electrothermally. In particular, the micromirror is adapted to do at least one of: (a) tipping along a first axis; (b) tilting along a second axis; (c) changing focal length (i.e., varifocal mode); and (d) elevating (i.e., piston mode). The invention also provides a system comprising at least one device comprising a movable micromirror and at least one light source. The invention can be used in smart lighting applications.

A backlight assembly includes a light source, a light guide optically coupled to the light source that receives light from the light source, a substrate including an electrode layer and a hydrophobic surface located on the electrode layer, wherein the hydrophobic surface of the substrate is spaced apart from a surface of the light guide to define a cell gap, and a plurality of conductive liquid beads located within the cell gap. Liquid beads that are subject to an actuation voltage applied to the electrode layer are in an actuated state, and liquid beads that are not subject to an actuation voltage applied to the electrode layer are in a non-actuated state. When the liquid beads are in the non-actuated state, the liquid beads are in contact with the surface of the light guide for extracting light from the light guide, and when the liquid beads are in the actuated state, the liquid beads deform such that contact of the liquid beads with the surface of the light guide is reduced relative to the non-actuated state to reduce extraction of light from the lightguide, thereby dimming the backlight assembly.

A rotating or tilting MEMS structure, such as a tilt mirror for an optical device, includes a damping mechanism, provided by locating an inlay block structure underneath the MEMS rotating surface. Damping is created by the temporary squeezing or compression of the air, atmosphere, or gas(es) surrounding the MEMS structure, between the underside of the MEMS tilting surface and the top surface of the block. Movement of the MEMS surface away from the top surface of the block will also be damped by the temporary reduction in pressure. The block structure is fabricated separately from the MEMS tilt-mirror structure and located under the MEMS tilt-mirror structure, either before or during the die-attach or die-bonding process. The damping effect serves to minimize and limit the amplitude and duration of oscillatory motion of the MEMS tilt-mirror, following intentional movement of the mirror, or, in response to external shock and vibrational forces.

Systems and methods to amplify the response of a MEMS micro-oscillator by driving the MEMS device at its electrical and mechanical resonance frequencies, simultaneously. This enhances the MEMS mechanical sensitivity to electrical excitation and increases the voltage across the MEMS capacitor. Moreover, using a combination of two input signals at different frequencies (beat signal) may be used to achieve double resonance in any MEMS device, even if its natural frequency is far from its electrical resonance.