A silicon photonic (SiPh) packaging assembly includes a SiPh interposer and a wafer. The SiPh interposer has one or more optical gratings disposed thereon to couple an optical signal traversing the wafer. The wafer is bonded to the interposer, with the wafer including one or more microlenses, each microlens aligned with a respective optical grating and designed to direct the optical signal traversing the wafer at a desired angle.

This disclosure generally relates to high-speed fiber optic networks that use light signals to transmit data over a network. The disclosed subject matter includes devices and methods relating to multi-lens optical components and/or optoelectronic subassemblies. In some aspects, devices and methods relate to an optical component including a housing defining a cavity and a lens array having a plurality of lenses on an optically transmissive portion of the housing. In some aspects, devices and methods relate to an optical component including a substrate; and a lens array on the substrate, the lens array having a plurality of discrete lenses.

An avionics unit for an avionics network is disclosed having a light emitter to provide a modulated broadband optical signal. The avionics unit also includes a first optical interface and a second optical interface. The first optical interface is optically connected to the light emitter and is to receive a removable wavelength selective filter to extract a modulated narrowband optical signal from the modulated broadband optical signal. The second optical interface is optically connected to the first optical interface and is to output the modulated narrowband optical signal.

Inverted 45° semiconductor mirrors as vertical optical couplers for PIC chips, particularly optical receivers and transmitters. An inverted 45° semiconductor mirror functions to couple light between a plane in the PIC chip defined by thin film layers and a direction normal to a top surface of the PIC chip where it may be generated or collected by an off-chip component, such as a wire terminal. In an exemplary embodiment, a (110) plane of a cubic crystalline semiconductor may provide a 45° facet inverted relative to a (100) surface of the semiconductor from which light is to be emitted. In further embodiments, a (110) plane may be exposed by undercutting a device layer of a semiconductor on insulator (SOI) substrate. Alternatively, a pre-etched substrate surface may be bonded to a handling wafer, thinned, and then utilized for PIC waveguide formation.

The present invention is based on a two-dimensional photonic crystal in which defects are inserted in a controlled manner, has the main function of division of the power of an input signal, excited in one of its six waveguides, among other three waveguides (output ones), while keeping isolation of the input port by means of two other waveguides. The operating principle of the device is based on the alignment of a dipole mode excited in the resonant cavity, in such a way that the nodes of this mode are oriented in the direction of two waveguides, so that these waveguides are not excited. Due to this alignment, each of the three output waveguides receive about one third of the power of input signal. The orientation of dipole mode is controlled by the applied DC magnetic field and the physical and geometrical parameters of the resonator.

A compact and highly efficient coupling structure for coupling between DFB-LD and Si PIC edge coupler with suppressed return loss may include a DFB-LD, a Si PIC comprising at least one input edge coupler and at least one output edge coupler, a silica cover lid disposed on the Si PIC and aligned edge to edge with the Si PIC, a single-mode fiber aligned to the at least one output edge coupler of the Si PIC, a lens disposed between the DFB-LD and the at least one input edge coupler of the Si PIC, and an isolator bonded to a facet of the at least one input edge coupler with a first volume of an index matching fluid. The lens may be configured to minimize a mismatch between an output spot size of the DFB-LD and a spot size of the at least one input edge coupler of the Si PIC.

A coaxial transmitter optical subassembly (TOSA) including an optical fiber coupling receptacle coupled to a laser package may be used in an optical transceiver for transmitting an optical signal at a channel wavelength. The optical fiber coupling receptacle may include a housing having a first open end to receive a ferrule-terminated optical fiber. The receptacle may also include a fiber-coupling ferrule holding an optical fiber segment and secured within the housing to optically couple the optical fiber segment to a laser of the TOSA through a second open end of the housing opposite the first open end. The receptacle may further include a sleeve disposed on an interior surface of the housing to provide a cavity to secure the ferrule-terminated optical fiber and align the optical fiber to the optical fiber segment.

A coaxial transmitter optical subassembly (TOSA) with optical isolator alignment correction may be used in an optical transceiver for transmitting an optical signal at a channel wavelength. The coaxial TOSA includes an optical fiber coupling receptacle extending from a laser package. The laser package may include a laser diode and a lens to focus laser light emitted from the laser diode onto an optical fiber. The laser diode and lens are aligned along a first longitudinal axis of the laser package parallel to a transmission path of the laser light. An optical isolator located in the transmission path is aligned along a second longitudinal axis of the laser package. The second longitudinal axis is coincident with a centerline of the laser package, and the first longitudinal axis is offset from the second longitudinal axis by a predetermined offset distance to compensate for light shifting characteristics of the isolator.

An optical component assembly includes a light-guiding member; a cylindrical member which retains the light-guiding member in a through hole thereof; and a projection which is provided at one end of the cylindrical member so as to extend beyond an outer periphery of the cylindrical member, and is engageable in a groove which is formed in a cylindrical shell so as to extend in an axial direction of the cylindrical shell and then turn at a distal end thereof in a circumferential direction of the cylindrical shell. By fixing the cylindrical shell to the projection, the cylindrical shell becomes attachable and detachable. It is possible to provide an optical receptacle and a transceiver module for optical communications having easy removal of foreign matters.

Aspects described herein include a method comprising arranging a laser die on a substrate. The laser die has multiple channels that are arranged with a first planar arrangement proximate to a facet of the laser die. The method further comprises aligning a single lens to the facet, and aligning a multicore optical fiber to the laser die through the single lens. The multicore optical fiber has a plurality of optical cores that are arranged with a second planar arrangement. Aligning the multicore optical fiber to the laser die comprises rotationally aligning the multicore optical fiber to align the second planar arrangement with the first planar arrangement.