A light intensity modulator includes an input optical fiber; an output optical fiber; an optical arrangement having a lens, where the optical arrangement is configured to receive light from the input optical fiber, pass the light through the lens, and direct the light to the output optical fiber; and a piezoelectric device coupled to the lens, where the piezoelectric device is configured for moving the lens to alter overlap of the output optical fiber and the light directed to the output optical fiber to modulate intensity of light in the output optical fiber.

An optical module includes: a first lens and a second lens provided between a light emitter and a light receiver; and a base member on which the light emitter and the light receiver are placed, and each of the first lens and the second lens is fixed via an adhesive resin. A first bonding direction in which a first bonding surface of the first lens is bonded and fixed via an adhesive resin, and a second bonding direction in which a second bonding surface of the second lens is bonded and fixed via an adhesive resin are respectively perpendicular to an optical axis direction of light, and an orientation of the first bonding surface and an orientation of the second bonding surface make are different from each other.

Aspects described herein include a method including arranging a laser die on a substrate. The laser die has multiple channels that are arranged with a first planar arrangement proximate to a facet of the laser die. The substrate is arranged on a housing component. The method further includes aligning a single lens to the facet, and aligning a multicore optical fiber to the laser die through the single lens. The multicore optical fiber has a plurality of optical cores that are arranged with a second planar arrangement. Aligning the multicore optical fiber to the laser die includes attaching the multicore optical fiber to the housing component and rotationally aligning the multicore optical fiber to align the second planar arrangement with the first planar arrangement.

A laser alignment system is used to align an output fiber with a fiber laser, for example, when coupling a feeding fiber to a process fiber using a beam coupler or switch. The alignment system includes a laser alignment apparatus that is coupled at a first end to the output fiber and at a second end to a beam dump/power meter. The alignment apparatus defines a light passage and a light capture chamber along the light passage. When light is not aligned into the core of the output fiber, at least a portion of the light passing out of the output fiber will be captured by the light capture chamber and detected by a photodetector in optical communication with the light capture chamber. By monitoring the readings of the photodetector, the output fiber may be properly aligned with the laser light from the fiber laser.

A fiber plug facilitates optical coupling of a light-guiding fiber to a plug receptacle and includes a plug housing for receiving and locking parts of the fiber plug in position relative to one another. The plug housing has: a fiber inlet and a fiber bearing for the spatially fixed reception of the fiber; optically downstream of the fiber bearing along a beam path, an optical lens for collecting light exiting at an end face of the light-guiding fiber and for collimating the collected light; and a coupling surface with an output of the beam path and with a coupling structure for connection to a receptacle structure that is complementary to the coupling structure. An adjustable optical element is arranged optically downstream of the fiber bearing in the beam path and has a first component of a magnetic coupling consisting of two components and a first component of a kinematic coupling.

A laser alignment system is used to align an output fiber with a fiber laser, for example, when coupling a feeding fiber to a process fiber using a beam coupler or switch. The alignment system includes a laser alignment apparatus that is coupled at a first end to the output fiber and at a second end to a beam dump/power meter. The alignment apparatus defines a light passage and a light capture chamber along the light passage. When light is not aligned into the core of the output fiber, at least a portion of the light passing out of the output fiber will be captured by the light capture chamber and detected by a photodetector in optical communication with the light capture chamber. By monitoring the readings of the photodetector, the output fiber may be properly aligned with the laser light from the fiber laser.

An alignment means of a measurement instrument includes a housing an optical component having a principal axis in a direction parallel to a desired alignment; a first light source positioned at a first distance S1 from the optical component and at a first height h1 from the principle axis; a second light source positioned at a second distance S2 from the optical component and at a second height h2 from the principle axis; and an angle barrier means arranged between the optical component, and the first and second light sources. The housing, the optical component, and the angle barrier means are arranged to block visibility of the first light source along the principal axis at a distance superior to d1′; and block visibility of the second light source along the principal axis at a distance smaller than d2, wherein d2 is smaller than d1′.

An optical ferrule has a different thermal expansion coefficient than a substrate to which a optical device is mounted, the ferrule optically coupling the device to one or more optical fibers. The optical ferrule includes and/or a cradle in which the ferrule is mounted include lateral and longitudinal engagement feature that ensure alignment with the optical device at an operating temperature, the ferrule expanding relative to the substrate when transitioning to the operating temperature.

Systems and methods described herein relate to the manufacture of optical elements and optical systems. An example method includes providing a first substrate that has a plurality of light-emitter devices disposed on a first surface. The method includes providing a second substrate that has a mounting surface defining a reference plane. The method includes forming a structure and an optical spacer on the mounting surface of the second substrate. The method additionally includes coupling the first and second substrates together such that the first surface of the first substrate faces the mounting surface of the second substrate at an angle with respect to the reference plane.

An optoelectronic assembly may include a photonic integrated circuit (PIC) with a top surface and a laser with a top surface and a bottom surface. The optoelectronic assembly may also include a housing configured to cooperate with the PIC to one or both of house and support one or more components. The housing may include a PIC mount including a first surface to interface with the top surface of the PIC, and a laser mount including a second surface to interface with the top or bottom surface of the laser. The first surface and the second surface may be parallel to each other.