A system for passive alignment of fibers to an interface of a photonic integrated circuit (PIC) includes an input frame, an actuator, and an output frame. The actuator arranged to apply force along a force axis to the input frame. The output frame including a tip for picking up a plate and transferring the force thereto, the output frame being connected to the input frame such that the output frame may tilt relative to the input frame and the output frame is elastically biased relative to the input frame into a position wherein the tip is aligned on the force axis.

An optical assembly includes an optical ferrule configured to receive light from an optical waveguide and including at least four ferrule alignment features; and a cradle securing the optical ferrule therein and configured to align the optical ferrule to an optical component, the cradle including at least four cradle alignment features configured to make contact or near contact with the at least four ferrule alignment features in a one to one correspondence in at least four corresponding contact regions, such that as a temperature of at least one of the cradle and the optical ferrule changes sufficiently, the corresponding alignment features of the optical ferrule and the cradle slide relative to each other causing the corresponding alignment features of the optical ferrule and the cradle to move to define corresponding traversed regions, such that when extended, the traversed regions of the at least four ferrule alignment features and the at least four cradle alignment features pass within 20 microns of a same first point.

An optical module having an externally-mounted magnetic ring and a chip positioning angle and a pressing block structure thereof are disclosed. The pressing block structure includes a pressing block. The pressing block includes a pressing block body. The pressing block body is provided with an insertion core positioning hole, a chip accommodating hole, and a magnetic ring accommodating chamber. The chip accommodating hole is provided with at least one positioning angle. The overall assembly accuracy of the optical module is improved, the material cost of the isolator chip is reduced, the positioning of the chip is more accurate, and the occurrence of glue overflow can be avoided.

Aspects described herein include an apparatus supporting optical alignment with one or more optical waveguides optically exposed along an edge of a photonic integrated circuit (IC). The apparatus comprises a frame body comprising an upper portion defining a reference surface, and a lateral portion defining an interface for an optical connector connected with one or more optical fibers. The lateral portion comprises one or more optical components defining an optical path through the lateral portion. The one or more optical components are arranged relative to the reference surface such that the one or more optical components align with (i) the one or more optical waveguides along at least one dimension when the reference surface contacts a top surface of an anchor IC, and with (ii) the one or more optical fibers when the optical connector is connected at the interface.

An optical waveguide package includes a substrate, a cladding on a first surface of the substrate, and a core in the cladding. The cladding has a recess surrounding an element mount. The recess has an inner wall surface including a plurality of wall surfaces and a corner support surface between adjacent wall surfaces of the plurality of wall surfaces.

An optoelectronic device. The device comprising: a silicon-on-insulator, SOI, wafer, the SOI wafer including a cavity and an input waveguide, the input waveguide being optically coupled into the cavity; and a mirror, located within the cavity and bonded to a bed thereof, the mirror including a reflector configured to reflect light received from the input waveguide in the SOI wafer.

The photoelectric signal conversion and transmission device includes a photoelectric signal module and a fiber joint, matched and coupled together. A circuit board of the photoelectric signal module includes one or more connection bases. Light emission elements, light reception elements, and amplifiers are configured on a first coupling face of the connection based, and electrically connected by first and second wires. The fiber joint includes a number of fibers axially aligned with the light emission and reception elements. By having the light emission and reception elements and amplifiers configured on a same coupling face, their physical connection distance is reduced, thereby decreasing signal attenuation, enhancing signal transmission performance, and facilitating structural miniaturization.

A chip-scale transceiver includes an interposer having microspring electrical contacts disposed on the interposer substrate. At least one electronic chip and at least one optoelectronic chip are electrically coupled to the interposer through the microsprings. The electronic chip includes at least one of an amplifier array and a laser driver array. First electrical contact pads arranged to make electrical contact with the first microsprings of the interposer. The optoelectronic chip includes at least one of a laser array and a photodetector array. Second electrical contact pads arranged to make electrical contact with the second microsprings of the interposer are disposed on the optoelectronic chip substrate. The transceiver has an area less than or equal to 0.17 mm.sup.2 per Gbps.

The invention relates to a positioning apparatus (100) for positioning a light-guiding fiber (206) in a calibration port (208) of a medical apparatus (202) comprising at least one light source (204) for the light-guiding fiber (206), wherein the positioning apparatus (100) comprises an elongate body (102) with two end faces (110, 112) and at least one side face (116). A channel (104) for receiving the light-guiding fiber (206) is formed in the body (102), said channel extending along a longitudinal axis of the body (102) proceeding from a first end face (110). Here, according to the invention, provision is made for the body (102), at least in one portion, to consist of an opaque material in the region of the channel (104) and/or to be coated with an opaque material and for said body to have at least one cutout (113, 118), which extends from a side face (116) and/or the second end face (112) of the body (102) to the channel (104) such that radiation emitted by the light-guiding fiber (206) can only emerge from the positioning apparatus (100) in unimpeded fashion through the at least one cutout (113, 118).

Precisely aligned assemblies can be complex, time consuming, labor intensive, and expensive and a need exists for better alternatives. Systems and methods described herein yield high precision printed circuit board assemblies (PCBAs) that contain pre-built alignment features to address this need. The work of precisely locating components on the PCBA to a final position in the overall assembly is already built in to the board. Locating features are used to precisely position one or more components, such as optical components, electro optical components, or mechanical components in assemblies. The locating features may be used to constrain the positions of those components, such as by kinematic coupling, solder wetting dynamics, semiconductor cleaving, dicing, photolithographic techniques for etching, constant contact force, and advanced adhesive technology to result in optical level positioning that significantly improves or eliminates assembly alignment challenges.