An optical transmission device is provided. A substrate includes an optical transmission channel exposed on its end surface, and a first positioning portion. A jumper includes a mounting portion abutting the end surface and a second positioning portion engaged to the first positioning portion. An optical fiber is mounted to the mounting portion, and the end surface of the optical fiber aligns with the optical transmission channel. The coupling method of the optical transmission device includes steps: forming at least one first hole on the substrate, forming an optical transmission layer with at least one optical transmission channel on the substrate, forming an alignment mark on the optical transmission layer within the first hole, forming at least one second hole on the substrate based on the alignment mark, and connecting the jumper to the second hole and make the jumper abutting against the substrate.

An optical fiber connector is provided. A receptacle has an angled interior surface that acts to guide an optical fiber into the correct position as a jack is inserted into the receptacle.

An optoelectronic device includes a carrier, an electronic component, a photonic component and a supportive component. The electronic component is electrically coupled to the carrier. The photonic component is electrically coupled to the electronic component. The supportive component is disposed outside the photonic component and the electronic component and configured to support an optical component.

An object is, in a pluggable optical module, to compactly house an optical fiber used for connecting optical components in a housing in which a plurality of optical components are mounted. The pluggable optical module (100) includes: a plurality of optical components, a printed circuit board (51); one or more optical fibers; and optical fiber housing means (14). All or a part of the plurality of optical components are mounted on the printed circuit board (51). One or more optical fibers connect between the plurality of optical components. The optical fiber housing means (14) includes a guide that is disposed on a plate-like member and can wind the one or more optical fibers, and mounted to be stacked with the printed circuit board (51) on which the optical components are mounted and all or a part of optical components other than the optical components mounted on the printed circuit board (51).

A laser source assembly is based upon an optical reference substrate that is utilized as a common optical reference plane upon which both a fiber array and a laser diode array are disposed and positioned to provide alignment between the components. Passive optical components used to provide alignment between the laser diode array and the fiber array are also located on the optical reference substrate. A top surface of the reference substrate is patterned to include alignment fiducials and bond locations for the fiber array receiving block, laser diode array submount and passive optical components. The receiving block is configured to present the optical fibers at a height that facilitates alignment with the output beams from the laser diodes positioned on the silicon submount.

An optical fiber array module that can accommodate variations in diameters of the optical fibers in the fiber array within anticipated tolerance, to accurately and securely retain the optical fibers in grooves in the module without using any solder interface or epoxy interface between the optical fibers and the supporting components. The fiber array module of the present invention relies on elasto-plastic interfaces for mechanical deformation, as opposed to solder reflow or epoxy curing, to accommodate variations in diameters of the optical fibers in the fiber array as supported in grooves between a substrate and a cover.

Embodiments herein describe an optical system that includes a photonic integrated circuit (PIC) bonded to a package containing an electrical integrated circuit (EIC). However, this bond can prevent an edge coupler from optically aligning an optical fiber to an edge of the PIC in order to transfer optical signals. To provide room for the edge coupler, the PIC is arranged to overhang the package containing the EIC so that the package does not interfere with the ability of the edge coupler to align with the side or edge of the PIC. In this manner, an optical fiber can be optically aligned (e.g., butt coupled) to the edge of the PIC rather than having to use a grating coupler or some other less efficient optical coupling in order to transfer optical signals between the PIC and the optical fiber.

The photoelectric signal conversion and transmission device includes a photoelectric signal module and a fiber joint, matched and coupled together. A circuit board of the photoelectric signal module includes one or more connection bases. Light emission elements, light reception elements, and amplifiers are configured on a first coupling face of the connection based, and electrically connected by first and second wires. The fiber joint includes a number of fibers axially aligned with the light emission and reception elements. By having the light emission and reception elements and amplifiers configured on a same coupling face, their physical connection distance is reduced, thereby decreasing signal attenuation, enhancing signal transmission performance, and facilitating structural miniaturization.

Techniques for efficient alignment of a semiconductor laser in a Photonic Integrated Circuit (PIC) are disclosed. In some embodiments, a photonic integrated circuit (PIC) may include a semiconductor laser that includes a laser mating surface, and a substrate that includes a substrate mating surface. A shape of the laser mating surface and a shape of the substrate mating surface may be configured to align the semiconductor laser with the substrate in three dimensions.

Systems and method for aligning components of photonic systems are provided. An optical component for integration into and optical coupling within a photonic system is created by separating the component from a substrate to form a precisely defined surface on the optical component, the surface being precisely spaced from an optical feature of the component to be optically coupled within the photonic system. The precisely defined surface of the optical component is then pressed against a reference surface to position the optical feature in a predefined position and/or orientation for optical coupling of the optical feature within the photonic system. Passive precise alignment and optical coupling is thus provided without the need for iterative readjustment, multi-axis feedback, or active feedback.