Multiple methods are provided for fiber optic welding on a photonic integrated circuit (PIC). An example method includes providing a PIC, forming an attachment surface on the PIC configured to receive an optical fiber. The method further includes disposing at least a portion of the optical fiber on the attachment surface. The method may then include welding the optical fiber to secure the optical fiber with respect to the attachment surface. The attachment surface may be comprised of substantially the same material as an outer portion of the optical fiber and may result in a homogenous weld securing and connecting the optical fiber to the PIC.

An optical module includes a light-forming part; a protective member and including an output window and disposed so as to surround the light-forming part; an adapter connected to the protective member and including an optical passage through which light emitted from the light-forming part and transmitted by the output window passes; and an optical coupling component that is connected to the adapter and that light passing through the optical passage enters. The light-forming part includes semiconductor light-emitting devices and lenses configured to convert, in terms of spot size, light emitted from the semiconductor light-emitting devices. The optical coupling component includes an optical component and a support member supporting the optical component. The support member and the adapter are connected together.

In accordance with an embodiment, a welding assembly is disclosed that allows for a laser assembly to be coupled into a socket of the same and held at a fixed position, e.g., by a mechanical grabber of a welding system. The mechanical grabber may then travel along one or more axis to bring the TOSA module into mechanical alignment with an opening of an associated optical subassembly housing. The welding assembly may further include an alignment member that provides one or more alignment contact surfaces configured to be brought directly into contact with a surface of the associated subassembly housing. When the one or more alignment contact surfaces are flush with the surface of the subassembly housing the emission face of the TOSA module is substantially parallel, and by extension, optically aligned with the opening of the associated subassembly housing.

In accordance with an embodiment, a transmitter optical subassembly (TOSA) module is disclosed with a base portion that provides one or more mounting surfaces to mount a laser diode and associated driver circuitry in close proximity to allow for direct coupling without the use of an intermediate interconnect device, such as a flexible printed circuit or other interconnect device. The TOSA module base further includes a cylindrical shaped portion with a passageway extending therethrough. The substantially cylindrical shaped portion allows the TOSA module base to mount to a multi-channel TOSA housing via a Z-ring or other suitable welding ring without the use of an intermediate device such as a welding cap.

A variation in coupling ratio of output light from a laser element to an optical fiber is suppressed. A semiconductor laser module including a plurality of semiconductor laser elements, an optical fiber, a condenser that condenses a laser beam emitted from each of the semiconductor laser elements to the optical fiber, and a housing that implements the laser elements, the condenser, and the optical fiber includes at least one thin plate that is arranged between the laser elements and a top of the housing, and arranged on the top to form a gap with the top.

An optical module may include a case, an optical assembly, a circuit board interface positioned on the case, and a circuit board attached to the case through the circuit board interface. The optical assembly may be arranged in the case. The circuit board may include a first area that may electrically connect the circuit board to the optical assembly. The circuit board may also include a second area that may secure the circuit board to the circuit board interface. An optical module manufacturing method is also provided.

An optical communication module configured for enhancing optical coupling efficiency, which includes an optical butt joint receptacle and a light emitting body provided on one side of the optical butt joint receptacle. The optical butt joint receptacle has a receptacle body and a through hole provided in the receptacle body for a dual-core optical fiber to extend through. The receptacle body has a light-receiving side and an optical fiber insertion groove corresponding respectively to two ends of the through hole. The light emitting body includes a housing, a laser semiconductor provided in the housing, and an aperture provided in one side of the housing for aligning with the through hole so as that the laser beam emitted by the laser semiconductor is optically coupled to the dual-core optical fiber. The dual-core optical fiber has different core diameters and numerical apertures to enhance the coupling efficiency and reduce the coupling loss in between with the external optical fiber.

In accordance with an embodiment, a transmitter optical subassembly (TOSA) module is disclosed with a base portion that provides one or more mounting surfaces to mount a laser diode and associated driver circuitry in close proximity to allow for direct coupling without the use of an intermediate interconnect device, such as a flexible printed circuit or other interconnect device. The TOSA module base further includes a cylindrical shaped portion with a passageway extending therethrough. The substantially cylindrical shaped portion allows the TOSA module base to mount to a multi-channel TOSA housing via a Z-ring or other suitable welding ring without the use of an intermediate device such as a welding cap.

A light source device is provided. The light source device includes: a ferrule which holds an optical fiber; a light-emitting element which emits laser light; and a casing which houses the ferrule and the light-emitting element such that the laser light enters the optical fiber. The casing includes a through hole from a first end face to a second end face. The through hole includes a diameter which decreases in a stepwise manner from the first end face toward the second end face. The ferrule is fitted to a small bore portion of the through hole, which is smallest in diameter. The light-emitting element is fitted to a large bore portion of the through hole, which is larger in diameter than the small bore portion.

An optical receptacle and an optical module that implements the optical receptacle are disclosed. The optical receptacle provides a stub holding a coupling fiber in a center thereof, a bush press-fitting the stub therein, a sleeve, and a metal cover that is to be welded to an external metallic member. The coupling fiber has a type of polarization maintaining fiber. The bush is inserted into the cover as leaving a gap between the cover and the bush. The gap between the cover and the bush effectively relaxes or absorbs stresses induced during the welding caused in the coupling fiber.