An apparatus includes a dielectric support substrate with one or more planar major surfaces and one or more optical fiber interfaces fixed to the support substrate adjacent one of the one or more planar major surfaces. Each optical fiber interface has optical modulators and photodetectors. The apparatus also includes one or more digital signal processing chips fixed to the support substrate adjacent one of the one or more planar major surfaces, and laterally separated from and communicatively connected via metallic lines to the one or more optical fiber interfaces. The apparatus also includes a first set of one or more metallic heatsinks adjacent the one or more digital signal processing chips to provide heat dissipation therefrom. The apparatus also includes a second set of one or more metallic heatsinks being located adjacent the one or more optical fiber interfaces to provide heat dissipation therefrom and physically separated by a distance from the one or more metallic heatsinks of the first set.

Disclosed is a package comprising a substrate having a patterned surface with an optical contact area, an optical redistribution layer (oRDL) feature, and a build-up material extending over the patterned surface of the substrate and around portions of the oRDL features. In some embodiments, the package comprises a liner sheathing the oRDL features. In some embodiments, the oRDL feature extends through openings in an outer surface of the build-up material and forms posts extending outward from the outer surface. In some embodiments, the package comprises an electrical redistribution layer (eRDL) feature, at least some portion of which overlap at least some portion of the oRDL feature. In some embodiments, the package comprises an optical fiber coupled to the oRDL features.

Techniques for efficient alignment of a semiconductor laser in a Photonic Integrated Circuit (PIC) are disclosed. In some embodiments, a photonic integrated circuit (PIC) may include a semiconductor laser that includes a laser mating surface, and a substrate that includes a substrate mating surface. A shape of the laser mating surface and a shape of the substrate mating surface may be configured to align the semiconductor laser with the substrate in three dimensions.

An optical assembly includes a combination of laser sources emitting radiation, focused by a combination of lenses into optical waveguides. The optical waveguide and the laser source are permanently attached to a common carrier, while at least one of the lenses is attached to a holder that is an integral part of the carrier, but is free to move initially. Micromechanical techniques are used to adjust the position of the lens and holder, and then fix the holder it into place permanently using integrated heaters with solder.

Two semiconductor chips are optically aligned to form a hybrid semiconductor device. Both chips have optical waveguides and alignment surface positioned at precisely-defined complementary vertical offsets from optical axes of the corresponding waveguides, so that the waveguides are vertically aligned when one of the chips is placed atop the other with their alignment surface abutting each other. The position of the at least one of the alignment surface in a layer stack of its chip is precisely defined by epitaxy. The chips are bonded at offset bonding pads with the alignment surfaces abutting in the absence of bonding material therebetween.

An optical module includes a base having a first surface, a board having a second surface and a third surface, an optical circuit element having a fourth surface, a fifth surface and two ports, and an array lens. The first surface is joined to the second surface by a first solder. The third surface has a first metallic pattern and a second metallic pattern that are joined to the fourth surface by a second solder. The array lens is fixed onto the first surface of the base so as to be optically coupled to the two ports provided at one end of the optical circuit element in the first direction. The first metallic pattern is formed closer than the second metallic pattern to the one end of the optical circuit element in the first direction and is formed between the two ports in the second direction.

An optical module includes a wiring board having a first electrode, an optical waveguide provided on the wiring board, an optical element having a second electrode and provided on the optical waveguide, a conductive bonding material bonding the first and second electrodes, and a fixing member that fixes the optical element to the optical waveguide. The optical waveguide includes a core layer, a first cladding layer provided on a first side of the core layer, a second cladding layer provided on a second side of the core layer opposite to the first side, and an optical path conversion mirror provided on the core layer or the second cladding layer. The optical element is optically coupled to one end of the core layer via the optical path conversion mirror, and a softening point of the fixing member is higher than a melting point of the conductive bonding material.

Techniques for efficient alignment of a semiconductor laser in a Photonic Integrated Circuit (PIC) are disclosed. In some embodiments, a photonic integrated circuit (PIC) may include a semiconductor laser that includes a laser mating surface, and a substrate that includes a substrate mating surface. A shape of the laser mating surface and a shape of the substrate mating surface may be configured to align the semiconductor laser with the substrate in three dimensions.

A structure and method of formation of a buried heterostructure laser die with alignment aids wherein the alignment aids include lateral and vertical structures formed on the die. Lateral alignment aids are formed using a same mask layer as the ridge structure of the laser and provide fiducials that are formed in reference to the ridge structure. Vertical alignment aids, and vertical protrusions of the lateral alignment aids are formed using etch stop layers positioned in the buried heterostructure laser layer structure.

Apparatuses, systems and methods for optical coupling, optical integration, electro-optical coupling, and electro-optical packaging are described herein. Optical couplers may comprise various optical elements (e.g., mirrors as described herein) to relax optical assembly requirements and improve producibility. Optical couplers may improve fiber-to-chip, fiber-to-fiber and chip-to-chip optical connection. Optical couplers and optical components may be used to improve integration of, connection of, and/or packaging of optical systems and/or components with electrical systems and/or components.