Systems and methods for fabricating a semiconductor chip with an integrated laser diode (or other optical component). An example method may comprise fabricating a recess shaped to receive the optical component. The method may also comprise metallizing at least one surface of the recess. The method may also comprise coupling the optical component to the at least one metallized surface of the recess. The component may comprise a laser diode comprising a p-type semiconductor and an n-type semiconductor. The n-type semiconductor may be electrically coupled to the at least one metallized surface of the recess. The method may also comprise optically coupling an optical output of the laser diode (or other optical component) to an optical input of a photonic interface of the chip with a photonic wire bond and/or at least one polymer lens.

A carrier laser device assembly is provided in which a visible region of a laser that includes an output portion and/or output portion of a waveguide of the laser is visible to an imaging system when the laser is attached to a carrier. The laser may be burned-in and/or tested prior to attachment to a photonic integrated circuit. The output portion and/or output portion of waveguide may be aligned with a corresponding input portion and/or input portion of a waveguide of the PIC as the laser assembly is being attached to the PIC via imaging of the visible portion by the imaging system.

A method and apparatus for mounting optical components is described. The apparatus is suitable for mounting multiple optical components and comprises a baseplate having opposing first and second surfaces. Recesses or apertures are formed within the baseplate and are located upon the first or second surfaces so as to define thermally activated optic mounting areas. Pillars are then located within the thermally activated optic mounting areas and these provide a means for attaching the optical component to the baseplate. The employment of the recesses or apertures act to significantly reduce the thermal conduction throughout the baseplate. As a result preferential heating can be provided to the one or more thermally activated optic mounting areas while maintaining the baseplate with a desired mechanical strength. The optical mounting apparatus exhibits a high thermal stability thus making the apparatus ideally suited for use within commercial optical system.

An optical device includes a substrate that includes a substrate-side electrode, and a chip that includes N active layers and a chip-side electrode that is mounted on the substrate-side electrode. From among bumps that are disposed side by side with an Nth layer on both sides of a surface that is located opposite the Nth layer and that is included in the substrate-side electrode, bumps located at a position farther away from the center of gravity of all of the bumps are defined as first bumps, and bumps located at a position closer to the center of gravity are defined as second bumps. In at least one combination of the first bump and the second bump, the first bump and the second bump are arranged on the substrate-side electrode such that a distance between the first bump and the surface is longer than a distance between the second bump and the surface.

Apparatuses, systems and methods for optical coupling, optical integration, electro-optical coupling, and electro-optical packaging are described herein. Optical couplers may comprise various optical elements (e.g., mirrors as described herein) to relax optical assembly requirements and improve producibility. Optical couplers may improve fiber-to-chip, fiber-to-fiber and chip-to-chip optical connection. Optical couplers and optical components may be used to improve integration of, connection of, and/or packaging of optical systems and/or components with electrical systems and/or components.

The present disclosure provides for an example integrated optics assembly. The integrated optics assembly may include an optics mount, a substrate including a heat sink, and a photonic integrated circuit (“PIC”). The optics mount may be adapted to support a light source on a first end of the optics mount. The first end of the optics mount may be coupled to a region of the substrate including the heat sink. The heat sink may remove or dissipate the heat produced by the light source. A second end of the optics mount may be coupled to the PIC such that the optics mount extends between the substrate and the PIC. This may decrease the amount of space the optics mount takes up on the PIC thereby allowing the overall size of the PIC to be decreased. Decreasing the size of the PIC may allow for more PICS per wafer.

A chip packaging structure that includes an optoelectronic (OE) chip mounted on a first surface of a substrate and whose optically active area is directed laterally; and a lens array for the optoelectronic (OE) chip that is mounted on the first surface of the substrate and faces to the optoelectronic (OE) chip, wherein the lens array has inside a reflector reflecting light from a first direction to a second direction, in which the first direction is substantially perpendicular to the second direction.

Provided is an optical fiber connection component in which an optical waveguide of a planar lightwave circuit and an optical fiber can be connected after a process using SMT and reflow mounting technology. The optical fiber connection component includes: a plurality of fiber guide holes into which optical fibers are insertable at intervals equal to intervals of a plurality of optical waveguides of the planar lightwave circuit; and grooves for demarcating an area provided with the plurality of fiber guide holes and an area coated with an adhesive in an end surface to be joined with the planar lightwave circuit. The plurality of optical waveguides and the plurality of fiber guide holes are respectively aligned and fixed to the planar lightwave circuit with the adhesive in advance.

A method for assembling an optoelectronic package assembly includes engaging a connector holder with a substrate, the connector holder defining an engagement feature and the substrate including optical waveguides, engaging a connector of a fiber array unit with the engagement feature the connector holder where the engagement feature retains the connector and where the fiber array unit includes the connector and optical fibers coupled to the connector, optically coupling the optical fibers to the optical waveguides of the substrate, heating the connector holder, the fiber array unit, the substrate, and a solder positioned between the substrate and a base substrate, where the heating is sufficient to melt the solder, and cooling the solder to couple the substrate to the base substrate.

An assembly may include at least one camera and a controllable mechanical handling device. The system may further include a first component, including a first optical waveguide and a second component, including a second optical waveguide. The first component and the second component are fixedly connected to a substrate and arranged directly next to one another on the substrate and relative to one another in such a way that a coupling side of the first component and a coupling side of the second component are situated opposite each other on a first and second side of a coupling plane. The optical waveguides of the first and second component each end at a first coupling surface or a second coupling surface. The first and second coupling sides are aligned, and optically coupled with one another at a first and second end face.