An optical waveguide alignment method includes a step of covering an end portion of an optical fiber, an end portion of a PLC, and a microlens with an adhesive before curing in a state in which at least one microlens is disposed between incidence and emission end faces of end portions of the optical fiber and the PLC, a step of causing light for alignment to be incident on at least one of the optical fiber or the PLC so that light enters a portion covered with the adhesive between the optical fiber and the PLC, and a step of curing the adhesive after the microlens moves onto an optical path between the optical fiber and the PLC due to radiation pressure of light. The optical fiber and the PLC are optically connected via the adhesive and the microlens, and the optical fiber, the PLC, and the microlens are mechanically connected by the adhesive.

Various embodiments provide methods for fabricating a couplable electro-optical device. An example method comprises fabricating a pillar on a substrate by forming a lens spacer portion about an electro-optical component fabricated on the substrate; and adhering unshaped lens material to an exposed surface of the pillar. The exposed surface of the pillar is disposed opposite the substrate. The example method further comprises maintaining the unshaped lens material at a reflow temperature for a reflow time to allow the lens material to reflow into a formed lens shape, and curing the lens material to form an integrated lens having the formed lens shape secured to the lens spacer portion and formed about the electro-optical component on the substrate.

An optoelectronic package and a method of manufacturing an optoelectronic package are provided. The optoelectronic package includes a carrier. The carrier includes a first region and a second region. The first region is configured to supply power to a processing unit disposed on the carrier. The second region is for accommodating at least one optoelectronic device electrically coupled to the processing unit.

To provide an optical waveguide device in which damage to a thin plate, particularly damage to an optical waveguide, is prevented. An optical waveguide device includes: a thin plate 1 that has an electro-optic effect and that has a thickness of equal to or thinner than 10 μm, an optical waveguide 2 being formed on the thin plate; and a reinforcing substrate that supports the thin plate, in which the thin plate 1 has a rectangular shape in a plan view, a dissimilar element layer 3, in which an element different from an element constituting the thin plate is disposed in the thin plate, is formed on at least a portion between an outer periphery of the thin plate and the optical waveguide 2, and a total length over which a cleavage plane of the thin plate traverses a region where the dissimilar element layer is formed, is equal to or longer than 5% of a width of the thin plate in a short side direction.

A package includes a photonic layer on a substrate, the photonic layer including a silicon waveguide coupled to a grating coupler; an interconnect structure over the photonic layer; an electronic die and a first dielectric layer over the interconnect structure, where the electronic die is connected to the interconnect structure; a first substrate bonded to the electronic die and the first dielectric layer; a socket attached to a top surface of the first substrate; and a fiber holder coupled to the first substrate through the socket, where the fiber holder includes a prism that re-orients an optical path of an optical signal.

The present disclosure provides an optical fiber to silicon photonics circuit (PIC) assembly method utilizing a structured fiber retaining apparatus for fiber confinement in which polymer filling volume for adhesion and refractive index matching purpose is reduced. Reduction of polymer volume result in smaller optical alignment change due to polymer material volume changes upon moisture absorption and aging, hence improving assembly reliability. In an embodiment, the assembly method and apparatus, transparent polymer material interfaces between fiber and edged coupler volume reduce more than 50% compares to conventional assembly method.

A receptacle of a photonics package, a receptacle assembly including the receptacle, the photonics package, and a method of making the receptacle assembly. The receptacle assembly comprises: a photonics integrated circuit (PIC) including waveguides thereon; a die side lens assembly; and a rigid receptacle body including: a plug portion to receive an optical plug that includes a plug side lens assembly; a lens portion supporting the die side lens assembly and configured such that the die side lens assembly and the plug side lens assembly are aligned to one another when the optical plug is received in the plug portion; and a PIC portion bonded to the PIC such that the waveguides of the PIC are aligned to: corresponding lenses of the die side lens assembly; and corresponding lenses of the plug side lens assembly when the optical plug is received in the plug portion.

An apparatus for coupling a laser and an optical fiber and an optical signal transmission system and transmission method where the coupling apparatus is disposed between a laser and an optical fiber, where the coupling apparatus includes an optical signal transmission part whose inner refractive index changes gradually, where a refractive index becomes higher at a position closer to a principal axis of the optical signal transmission part; and the optical signal transmission part may be configured to shape an optical signal incident from the laser (including optical signal convergence or divergence), so that a mode field radius of the adjusted optical signal matches a core radius of the optical fiber, and the adjusted optical signal can be coupled into the optical fiber in high efficiency.

A micro optical engine assembly including a printed circuit board, a frame mounted on the printed circuit board, a micro optical engine mounted on the printed circuit board within a central space of the frame, a jumper having a lens-carrying end placed on top of the micro optical engine and aligned therewith by alignment members to thereby limit horizontal movement of the jumper, and a latch having a snap mechanism releasably snapped onto the frame, and at least one spring plate resiliently pressing against an upper surface of the jumper when the latch is snapped onto the frame to thereby limit vertical movement of the jumper.

An optical fiber holding structure includes: a structure main body having a prismatic shape; a through hole into which an optical fiber is inserted; a protruding portion having a columnar shape projecting from the structure main body and configured to be inserted into an opening portion of a substrate; and a contact portion configured to abut on a surface of the substrate to position an optical element and the optical fiber at a predetermined distance. The through hole is formed so as to penetrate from a surface of the structure main body through which the optical fiber is inserted to an end surface of the protruding portion, and at least one side surface of the structure main body is flush with at least one side surface of the protruding portion.