A photonic integrated circuit may be coupled to an optical fiber and packaged. The optical fiber may be supported by a fiber holder during a solder reflow process performed to mount the packaged photonic integrated circuit to a circuit board or other substrate. The optical fiber may be decoupled from the fiber holder, and the fiber holder removed, after completion of the solder reflow process.

A construction and configuration for the receiving function of a high speed optical communication system with reduced manufacturing cost and improved performance. In an aspect, mounting the cover and lens provides a self-alignment behaviour that advantageously positions the cover and the lens to be in the optimum position for the photodiode. An assembly of electronic components receives data using an optical fibre. In one aspect, the assembly includes a photodiode, an amplifier coupled to the photodiode, and a printed circuit board on which the photodiode and amplifier are physically mounted, The printed circuit board has areas of a first material to which components may be attached using a fixing agent, and areas of a second material to which components will not attach using the fixing agent. Conductive bond wires are configured to directly couple the amplifier and the photodiode to conductive traces on an opposite side of the printed circuit board. A cover is configured to cover the amplifier and the photodiode, and is physically attached to the printed circuit board to provide mechanical rigidity around the photodiode and the amplifier. The cover has an optically transparent aperture containing a lens configured to focus modulated light signals from a fibre onto the photodiode. The printed circuit board has areas of a first material and second material configured to fix a location of the cover by use of the fixing agent to align the lens to focus the light signals from the fibre onto the photodiode.

An integrated circuit package and a method of forming the same are provided. The integrated circuit package includes a photonic integrated circuit die. The photonic integrated circuit die includes an optical coupler. The integrated circuit package further includes an encapsulant encapsulating the photonic integrated circuit die, a first redistribution structure over the photonic integrated circuit die and the encapsulant, and an opening extending through the first redistribution structure and exposing the optical coupler.

An optical device according to one embodiment includes an optical element, a sleeve including a receptacle portion and an insertion portion, and a base having a lower plate having a main surface with the optical element being mounted thereon and a side wall having a hole with the insertion portion of the sleeve optically coupled with the optical element inserted into the hole. A step difference at a position lower than the main surface is formed at a lower position of the hole in the side wall.

Disclosed is an optical device including a first lens and a second lens. The first lens of the optical device is joined to an end surface of an optical waveguide of an optical element to emit light emitted from the optical element. The second lens is optically coupled with the first lens to convert the light emitted from the first lens into collimated light.

There is provided a highly convenient package for an optical module in which a device can be mounted as it is even when the number and mounting position thereof are different according to the device to be mounted. The package includes a base plate having a top surface on which devices are assembled, an optical fiber mounting component mounted on the top surface of the base plate, a direct current electrical interface component and a high frequency electrical interface component mounted on the top surface of the base plate. The optical fiber mounting component and the electrical interface components are separately manufactured, separately assembled on the top surface of the base plate, and fixed in different modes. The optical fiber mounting component is fixed by fastening with screws and fixed by soldering, and the electrical interface components are fixed by fastening with the screw.

An optical module for endoscope includes an optical fiber, a light emitting element, a ferrule including a front surface and a back surface, and including a first through-hole into which the optical fiber is inserted, a glass substrate including a first principal surface at which the light emitting element is mounted and a second principal surface, a sleeve including a third principal surface bonded to the second principal surface of the glass substrate, and a fourth principal surface, and including a second through-hole into which the ferrule is inserted, and a stopper including a contact surface in surface contact with the back surface of the ferrule, fixed to the sleeve by using an adhesive, and further including an inner side surface in contact with a side surface of the sleeve.

An optical transducer for endoscope includes an optical element, an optical fiber, and a fiber holding member including a first holding member including a first principal surface and a second principal surface and a second holding member in which a third principal surface is disposed to face the second principal surface, a first through-hole into which the optical fiber is inserted, being formed in the first holding member, the optical element being mounted on a fourth principal surface. A trench connected to the first through-hole and including openings respectively on opposed two side surfaces is formed on the second principal surface. Only a part of a distal end portion of the optical fiber is observable from the openings of the trench.

An optical device includes a first substrate having a first surface, a second substrate having a second surface, at least one optical waveguide, and a plurality of spacers, disposed on at least either the first surface or the second surface, that include a first portion and a second portion. The first portion of the plurality of elastic spacers is at least one elastic spacer located in a region between the first substrate and the second substrate in which the first substrate and the second substrate overlap each other as seen from an angle parallel with a direction perpendicular to the first surface. The second portion of the plurality of elastic spacers is at least one elastic spacer located in a region in which the first substrate and the second substrate do not overlap each other as seen from an angle parallel with the direction perpendicular to the first surface.

Integrated optical waveguides, direct-bonded waveguide interface joints, optical routing and interconnects are provided. An example optical interconnect joins first and second optical conduits. A first direct oxide bond at room temperature joins outer claddings of the two optical conduits and a second direct bond joins the inner light-transmitting cores of the two conduits at an annealing temperature. The two low-temperature bonds allow photonics to coexist in an integrated circuit or microelectronics package without conventional high-temperatures detrimental to microelectronics. Direct-bonded square, rectangular, polygonal, and noncircular optical interfaces provide better matching with rectangular waveguides and better performance. Direct oxide-bonding processes can be applied to create running waveguides, photonic wires, and optical routing in an integrated circuit package or in chip-to-chip optical communications without need for conventional optical couplers. An example wafer-level process fabricates running waveguides, optical routing, and direct-bonded optical interconnects for silicon photonics and optoelectronics packages when two wafers are joined.