An integrated photonics device that emits light out towards a measured sample value is disclosed. The device can include a discrete optical unit that attaches to a supporting layer. The discrete optical unit can include mirror(s), optics, detector array(s), and traces. The supporting layer can include one or more cavities having facet walls. Light emitter(s) can emit light that propagate through waveguide(s). The emitted light can exit the waveguide(s) (via termination point(s)), enter the one or more cavities at the facet walls, and be received by receiving facets of the discrete optical unit. The mirror(s) of the discrete optical unit can redirect the received light towards collimating optics, which can direct the light out of the device through the system interface. The discrete optical unit can be formed separately from the supporting layer or bonded to the supporting layer after the mirror, optics, detector arrays, and traces are formed.

A micro optical engine assembly including a printed circuit board, a frame mounted on the printed circuit board, a micro optical engine mounted on the printed circuit board within a central space of the frame, a jumper having a lens-carrying end placed on top of the micro optical engine and aligned therewith by alignment members to thereby limit horizontal movement of the jumper, and a latch having a snap mechanism releasably snapped onto the frame, and at least one spring plate resiliently pressing against an upper surface of the jumper when the latch is snapped onto the frame to thereby limit vertical movement of the jumper.

The application provides a connector device for connecting at least one optical fiber endpiece to an electric terminal. The connector device comprises a printed circuit board and an electric connector plug connectable to an electric terminal. A fiber end piece holder is mounted or mountable in an orientation enabling light propagation parallel to the printed circuit board, whereas an optoelectronic chip comprising optoelectronic active elements enables emission and/or detection of light substantially normal to the printed circuit board. A layered optical stack is provided on the printed circuit board, which layered optical stack comprises a reflection surface for changing the propagation direction between parallel and normal to the printed circuit board.

An optical transmission device according to the present disclosure includes: an optical connector connection unit to which a connector unit of an optical cable is attached; a light emitting end configured to emit light to transmit an optical signal via the optical cable, and configured to radiate light to a reflection surface of the connector; and a driving unit configured to drive the reflection surface to refract the light radiated to the reflection surface toward an optical transmission path of the optical cable through refraction on the reflection surface in the case where the connector unit is attached in first orientation, and configured to drive the reflection surface to refract the light radiated to the reflection surface toward the optical transmission path of the optical cable through refraction on the reflection surface in the case where the connector unit is connected in second orientation that is different from the first orientation.

Provided herein is an optical module including: an optical receptacle including a first lens and a second lens; a lens module including a lens unit facing the second lens of the optical receptacle; and an optical element configured to receive a beam emitted from the lens module or form a beam to be emitted to the lens module. A horizontal length and a vertical length of a cross-section of the first lens may differ from each other, and a horizontal length and a vertical length of a cross-section of the second lens may differ from each other.

A method comprising: stamping imprint material that was deposited on a silicon photonics (SiPh) chip and at least in a cavity thereof to form a curved mirror shape and a tilted flat mirror shape; coating at least a portion of each the curved mirror shape and the tilted flat mirror shape with a reflective material to form a first curved mirror and first tilted flat mirror; and mounting the SiPh chip in a flip-chip orientation to a substrate.

In the examples provided herein, a mounting substrate includes a plurality of filter chips, where each filter chip includes a thin film filter coating on a surface of a different substrate, and the plurality of filter chips are positioned adjacent to each other in a row. A first edge of a first filter chip is flush with a first edge of the mounting substrate, a second edge of the first filter chip is flush with a second edge of the mounting substrate, and the first edge and second edge share a common corner. The flush edges of the first filter chip and the mounting substrate are reference surfaces, the plurality of filter chips are coupled to the mounting substrate via an epoxy, and the reference surfaces are to mate to connector reference surfaces on a connector.

An optical assembly includes a base plate, a light transmitting component arranged on the base plate, a lens component arranged on the base plate along an optical path of light transmitted from the light transmitting component, a supporting member, and an auxiliary member. The supporting member includes a bottom surface that bonds to the base plate and a side surface that connects to the auxiliary member. The auxiliary member includes a side surface on which the lens component is disposed and a bonding surface that bonds to the side surface of the supporting member. The lens component is configured to focus and couple, or collimate, an optical signal transmitted from the light transmitting component. A bottom surface of the auxiliary member and a bottom surface of the lens component are both higher than the top surface of the base plate.

A composite semiconductor laser is made by securing a III-V wafer to a transfer wafer. A substrate of the III-V wafer is removed, and the III-V wafer is etched into a plurality of chips while the III-V wafer is secured to the transfer wafer. The transfer wafer is singulated. A portion of the transfer wafer is used as a handle for bonding the chip in a recess of a silicon device. The chip is used as a gain medium for the semiconductor laser.

A coarse wavelength division multiplexing (CWDM) device includes a supporting frame, a collimating lens, focusing lenses, a supporting block, and a light splitter. The supporting frame includes first frame portion with collimating lens and a second frame portion with focusing lenses arranged in an array along an extending direction of the second frame portion. The supporting block includes a first sidewall facing the first frame portion and a second sidewall facing the second frame portion. The light splitter includes a mirror on the first sidewall and a plurality of filters on the second sidewall, the filters being arranged in an array along an extending direction of the second sidewall. The filters correspond to the focusing lenses.