[Object] To provide an optical coupling device that efficiently receives an optical signal from an optical fiber and has improved communication quality, and an optical communication system using the same. [Solving Means] An optical coupling device according to the present technology includes a light receiving and emitting device and an optical device. The light receiving and emitting device includes a light emitter that emits outgoing light, and a light receiver that receives incident light from outside. The light receiver has a light passing part through which the outgoing light passes. The light passing part is arranged on an optical axis of the incident light. The optical device causes incident light around the optical axis of the incident light to be refracted so as to be apart from the optical axis and to enter the light receiver.

To provide an optical connector which enables suppression of crosstalk, an optical connector includes a housing, an optic transceiver and a lens body, wherein the lens body includes a light emitting side lens section configured to be interposed between a light emitting element and one optical fiber of a partner optical connector, a light receiving side lens section configured to be interposed between a light receiving element and another optical fiber of the partner optical connector, and a light receiving side lens surrounding section in an integrated manner. A light shield section is formed in the lens body, the light shield section being configured to suppress a portion of light emitted from the light emitting element which enters the light receiving element via the lens body. The light receiving side lens surrounding section is configured to be transparent at an end facing the partner optical connector.

An integrated circuit (IC) package having multiple ICs is provided. The IC package includes a printed circuit board (PCB) having a cutout region and a substrate disposed above the PCB. The substrate includes a first cavity on a first surface of the substrate. The IC package also includes a first IC disposed on a second surface of the substrate and in the cutout region of the PCB, The IC package further includes a second IC disposed above the substrate, and a first device disposed on the second IC and in the first cavity on the first surface of the substrate.

A method of manufacturing an optical module is provided. The optical module includes an optical block having two positioning projections, a substrate, an optical element, and a positioning frame formed of a material having a coefficient of linear expansion that differs from that of the substrate. The positioning frame having two sides, positioning holes, and narrow portions, the positioning holes and the narrow portions being provided at the two sides. The method includes fixing the positioning frame on the substrate by a heat-curable adhesive provided at a portion excluding the positioning holes and the narrow portions, mounting the optical element on the substrate, press-fitting the two positioning projections of the optical block into the two positioning holes of the positioning frame, and fixing the optical block, the positioning frame, and the substrate to each other.

A method for assembling a beam combiner array including providing an array block having a back wall, a front surface and a plurality of aligned channels extending from the back wall to the front surface, where a bore extends through the back wall and into each channel, and providing a lens array including a plurality of lenses. The method further includes securing the lens array to the front surface of the block so that one of the lenses is aligned with each channel and threading a separate hollow core fiber through one of the bores in the back wall so that an end of the fiber is positioned within the channel. The method also includes aligning each fiber to the lens array so that a beam that propagates down the fiber is emitted into the channel, focused by the lens and emitted from the array as a collimated beam.

An optoelectronic module includes a housing and a printed circuit board (“PCB”) positioned within the housing. A positioning member is coupled to the PCB and includes one or more receptacles each configured to receive and secure positioning of an optical component relative to the PCB. The positioning member may include a plurality of receptacles positioned relative to one another in an arrangement defining a vertical array of receptacles, a lateral array of receptacles, or both. In one form, an optical component, when positioned in a receptacle of the positioning member, is spaced from the PCB. The positioning member may be formed of a thermally insulative or thermally conductive material, and a number of optical fibers may be routed between the positioning member and the housing.

An interconnect module and mating ring connector are described. The interconnect module may be a transceiver, transmitter, or receiver that is part of an optical communication system. The interconnect module has a low profile and small footprint. The interconnection system is capable of transferring information at high data rates.

The optical module includes a housing, a lid that closes an opening of the housing, an optical component arranged inside the housing, and a printed circuit board arranged on a front surface of the lid outside the housing so as to be used as a board on which a control circuit that controls the optical component is mounted. The optical module further includes a side electrode that is provided on a side surface of the housing and configured to be electrically connected to an electrode of the optical component; and a flexible substrate that provides electrical connection between the side electrode and an electrode of the control circuit. The optical module can be miniaturized by integrating the optical component and the control circuit.

An optoelectronic module includes a housing and a printed circuit board (“PCB”) positioned within the housing. A positioning member is coupled to the PCB and includes one or more receptacles each configured to receive and secure positioning of an optical component relative to the PCB. The positioning member may include a plurality of receptacles positioned relative to one another in an arrangement defining a vertical array of receptacles, a lateral array of receptacles, or both. In one form, an optical component, when positioned in a receptacle of the positioning member, is spaced from the PCB. The positioning member may be formed of a thermally insulative or thermally conductive material, and a number of optical fibers may be routed between the positioning member and the housing.

An optical connector includes: a base substrate; an optical device on the base substrate; an optical fiber optically aligned with the optical device; and a reflective injection-molded part arranged on the base substrate to cover the optical device and providing a reflective surface in an optical path between the optical device and the optical fiber, wherein the reflective injection-molded part includes: a prism providing the reflective surface; an alignment leg supporting the prism in a state in which the prism is at a height from the base substrate; a main block on a side of the prism, the side of the prism being opposite the base substrate; and a plurality of support ribs branching off at intermittent positions along the main block and supporting the prism with respect to the main block.