An optical module in which a space between a light emitting portion (or a light receiving portion) (11a) of an optical element (11) and an insulating layer (1) of an electric circuit board (E) is filled with a cured product of a light-transmissive resin composition containing a curing agent component including only a non-antimony-containing curing agent (i.e., an optical element bonding/reinforcing resin cured product (X)) and a junction between the optical element (11) and the electric circuit board (E) is reinforced with the cured product.

Provided is a light source device, a projector, a machining device, a light source unit, and a light source device adjusting method in which a replacement of a light source unit can be easily performed when required. The light source device 1 includes: a plurality of light source units 21 arranged in a two-dimensional array, each of the plurality of light source units having a plurality of light sources 21 and a support plate 22 supporting the plurality of light sources 21, each of the plurality of light sources 21 including a light emitting element for emitting a laser beam and a package housing the light emitting element; a base substrate 31 having a surface 311 on which the plurality of light source units 2 is arranged; and a fixing member 4 configured to detachably fix the support plate 22 to the base substrate 31.

In one embodiment, an optical module includes an electronic integrated circuit, a photonic integrated circuit, and a pluggable optical coupling connector. The photonic integrated circuit sends or receives optical signals. The pluggable optical coupling connector is adjacent to the photonic integrated circuit and includes a pluggable interface to optically couple a fiber array to the photonic integrated circuit. Further, the electronic integrated circuit, the photonic integrated circuit, and the pluggable optical coupling connector are all embedded in a mold.

An apparatus for coupling a laser and an optical fiber and an optical signal transmission system and transmission method where the coupling apparatus is disposed between a laser and an optical fiber, where the coupling apparatus includes an optical signal transmission part whose inner refractive index changes gradually, where a refractive index becomes higher at a position closer to a principal axis of the optical signal transmission part; and the optical signal transmission part may be configured to shape an optical signal incident from the laser (including optical signal convergence or divergence), so that a mode field radius of the adjusted optical signal matches a core radius of the optical fiber, and the adjusted optical signal can be coupled into the optical fiber in high efficiency.

An apparatus and method of assembly are described that provide an improved printed circuit board (PCB) assembly for an electro-optical interface, where more accurate positioning and alignment of electro-optical components can be achieved in an active part of the PCB assembly that is used for the electro-optical interface to meet tighter tolerances in an easier and more cost efficient manner. In particular, a photonic integrated circuit (PIC) is received in a cavity defined in a PCB that includes conductive elements for transmitting electrical signals. An optoelectronic transducer is connected to the PIC to convert between the optical signals and the corresponding electrical signals, and an optical coupler is secured to the optoelectronic transducer and supported by the PIC and/or PCB, where the optical coupler is configured to transmit the optical signals between the optoelectronic transducer and an optical fiber.

Provided herein is an optical module including: an optical receptacle including a first lens and a second lens; a lens module including a lens unit facing the second lens of the optical receptacle; and an optical element configured to receive a beam emitted from the lens module or form a beam to be emitted to the lens module. A horizontal length and a vertical length of a cross-section of the first lens may differ from each other, and a horizontal length and a vertical length of a cross-section of the second lens may differ from each other.

A method comprising: stamping imprint material that was deposited on a silicon photonics (SiPh) chip and at least in a cavity thereof to form a curved mirror shape and a tilted flat mirror shape; coating at least a portion of each the curved mirror shape and the tilted flat mirror shape with a reflective material to form a first curved mirror and first tilted flat mirror; and mounting the SiPh chip in a flip-chip orientation to a substrate.

A fluid compatible electro-optical packages and associated systems and devices are shown. For example, a fluid compatible electro-optical package includes integrated circuits with at least one photonic die and optical connections coupled with the integrated circuit. In an example, optical fibers are coupled with the optical connection. In an example fluid compatible electro-optical package, a fluid impermeable port is coupled with the optical connection and the optical fibers couple with the optical connection within the fluid impermeable port.

An optical module includes a substrate with a through-hole formed therein, an optical element member that includes a light receiving or emitting part that receives light or emits light at a position on a surface that is opposite to the substrate, the position corresponding to the through-hole, and a post that is formed of a transparent material, covers the light receiving or emitting part and is inserted into the through-hole.

A biased connector assembly is disclosed that includes a receptacle configured to mount to a substrate and form an electrical connection therewith, and a plug connector. The receptacle includes a cage that defines a port having a connector positioned therein. The connector may include a slot that is aligned with the port. The port includes one or more biasing members positioned therein. The plug connector includes a pluggable transceiver module to be inserted into the port and a card with at least one contact pad configured to engage with a terminal of the connector. The one or more biasing members may bias the plug module away from the connector such that a stub length of the contact pad is within a predetermined range.