An optical chip package is provided. The optical chip package includes a first transparent substrate, a second transparent substrate, and a spacer layer. The first and second transparent substrates each has a first surface and a second surface opposite the first surface. The first transparent substrate has a thickness that is different than that of the second transparent substrate. The second transparent substrate is disposed over the first transparent substrate, and the spacer layer is bonded between the second surface of the first transparent substrate and the first surface of the second transparent substrate. The recess region extends from the second surface of the second transparent substrate into the first transparent substrate, so that the first transparent substrate has a step-shaped sidewall. A method of forming an optical chip package is also provided.

Multi-fiber interface apparatuses providing a double reflection expanded beam arrangement include one or more substrates being configured to mountably receive a photonic integrated circuit (PIC), a fiber array coupling member mounted to a substrate, optical elements associated with the substrate and/or the fiber array coupling member, and one or more additional features. An additional feature according to certain implementations includes one or more passive substrate alignment features for aligning substrates to promote optical coupling between optical fibers and the PIC. In certain implementations configured for interfacing with printed circuit boards (PCBs), an additional feature includes a recess defined in an optically transmissive substrate in which a PIC is mounted, or includes a recess defined in a PCB into which the PIC is mounted. Various embodiments provide relaxed fiber alignment tolerances with simplified fabrication and system integration capabilities.

Optical modules are disclosed. An example optical module includes a substrate comprising a grating coupler, an optical connector removably coupled to the substrate adjacent the grating coupler to optically couple the optical connector and the grating coupler and an integrated circuit coupled to the substrate.

There is provided an optical device which realizes sufficient contrast or visibility, with a simple configuration. The optical device includes: a light guiding layer; a first optically functional layer provided on a first principal face of the light guiding layer; a second optically functional layer provided on a second principal face of the light guiding layer that is on an opposite side to the first principal face; and an optical medium layer provided on a surface of the second optically functional layer that is on an opposite side to the light guiding layer. A refractive index of the first optically functional layer is lower than a refractive index of the light guiding layer.

A method of forming an optical bench includes forming a reflector layer over a sloping side of a substrate. The method includes depositing a redistribution layer over the substrate. The method includes disposing an under bump metallization (UBM) layer over the redistribution layer. The method includes forming a passivation layer over the redistribution layer and surrounding sidewalls of the UBM layer. The method includes mounting a first optical component over an uppermost portion of the substrate, wherein the reflector layer is configured to reflect an electromagnetic wave from the first optical component, and the first optical component is mounted outside the trench.

An integrated electrical and optoelectronic package comprises an optical subassembly for the conversion of data between an optical and electrical format, an electronic chip including an integrated electric circuit for processing the data in the electrical format and an interposer. The interposer is configured as a supporting substrate to support the optical subassembly and the electronic chip. An optical connector may be coupled to the package. The optical subassembly comprises an optical adaptor used as an interface between a ferrule of the optical connector and an optoelectronic chip of the optical subassembly. Optical fibers of the optical cable are aligned to optical waveguides of the optoelectronic chip by at least one alignment pin of the optical adaptor.

The present invention is directed to an optical member including: a first layer that includes a first region having a refractive index n.sub.1 and a second region having a refractive index n.sub.3; and a second layer disposed on a first main surface of the first layer so as to be in contact with the first region and the second region, the second layer having a refractive index n.sub.2. The first layer includes a plurality of said second regions adjoining the first region along a planar direction of the first layer; the plurality of second regions constitute a geometric pattern; and n.sub.1 to n.sub.3 satisfy the relationship n1<n3<n2. When an optical member according to the present invention is integrated with a lightguide in use, excellent light extraction function is exhibited and leakage of light due to light scattering is suppressed, while attaining good mechanical strength at the same time.

Multi-fiber interface apparatuses providing a double reflection expanded beam arrangement include one or more substrates being configured to mountably receive a photonic integrated circuit (PIC), a fiber array coupling member mounted to a substrate, optical elements associated with the substrate and/or the fiber array coupling member, and one or more additional features. An additional feature according to certain implementations includes one or more passive substrate alignment features for aligning substrates to promote optical coupling between optical fibers and the PIC. In certain implementations configured for interfacing with printed circuit boards (PCBs), an additional feature includes a recess defined in an optically transmissive substrate in which a PIC is mounted, or includes a recess defined in a PCB into which the PIC is mounted. Various embodiments provide relaxed fiber alignment tolerances with simplified fabrication and system integration capabilities.

A transparent optical device (100) is provided, comprising a lightguide medium (101) configured for light propagation, and an at least one optically functional layer (10) comprising at least one optically functional feature pattern (11) formed in a light-transmitting carrier medium (11 1) by a plurality of embedded features provided as optically functional internal cavities (12), wherein said at least one feature pattern (11) is configured to perform an incident light control function and at least a light outcoupling function, whereby stray light is minimized and optical transparency of the device (100) is established.

With a simple configuration, an optical device which realizes uniform light distribution and adequate display quality is provided. An optical device includes: a light guiding layer; a first optically functional layer provided on at least one of a first principal face and a second principal face of the light guiding layer; and a ray control structure, at an end of the light guiding layer on a light-incident side, being provided on a surface of the first optically functional layer that is on an opposite side to the light guiding layer. The ray control structure reduces light which is incident from an edge of the light guiding layer to the first optically functional layer at an angle smaller than a critical angle.