A mounting frame system is disclosed that facilitates the mounting of optical connector modules to printed circuit boards. The mounting frame system can include a mounting frame that is configured to attach to a printed circuit board, and is adapted to attach to a connector module. Thus, the mounting frame system can further allow releasable mounting of optical connector modules to the printed circuit board, such that the mounting is achieved in a safe and reliable manner.

Communication devices are disclosed. In an example embodiment, a communication device may include a communication module including an illumination source and a body element. The body element may be configured to allow illumination generated by the illumination source to propagate within and illuminate at least a portion of an outer surface of the body element.

A connector, comprises: a cage having a chamber having a top wall; a radiator mounted on the top wall of the chamber; an elastic clip fixing the radiator on the top wall of the chamber and having a first side and a second side opposite to the first side in a lateral direction of the chamber; a first latch on the cage and having a slot; a second latch on the cage and having a slot; a first hook on the first side of the elastic clip engaged into the slot of the first latch from an outer side of the first latch; and a second hook on the second side of the elastic clip engaged into the slot of the second latch from an inner side of the second latch far away from the first latch and facing the first latch.

An adapter block assembly includes an adapter block, a circuit board arrangement, and a cover attached to the adapter block so that the circuit board arrangement is held to the adapter block by the cover. Contact assemblies can be disposed between the adapter block and the circuit board arrangement. The cover can be latched, heat staked, or otherwise secured to the adapter block. Each component of the adapter block assembly can include one or more parts (e.g., multiple adapter blocks, multiple circuit boards, and/or multiple cover pieces).

The technology relates to a cage configured to removably receive a module. The cage may include a frame comprising a plurality of panels joined to one another, a lever pivotably coupled to the frame, and a heatsink pivotably coupled to the lever. The panels together may extend around a longitudinal recess configured to receive the module therein. The longitudinal recess may define a longitudinal axis thereof. A first one of the panels may have an aperture defined therein in communication with the longitudinal recess. A first end of the lever may extend into the longitudinal recess. The heatsink may be pivotably coupled to a second end of the lever opposite the first end. The heatsink may be movable in a translation direction transverse to the longitudinal axis. The heatsink may be translatable between a first position outside of the longitudinal recess and a second position partially inside the longitudinal recess.

A photoelectric conversion connector comprising a support, a photoelectric conversion element that is provided on said support and that can be connected to an optical fiber through an optical signal, a first resin member that is formed at the upper part of the photoelectric conversion element, and a second resin member that is formed at the upper part of the first resin member. An optical signal transmitted between the photoelectric conversion element and the optical fiber goes through both the first resin member and the second resin member.

Pluggable optical transceiver modules are described herein that are specifically configured to preclude use of fiber jumpers inside of the module. Pluggable optical transceiver modules implement a rigid-plane jumper that provides an opto-mechanical interface between an external fiber cable (attached to the pluggable optical transceiver module) and the optical transceiver in a manner that does not require the fiber jumper, while ensuring reduced optical loss. In some embodiments one or more rigid waveguide plates act as an opto-mechanical coupling between the external fiber cable and on-board opto-electrical components (e.g., optical transceiver). For example, the rigid waveguide plates are coupled to a faceplate connector, and a CWDM block that is in turn optically coupled to the optical socket. In some embodiments, the CWDM block is directly attached to the rigid waveguide plates. In some embodiments, the CWDM block is indirectly attached to the rigid waveguide plates using a half periscope.

An optical transceiver performing the full-duplex transmission in a plural channel is disclosed. The optical transceiver provides an optical receptacle, a semiconductor optical device, an inner fiber that optically couples the optical receptacle with the semiconductor optical device, and a fiber tray that secures an extra length of the inner fiber. The fiber tray provides an inner wall inclined toward a direction perpendicular to a direction along which the inner fiber warps. The inner fiber is set within the space as touching the inclined inner wall and sliding thereon toward the inclined direction.

An optical transmission apparatus includes a substrate and a heatsink. The substrate is a substrate on which multiple light sources and a heat generating part are mounted. The heatsink includes a base portion, a fin portion, and multiple light guiding paths. The base portion is arranged on a surface of the heat generating part on an opposite side to the substrate. The fin portion rises up from a surface of the base portion on an opposite side to the heat generating part. The multiple light guiding paths are formed inside the base portion, and guide lights emitted by the multiple light sources to multiple output destinations corresponding to the multiple light sources.

Embodiments disclosed herein include photonics packages and systems. In an embodiment, a photonics package comprises a package substrate, where the package substrate comprises a cutout along an edge of the package substrate. In an embodiment, a photonics die is coupled to the package substrate, and the photonics die is positioned adjacent to the cutout. In an embodiment, the photonics package further comprises a receptacle for receiving a pluggable optical connector. In an embodiment, the receptacle is over the cutout.