The present disclosure relates to an easy-to-unlock optical module. The easy-to-unlock optical module includes an optical module body and a mechanism of a pull ring for unlocking or locking connection between the optical module body and a metal cage. The mechanism of the pull ring includes a cover plate and the pull ring arranged on the optical module body. A pivot part for pivotally connecting the optical module body, and a first rotating arm and a second rotating arm respectively located on front and rear sides of the pivot part are arranged on the cover plate, and a lock head protrusion for matching with a spring lock groove on the metal cage is formed in the first rotating arm. The pull ring is pivotally connected to the optical module body, an unlocking contact surface and a locking contact surface are formed in the pull ring.

A plug connector is attachable with an optical fiber cable and is connectable with a receptacle connector. The receptacle connector comprises a receptacle shell. The plug connector comprises a front holder, a cable holding portion, a rear holder and a coupling member. The front holder is made of metal. The front holder is mated with the receptacle shell when the plug connector is connected with the receptacle connector. The cable holding portion is made of metal. The cable holding portion is configured to hold the optical fiber cable. The rear holder guards the cable holding portion. The rear holder comprises, at least in part, a thermal insulating portion made of non-metal material. The coupling member couples the front holder and the rear holder with each other. Each of the coupling member and the front holder is in contact with the rear holder only on the thermal insulating portion.

A connector assembly includes a connector, an optical waveguide and a circuit board having a through-hole and a transmitter/receiver configured to transmit and/or receive light signals. The connector is interlockingly and releasably connected to the circuit board via a fastening element which is passed through the through-hole and connected to the circuit board. The connector has a receiving chamber which at least partially borders the transmitter/receiver. A lens unit is disposed in the receiving chamber and light-conductively connects the transmitter/receiver to the optical waveguide. A locking element is movably disposed on the connector. The locking element is disposed at least partially within the receiving chamber and secures the lens unit in the receiving chamber. The locking element is movable into a final latched position in which the locking element extends at least partially into the through-hole and blocks release of the fastening element from the circuit board.

An electronic component such as a fan-less component for a 5G system having an expansion card and optical transceivers is disclosed. The electronic component has a chassis heat sink having a contact surface and a printed circuit board. A transceiver cage is located on the printed circuit board. The cage receives the optical transceiver. The transceiver cage is in thermal contact with the optical transceiver. The system includes a bracket having a heat sink support with a flat surface in thermal contact with the contact surface of the chassis heat sink. The bracket has a transceiver support having a flat surface in thermal contact with the optical transceiver and supporting the expansion card. A connector support is coupled to the heat sink support and the transceiver support. Heat from the optical transceiver is transmitted through the transceiver, connector, and the heat sink supports to the chassis heat sink.

An optical module includes: a quantum photonic integrated circuit; a temperature controller; and a housing configured to house the photonic integrated circuit and the temperature controller. The photonic integrated circuit is attached to the temperature controller, such that the photonic integrated circuit is in thermal communication with the temperature controller, and the temperature controller is attached directly to the housing, such that the temperature controller is in direct thermal communication with the housing.

A universal sub slot module includes a Printed Circuit Board (PCB) including circuitry for power, a data plane, and a control plane; a faceplate connected to one end of the PCB and connectors connected to another end of the PCB, wherein the connectors are configured to connect to corresponding connectors in a host module; and a form factor containing the PCB and configured to interface a sub slot in the host module configured to operate in a chassis-based or rack mounted unit network element. The host module can include a plurality of sub slots, each being a port having one of the universal sub slot module and a filler module. The data plane can be configured to implement one of Optical Transport Network (OTN), Beyond 100G, Flexible Optical (FlexO), Ethernet, and Flexible Ethernet (FlexE).

An optical transceiver includes a groove-shaped accommodating portion that extends in a longitudinal direction, the housing being configured to be inserted and removed from a cage of an external device. The optical transceiver includes a movable member attached to the housing and a leaf spring member accommodated in the accommodating portion. The spring member includes a first pressing portion pressing a protrusion toward a first surface of the accommodating portion. The spring member includes and a second pressing portion pressing, in the longitudinal direction, a second surface of the accommodating portion. An end of the spring member toward the first pressing portion is configured to curve away from the first surface of the accommodating portion in the longitudinal direction as a distance from first pressing portion increases.

An adapter block assembly includes an adapter block, a circuit board arrangement, and a cover attached to the adapter block so that the circuit board arrangement is held to the adapter block by the cover. Contact assemblies can be disposed between the adapter block and the circuit board arrangement. The cover can be latched, heat staked, or otherwise secured to the adapter block. Each component of the adapter block assembly can include one or more parts (e.g., multiple adapter blocks, multiple circuit boards, and/or multiple cover pieces).

A system includes a housing that has a front panel; a substrate that is positioned at a distance from the front panel, in which a data processor is mounted on the substrate; and a pluggable module. The pluggable module includes a co-packaged optical module, at least one first optical connector, a first fiber optic cable that is optically coupled between the co-packaged optical module and the first optical connector, and a fiber guide that is positioned between the co-packaged optical module and the first optical connector and provides mechanical support for the co-packaged optical module and the first optical connector. The co-packaged optical module is configured to receive optical signals from the first optical connector, generate electrical signals based on the received optical signals, and transmit the electrical signals to the data processor. The pluggable module has a shape that enables the pluggable module to pass through an opening in the front panel to enable the co-packaged optical module to be coupled to the substrate.

In one embodiment, an apparatus includes an optical module, and a heat sink for attachment to an optical module cage configured for receiving the optical module, the heat sink having a surface in which recesses are formed. The optical module includes a thermal interface material attached to a surface of the optical module for thermal contact with the heat sink, and lifting elements extending from the surface. The lifting elements are configured to create a gap between the thermal interface material and the heat sink during insertion of the optical module into the optical module cage or removal of the optical module from the optical module cage, and are positioned for insertion into aligned recesses in the heat sink when the optical module is fully inserted into the optical module cage to eliminate the gap and provide contact between the heat sink and the thermal interface material.